Abstract:
A chip film package which can achieve a fine pitch and a display panel assembly having the same are provided. The chip film package includes a base film made of an insulating material, a wire pattern formed on the base film to form a predetermined circuit, and a lead which is formed at one end of the wire pattern to be electrically connected to an external terminal, wherein a width (Wb) of the bottom surface of the lead adjacent to the base film is smaller than a width (Wt) of the top surface of the lead connected to the external terminal.
Abstract:
A signal transfer member for a liquid crystal display (LCD) apparatus includes a power line for receiving power from an external source and for driving a semiconductor chip disposed on the transfer member or the display apparatus. The power line is bent so as to incorporate a serpentine structure, which enables the length of the power line to be easily adjusted and results in the line being longer than a power line formed with a relatively straight structure. Accordingly, the length of the power line can be adjusted to take into account the respective impedances of the chip and the external source so as to suppress electromagnetic waves in the power line. This prevents the creation of noise, distortion of signals, damage to the semiconductor chip, and disconnection of the input interconnection thereof that are caused by the electromagnetic waves, so that product yields are thereby improved.
Abstract:
A signal transfer member for a liquid crystal display (LCD) apparatus includes a power line for receiving power from an external source and for driving a semiconductor chip disposed on the transfer member or the display apparatus. The power line is bent so as to incorporate a serpentine structure, which enables the length of the power line to be easily adjusted and results in the line being longer than a power line formed with a relatively straight structure. Accordingly, the length of the power line can be adjusted to take into account the respective impedances of the chip and the external source so as to suppress electromagnetic waves in the power line. This prevents the creation of noise, distortion of signals, damage to the semiconductor chip, and disconnection of the input interconnection thereof that are caused by the electromagnetic waves, so that product yields are thereby improved.