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公开(公告)号：EP3896114A1
公开(公告)日：2021-10-20
申请号：EP21156605.4
申请日：2021-02-11
发明人： Zubarev, Dmitry , Urano, Hiroyuki , Takemura, Katsuya , Iio, Masashi , Honda, Kazuya , Kawai, Yoshio
摘要： Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1):
wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms ; X 1 to X 3 represent any of -CO 2 -, -CONR X1 -, -O-, -NR X1 -, -S-, -SO 2 -, -SO 3 - and -SO 2 NR X1 - and may be the same as or different from each other, provided that R X1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L 1 and L 2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.-
公开(公告)号：EP3896521A1
公开(公告)日：2021-10-20
申请号：EP21156645.0
申请日：2021-02-11
发明人： Zubarev, Dmitry , Urano, Hiroyuki , Takemura, Katsuya , Iio, Masashi , Honda, Kazuya , Kawai, Yoshio
摘要： Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2):
wherein T 1 and T 2 may be the same as, or different from, each other and represent any of -CO- and -SO 2 -; X 1 is a tetravalent organic group; and 1 is 0 or 1; and X 2 is a divalent organic group.-
3.发明公开SEMICONDUCTOR APPARATUS, STACKED SEMICONDUCTOR APPARATUS, ENCAPSULATED STACKED-SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING THE SAME 审中-公开半导体器件堆叠半导体端设备封装堆叠半导体器件和方法及其生产
公开(公告)号：EP3103835A1
公开(公告)日：2016-12-14
申请号：EP16001295.1
申请日：2016-06-08
发明人： Soga, Kyoko , Asai, Satoshi , Takemura, Katsuya
IPC分类号： C08K5/13 , C08L63/00 , C08L83/04 , C08L83/10 , H01L23/498 , H01L21/56 , H01L23/538 , C08G59/32 , C08G59/62
CPC分类号： H01L23/296 , C08G59/3281 , C08G59/621 , C08G77/52 , C08G77/60 , C08K5/13 , C08L63/00 , C09D183/14 , C09D183/16 , G03F7/0757 , G03F7/20 , G03F7/40 , H01L21/4853 , H01L21/565 , H01L21/568 , H01L23/49816 , H01L23/49827 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/06182 , H01L2224/12105 , H01L2224/16145 , H01L2225/06513 , H01L2225/06548 , H01L2225/06565 , H01L2225/06582 , H01L2924/18162 , C08L83/10
摘要： The present invention is a semiconductor apparatus including a semiconductor device, an on-semiconductor-device metal pad and a metal interconnect each electrically connected to the semiconductor device, a through electrode and a solder bump each electrically connected to the metal interconnect, a first photosensitive insulating layer formed on the semiconductor device, and a second photosensitive insulating layer formed on the first photosensitive insulating layer, in which the first and second photosensitive insulating layers are composed of a photocurable resin composition containing a silicone polymer compound having an epoxy group-containing repeating unit shown by formula (1) and a phenolic hydroxyl group-containing repeating unit shown by formula (2), a photosensitive acid generator, a solvent, and crosslinking agents. There can be provided a semiconductor apparatus that can be easily placed on a circuit board and stacked by forming a fine electrode on the semiconductor device and providing a through electrode outside the semiconductor device.
