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公开(公告)号：EP3031566B1
公开(公告)日：2018-06-20
申请号：EP14833782.7
申请日：2014-08-01
发明人： TACHIBANA, Ken , NOMURA, Hikaru , LEE, Kyu-oh
CPC分类号： B23K35/262 , B23K35/264 , B23K2101/38 , B32B15/01 , B32B15/018 , C22C12/00 , C22C13/02 , Y10T403/479
摘要： A lead-free solder alloy consisting essentially of, in mass percent, Bi: 31 - 59%, Sb: 0.15 - 0.75%, Cu: 0.3 - 1.0% and/or P: 0.002 - 0.055%, and a balance of Sn has a low melting point for suppressing warping of a thin substrate during soldering. Even when this solder alloy is used for soldering to electrodes having a Ni coating which contains P, the growth of a P-rich layer is suppressed so that the shear strength of the solder joints is improved. Since this solder alloy has a high ductility and a high tensile strength, the solder joint having high reliability can be formed.
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公开(公告)号：EP3173182A1
公开(公告)日：2017-05-31
申请号：EP16200965.8
申请日：2016-11-28
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02
摘要： To provide a solder alloy capable of suppressing the occurrence of liftoff phenomena, suppressing the deterioration by thermal fatigue, and suppressing the generation of solder bridges and solder icicles in a fillet. The solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1 to 0.8%; Ag: 0 to 0.3%; Cu: 0 to 0.7%; P: 0.001 to 0.1%, with the balance being Sn, and a total amount of Ag and Bi being from 0.3 to 0.8%.
摘要翻译： 提供一种能够抑制剥离现象的产生，抑制因热疲劳导致的劣化，并且抑制焊脚中的焊桥和焊料棒的产生的焊料合金。 该焊料合金具有以质量％计含有Bi：0.1〜0.8％， Ag：0至0.3％; Cu：0至0.7％; P：0.001〜0.1％，余量为Sn，Ag和Bi的合计量为0.3〜0.8％。
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公开(公告)号：EP3715040A1
公开(公告)日：2020-09-30
申请号：EP18908704.2
申请日：2018-12-21
摘要： The present invention provides a solder alloy, a solder paste, a solder ball, a resin flux-cored solder and a solder joint, both of which has the low-melting point to suppress the occurrence of the fusion failure and has excellent mechanical properties, impact resistance and excellent heat-cycle resistance. In order to achieve miniaturization of the alloy organization, the alloy composition is composed of 35 to 68 mass% of Bi, 0.5 to 3.0 mass% of In, 0.01 to 0.10 mass% of Pd, and a balance of Sn. The alloy composition may contain 1.0 to 2.0 mass% of In, contain 0.01 to 0.03 mass% of Pd and contain at least one of Co, Ti, Al and Mn in total amount of 0.1 mass% or less. The solder alloy may be suitably used for a solder paste, a solder ball, a resin flux-cored solder and a solder joint.
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公开(公告)号：EP3173182B1
公开(公告)日：2018-08-15
申请号：EP16200965.8
申请日：2016-11-28
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02
摘要： To provide a solder alloy capable of suppressing the occurrence of liftoff phenomena, suppressing the deterioration by thermal fatigue, and suppressing the generation of solder bridges and solder icicles in a fillet. The solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1 to 0.8%; Ag: 0 to 0.3%; Cu: 0 to 0.7%; P: 0.001 to 0.1%, with the balance being Sn, and a total amount of Ag and Bi being from 0.3 to 0.8%.
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公开(公告)号：EP2886243B1
公开(公告)日：2018-03-14
申请号：EP12879828.7
申请日：2012-06-30
CPC分类号： H01L24/13 , B23K1/0016 , B23K35/0222 , B23K35/0261 , B23K35/26 , B23K35/262 , C22C13/00 , C22C13/02 , H01B1/02 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05073 , H01L2224/05082 , H01L2224/05155 , H01L2224/05164 , H01L2224/05644 , H01L2224/05647 , H01L2224/1301 , H01L2224/13111 , H01L2224/13147 , H01L2924/01015 , H01L2924/01026 , H01L2924/01027 , H01L2924/01028 , H01L2924/01032 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/181 , H01L2924/2076 , H05K3/3457 , H05K2203/041 , H01L2924/00 , H01L2924/01029 , H01L2924/00014
摘要： A solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, which suppresses fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The present invention is a lead-free solder ball for electrodes of BGAs or CSPs consisting of 1.6 - 2.9 mass % of Ag, 0.7 - 0.8 mass % of Cu, 0.05 - 0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and excellent resistance to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment. At least one element selected from Fe, Co, and Pt in a total amount of 0.003 - 0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003 - 0.1 mass % may be added to this composition.
