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公开(公告)号：EP1555111A4
公开(公告)日：2010-09-08
申请号：EP03794141
申请日：2003-08-29
申请人： TERUMO CORP
发明人： SANO HIROAKI , NAGASHIMADA MASARU , ISHIDA SHINJI , YAMANUSHI SATOSHI , FUJIHARA HIDEYA , SUMIYA OSAMU
CPC分类号： B29C66/7373 , A61M39/146 , B29C65/2046 , B29C65/2076 , B29C65/30 , B29C65/7802 , B29C65/7841 , B29C66/1142 , B29C66/5221 , B29C66/71 , B29C66/818 , B29C66/857 , B29L2023/007 , Y10T156/1322 , Y10T156/17 , Y10T156/1702 , Y10T156/1744 , B29K2027/06
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公开(公告)号：EP1547755A4
公开(公告)日：2010-09-08
申请号：EP03791415
申请日：2003-08-29
申请人： TERUMO CORP
发明人： SANO HIROAKI , NAGASHIMADA MASARU , ISHIDA SHINJI , YAMANUSHI SATOSHI , FUJIHARA HIDEYA , SUMIYA OSAMU
CPC分类号： B29C66/7373 , A61M39/146 , A61M39/18 , B29C65/2046 , B29C65/2061 , B29C65/7802 , B29C65/7841 , B29C66/02241 , B29C66/1142 , B29C66/5221 , B29C66/71 , B29C66/8161 , B29C66/8167 , B29C66/818 , B29C66/857 , B29C66/91213 , B29C66/91231 , B29C66/91421 , B29C66/91431 , B29C66/91651 , B29C66/961 , B29L2023/007 , Y10T29/49893 , Y10T29/49902 , Y10T29/5199 , Y10T29/53048 , Y10T29/53987 , B29K2027/06
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公开(公告)号：EP1579983A4
公开(公告)日：2006-11-08
申请号：EP03809847
申请日：2003-09-17
申请人： TERUMO CORP
发明人： SANO HIROAKI , NAGASHIMADA MASARU , ISHIDA SHINJI
IPC分类号： A61M1/28 , B29C65/74 , G01R29/08 , A61M1/14 , A61M39/14 , B29C65/00 , B29C65/02 , B29C65/20 , B29L23/00 , G06F17/50
CPC分类号： B29C65/2084 , A61M39/146 , B29C65/2046 , B29C65/2076 , B29C65/7802 , B29C65/7841 , B29C66/0018 , B29C66/1142 , B29C66/5221 , B29C66/81417 , B29C66/81427 , B29C66/81431 , B29C66/818 , B29C66/857 , B29C66/87441 , B29C66/8748 , B29C66/91213 , B29C66/91231 , B29C66/91313 , B29C66/91315 , B29C66/91317 , B29C66/91421 , B29C66/91431 , B29C66/91631 , B29C66/91651 , B29C66/919 , B29C66/91951 , B29C66/9592 , B29C66/961 , B29L2023/007
摘要： A tube bonder capable of performing temperature control of a wafer stably and accurately even when a tube is bonded continuously. The tube bonder (1) comprises a heater (70) for heating a wafer holding section (5a), a thermistor (71) detecting the temperature at the wafer holding section (5a), a means (69) performing heating control of the heater (70) based on the output from the thermistor (71), and a means (68) for performing heating control of the wafer (6) through constant power control. Before heating control of the wafer (6) is started by the wafer heating control means (68), heating control of the heater (70) is performed by the heating control means (69) of the heater and the temperature at the wafer holding section (5a) is controlled to a constant level (about 65˚C).
摘要翻译： 即使在管子连续粘合时也能够稳定且精确地对晶片进行温度控制的管子粘合机。 管接合器（1）包括用于加热晶片保持部分（5a）的加热器（70），检测晶片保持部分（5a）处的温度的热敏电阻器（71），执行加热器加热控制的装置（69） （70），以及通过恒定功率控制对晶片（6）进行加热控制的装置（68）。 在由晶片加热控制装置（68）开始晶片（6）的加热控制之前，加热器（70）的加热控制由加热器的加热控制装置（69）和晶片保持部分 （5a）控制在恒定水平（约65℃）。
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公开(公告)号：EP1652653A4
公开(公告)日：2009-03-11
申请号：EP04746807
申请日：2004-07-01
申请人： TERUMO CORP
IPC分类号： A61M5/14 , B29C65/20 , A61M1/14 , A61M1/28 , A61M39/02 , A61M39/14 , B29C65/00 , B29L22/00 , B29L23/00
CPC分类号： B29C65/203 , A61M39/146 , B29C65/2046 , B29C65/2076 , B29C65/7802 , B29C65/7841 , B29C66/1142 , B29C66/5221 , B29C66/71 , B29C66/7373 , B29C66/8167 , B29C66/818 , B29C66/857 , B29C66/872 , B29C66/876 , B29C66/91213 , B29C66/91231 , B29C66/91421 , B29C66/91431 , B29C66/91651 , B29C66/919 , B29C66/942 , B29C66/96 , B29C66/961 , B29L2031/7148 , Y10T156/1054 , Y10T156/12 , Y10T156/1313 , Y10T156/1326 , B29K2027/06
摘要： A safety-conscious tube joining device capable of self-restoring without damaging the device even when a power supply is cut off during a tube joining operation. The tube joining device is provided with an EEPROM storing information about a tube joining condition, and restoring is effected if a power supply cut-off during tube joining is judged from information about a tube joining condition stored in the EEPROM and from the detection result of a wafer (41) by a wafer position detection sensor (421) when a power supply is turned on. Although the restoring involves reheating the wafer to melt a tube fixed to the wafer (S614, 616), resuming the operation and completing the joining operation (S620-632), an error is displayed on an LCD display to guarantee a joining strength or the like (S634). Safety is ensured by keeping a cooling time locked (S628-632) after wafer heating is stopped.
摘要翻译： 一种管连接装置，其可以进行自复位操作而不损坏设备，并且考虑操作者的安全性。 管连接装置具有关于管的连接处理状态的EEPROM存储信息。 当输入电力时，设备根据存储在EEPROM中的信息相对于管的连接处理状态和根据晶片位置检测的晶片41的检测结果来判断在管连接操作期间电源是否被切断 传感器421，并进行复位操作。 在复位操作中，通过再次加热晶片来熔化附着在晶片上的管（S614,616），装置重启并完成连接操作（S620至632）。 错误指示显示在LCD显示屏上，以确保连接强度等（S634）。 在停止加热晶片以确保安全性之后的冷却时间期间，锁定状态不被取消（S628至S632）。
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