摘要翻译： 本发明是一种半导体装置，导通半导体器件的金属焊盘和金属互连的每个电连接到所述半导体器件中，通过电极和焊料凸块的每个电连接到所述金属互连，第一感光的半导体装置 含基的重复形成在半导体装置上的绝缘层，以及形成在第一感光绝缘层上的第二感光绝缘层，其中，所述第一和第二感光绝缘层由具有在环氧树脂光固化性树脂组合物含有有机硅聚合物的化合物的 由式（1）所示单元和酚羟基的基团的重复式（2），一光敏酸发生器，溶剂示出单元，和交联剂。 还有可以提供一种半导体装置，确实可以很容易地放置在电路板上，并通过层叠形成半导体器件的微细电极和贯通电极的半导体装置的外部提供。
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4.发明公开POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM AND METHOD FOR PRODUCING SAME, LAYERED PRODUCT, PATTERNING PROCESS, AND SUBSTRATE 有权正感光树脂组合物，光固化干膜及其制备方法体，分层结构产品的方法及基板
公开(公告)号：EP2957955A1
公开(公告)日：2015-12-23
申请号：EP15001757.2
申请日：2015-06-15
CPC分类号： G03F7/039 , G03F7/022 , G03F7/0226 , G03F7/0236 , G03F7/0757 , G03F7/09 , G03F7/11 , G03F7/16 , G03F7/20 , G03F7/30 , G03F7/32 , G03F7/40
摘要： The present invention provides a positive photosensitive resin composition containing (A) a polymer compound obtained in the presence of an acid catalyst by condensation of at least a siloxane compound shown by formula (1), a phenol compound(s) shown by formula (2) and/or formula (3), and aldehydes and ketones shown by formula (4), (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinker, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination generated on a metal wiring, an electrode, and a substrate such as Cu and Al, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when the widely used 2.38% TMAH aqueous solution is used as a developer.
摘要翻译： 本发明提供一种含有一个正型感光性树脂组合物（A）中由式所示的存在下用酸催化剂的至少一个硅氧烷化合物的缩合得到的（1），酚化合物（S）由式表示（2高分子化合物 ）和/或式（3），和由式所示的醛和酮（4），（B）能够通过光在酸产生和在碱性水溶液中增加的溶解速率的感光材料，（C）交联剂， 和（D）溶剂。 还有可以提供一种正型感光性树脂组合物做了可以弥补上的金属布线向电极产生剥离的麻烦，以及底物：诸如Cu和Al，爱尤其是在底物：例如SiN，并且可以形成具有精细图案 正锥形状，但不产生浮渣和在图案底部和衬底当广泛应用于2底脚轮廓：38％TMAHwässrige溶液用作显影剂。
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5.发明公开Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film 有权一种化学放大型，负型抗蚀剂组合物，可光固化干膜制造方法中，图案形成方法以及用于电气/电子部件的保护膜
公开(公告)号：EP2602661A1
公开(公告)日：2013-06-12
申请号：EP12196245.0
申请日：2012-12-10
CPC分类号： G03F7/0757 , G03F7/038 , G03F7/0382 , G03F7/085 , G03F7/161 , G03F7/2002 , G03F7/40
摘要： A chemically amplified negative resist composition is provided comprising (A) a resin having a crosslinking group, (B) a crosslinker, (C) a photoacid generator capable of generating an acid upon exposure to light of wavelength 190-500 nm, (D) a solvent, and (E) an isocyanuric acid. The resist composition overcomes the stripping problem that the film is stripped from metal wirings of Cu or Al, electrodes, and SiN substrates.
摘要翻译： 化学放大负性抗蚀剂组合物提供了包含（A）具有交联基团的树脂，（B）一种交联剂，（C），能够在曝光时产生酸的波长190-500纳米的光的光酸产生剂，（D） 溶剂中，和（e），以异氰脲酸。 在抗蚀剂组合物来汽提问题的根本所述膜由Cu或Al，电极的金属布线，以及氮化硅基板剥离。
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6.发明公开Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film 审中-公开一种化学放大型，负型抗蚀剂组合物，可光固化干膜制造方法中，图案形成方法以及用于电气/电子部件的保护膜
公开(公告)号：EP2602660A1
公开(公告)日：2013-06-12
申请号：EP12196251.8
申请日：2012-12-10
CPC分类号： G03C1/805 , B32B3/266 , G03C2001/7635 , G03F7/0045 , G03F7/0046 , G03F7/038 , G03F7/0382 , G03F7/0757 , G03F7/11 , G03F7/20 , G03F7/38 , G03F7/40 , Y10T428/24331 , Y10T428/24612
摘要： A chemically amplified negative resist composition is provided comprising (A) a resin having a crosslinking group, (B) a crosslinker, (C) a photoacid generator capable of generating an acid upon exposure to light of wavelength 190-500 nm, (D) a solvent, and (E) a fluoroalkyl-containing amine compound. The resist composition can form a fine pattern, specifically a fine hole or space pattern which has a positive taper (or forward taper) profile in which the size of top is greater than the size of bottom or improves the overhang profile with extremely projected top.