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公开(公告)号：EP3715039A1
公开(公告)日：2020-09-30
申请号：EP20166279.8
申请日：2020-03-27
摘要： A solder alloy has an alloy composition consisting of, in mass%, Ag: from 3.2 to 3.8%, Cu: from 0.6 to 0.8%, Ni: from 0.01 to 0.2%, Sb: from 2 to 5.5%, Bi: from 1.5 to 5.5%, Co: from 0.001 to 0.1%, Ge: from 0.001 to 0.1%, and optionally at least one of Mg, Ti, Cr, Mn, Fe, Ga, Zr, Nb, Pd, Pt, Au, La and Ce: 0.1% or less in total, with the balance being Sn. The alloy composition satisfies the following relationship (1): 2.93 ≤ Ge / Sn + Bi / Ge × Bi / Sn In the relationship (1), each of Sn, Ge, and Bi represents the content (mass%) in the alloy composition.
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公开(公告)号：EP2839920B1
公开(公告)日：2017-11-01
申请号：EP13778363.5
申请日：2013-04-17
IPC分类号： B23K35/26 , B23K1/19 , C22C13/00 , B23K101/38 , B23K103/10 , B23K101/32 , B23K101/00 , B23K1/00 , B23K35/28
CPC分类号： B23K35/262 , B23K1/00 , B23K1/0016 , B23K1/19 , B23K35/282 , B23K2201/00 , B23K2201/32 , B23K2201/38 , B23K2203/10 , C22C13/00 , Y10T403/479
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公开(公告)号：EP3031566A1
公开(公告)日：2016-06-15
申请号：EP14833782.7
申请日：2014-08-01
发明人： TACHIBANA, Ken , NOMURA, Hikaru , LEE, Kyu-oh
CPC分类号： B23K35/262 , B23K35/264 , B23K2201/38 , B32B15/01 , B32B15/018 , C22C12/00 , C22C13/02 , Y10T403/479
摘要： A lead-free solder alloy consisting essentially of, in mass percent, Bi: 31 - 59%, Sb: 0.15 - 0.75%, Cu: 0.3 - 1.0% and/or P: 0.002 - 0.055%, and a balance of Sn has a low melting point for suppressing warping of a thin substrate during soldering. Even when this solder alloy is used for soldering to electrodes having a Ni coating which contains P, the growth of a P-rich layer is suppressed so that the shear strength of the solder joints is improved. Since this solder alloy has a high ductility and a high tensile strength, the solder joint having high reliability can be formed.
摘要翻译： 以质量百分比计，Bi：31-59％，Sb：0.15-0.75％，Cu：0.3-1.0％和/或P：0.002-0.055％和余量的Sn组成的无铅焊料合金具有 低熔点用于抑制焊接期间薄基板的翘曲。 即使当该焊料合金用于焊接具有含P的Ni涂层的电极时，也抑制了富P层的生长，从而改善了焊点的剪切强度。 由于该焊料合金具有高延展性和高拉伸强度，因此可以形成具有高可靠性的焊接接头。
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公开(公告)号：EP2839920A1
公开(公告)日：2015-02-25
申请号：EP13778363.5
申请日：2013-04-17
IPC分类号： B23K35/26 , B23K1/19 , C22C13/00 , B23K101/38 , B23K103/10
CPC分类号： B23K35/262 , B23K1/00 , B23K1/0016 , B23K1/19 , B23K35/282 , B23K2201/00 , B23K2201/32 , B23K2201/38 , B23K2203/10 , C22C13/00 , Y10T403/479
摘要： To provide Sn-Zn series solder alloy that can decrease the amount of occurred dross, suppress discoloration of the fusion solder alloy and re-oxidation, and suppress the erosion phenomenon of Al and Ni even when the fusion solder alloy exposes the air.
In order to suppress diffusion of Al and/or Ni to the solder alloy by forming an oxide film on a surface of the solder bath prior to Zn, a solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn.摘要翻译： 为了提供可以减少发生的渣滓量的Sn-Zn系焊料合金，抑制熔融焊料合金的变色和再次氧化，并且即使当熔融焊料合金露出空气时也抑制Al和Ni的腐蚀现象。 为了通过在Zn之前在焊料槽的表面上形成氧化膜来抑制Al和/或Ni对焊料合金的扩散，焊料合金具有含有3〜25质量％的Zn，0.002的Ti的合金组成 通过0.25质量％的Al，0.002〜0.25质量％的Al和余量的Sn。
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