Abstract:
An electronic device is provided. The electronic device includes a housing, a touch display, a pressure sensing circuit, a fingerprint sensor, a processor, and a memory. The memory is configured to store fingerprint data associated with a plurality of reference fingerprints. The processor is configured to, when pressure is applied by the finger in the fingerprint sensing area, receive first data associated with the pressure from the pressure sensing circuit and receive second data associated with the fingerprint of the finger from the fingerprint sensor, identify a selected function corresponding to the second data based on comparing result of the second data and the reference fingerprint data, and execute the selected function.
Abstract:
An electronic device and method of operating an electronic device is provided. The electronic device a display in which a fingerprint recognition area is formed in at least one portion thereof; a fingerprint sensor disposed under the display on which a screen is displayed, wherein the fingerprint sensor is adapted to acquire image information related to authentication of a fingerprint corresponding to an object that approaches a fingerprint recognition area at least partially based on light radiated from at least one pixel of the display and reflected by the object; and a processor adapted to control at least one function of the fingerprint sensor in association with the operation of acquiring the image information.
Abstract:
An electronic device is provided which includes a light emitting module that radiates infrared light, a window disposed on the light emitting module and having a specific refractive index with respect to the infrared light, wherein the window includes a refraction part that totally reflects the infrared light inside the window in correspondence with the specific refractive index, and a fingerprint sensor disposed under the window and obtaining a fingerprint of a user based on a user input on the window by using scattered light of the infrared light.
Abstract:
An electronic device is provided. The electronic device includes a transparent member, a display positioned under a transparent member that includes a plurality of pixels, an image sensor positioned under some areas of the display, a memory, and a processor. The processor obtains a first image at least based on light output through at least some of the plurality of pixels and reflected by an external object coming into contact with the transparent member using the image sensor, performs authentication on the external object at least based on the at least one template using the first image, generates a second image of the external object at least based on the first image when quality of the first image corresponds to a given condition based on a result of the authentication, and performs authentication on the external object at least based on the at least one template using the second image.
Abstract:
An electronic device includes a display including at least one pixel and at least a partial area of which is transparent. The electronic device also has a fingerprint sensor disposed in an area under the display, on which a screen is displayed, to collect light, a direction of which is changed by an object approaching the display and acquire image information related to fingerprint authentication. In addition, the electronic device has a processor adapted to acquire image information of the fingerprint sensor.
Abstract:
A semiconductor assembly with a package on package (POP) structure includes a first semiconductor package (100) having a first lower substrate (110), a first upper substrate (120) facing the first lower substrate, and a first semiconductor chip (130) mounted on an area of the first lower substrate. The POP structure further includes a second semiconductor package (200) having a second lower substrate (210) stacked on the first semiconductor package and spaced apart from the first semiconductor package, and a second semiconductor chip (220) mounted in an area of the second lower substrate. At least one passive element (301) is disposed in at least one of the first semiconductor package and the second semiconductor package and electrically connected to the second semiconductor chip.