摘要翻译： 化学放大负性抗蚀剂组合物提供了包含（A）具有交联基团的树脂，（B）一种交联剂，（C），能够在曝光时产生酸的波长190-500纳米的光的光酸产生剂，（D） 溶剂中，和（e）的含氟烷基胺化合物。 抗蚀剂组合物可以形成微细图案，特别是细孔或具有正锥形（或正锥形）分布，其中的顶部的尺寸小于底部的尺寸大于或改善具有非常突出顶部悬垂轮廓空间图案。
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公开(公告)号：EP0701171A1
公开(公告)日：1996-03-13
申请号：EP94113965.1
申请日：1994-09-06
发明人： Takemura, Katsuya , Ishihara, Toshinobu , Maruyama, Kazumasa , Takeda, Yoshihumi , Shigemitsu, Minoru , Itoh, Ken'ichi
CPC分类号： G03F7/0045 , G03F7/039
摘要： A resist composition comprising an alkali-soluble resin, typically a partially t-butoxycarbonylated polyhydroxystyrene, a p-butoxystyrene/t-butylacrylate copolymer or p-butoxystyrene/maleic anhydride copolymer as a dissolution inhibitor, and a iodonium or sulfonium salt as a photoacid generator is effective for forming a resist film which can be precisely and finely patterned using high energy radiation such as a KrF excimer laser.
摘要翻译： 抗蚀剂组合物，其包含碱溶性树脂，通常为部分叔丁氧基羰基化的聚羟基苯乙烯，作为溶解抑制剂的对丁氧基苯乙烯/叔丁基丙烯酸酯共聚物或对丁氧基苯乙烯/马来酸酐共聚物，以及作为光酸产生剂的碘鎓盐或锍盐 对于形成可以使用诸如KrF准分子激光器的高能辐射精确和精细地图案化的抗蚀剂膜是有效的。
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公开(公告)号：EP4063954A3
公开(公告)日：2022-10-19
申请号：EP22159695.0
申请日：2022-03-02
摘要： The present invention is a positive photosensitive resin composition including : (A) an alkali-soluble resin containing at least one structure selected from a polyimide structure, a polyamide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a polymer compound having a structural unit formed by cyclopolymerization; and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution. An object of the present invention is to provide a positive photosensitive resin composition and a positive photosensitive dry film that are soluble in an alkaline aqueous solution, that can achieve high resolution without damaging excellent features such as the mechanical characteristics of a protective film, adhesiveness, etc., and that have excellent mechanical characteristics and adhesiveness to a substrate even when cured at low temperatures.
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公开(公告)号：EP3951499A1
公开(公告)日：2022-02-09
申请号：EP21188838.3
申请日：2021-07-30
摘要： The present invention is a negative photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); (C) a compound that generates an acid by light; and (D) a heat crosslinking agent. An object of the present invention is to provide a negative photosensitive resin composition that enables formation of a fine pattern with high rectangularity and high resolution, has excellent mechanical characteristics even when cured at low temperatures, and furthermore, has no degradation in adhesive force between before and after a high temperature and high humidity test.
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公开(公告)号：EP3604390A1
公开(公告)日：2020-02-05
申请号：EP19188162.2
申请日：2019-07-24
摘要： The present invention is a polymer having a polyamide structural unit, a polyamide-imide structural unit, or a polyimide structural unit, selected from a polyamide, a polyamide-imide, a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor, including a reaction product of a diamine containing at least one of a diamine shown by the following general formula (1) and a diamine shown by the following general formula (2), together with at least one of a tetracarboxylic dianhydride shown by the following general formula (3) as well as a dicarboxylic acid and a dicarboxylic halide shown by the following general formula (4). This provides a polymer which is soluble in a safe organic solvent used widely, and is usable as a base resin of a positive photosensitive resin composition that is soluble in an aqueous alkaline solution and capable of forming a fine pattern to give higher resolution.
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