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1.发明公开Cassette conveyance method and cassette conveyance apparatus 审中-公开Kassettentransportverfahren und Kassettentransportvorrichtung
公开(公告)号：EP1855314A1
公开(公告)日：2007-11-14
申请号：EP07107488.4
申请日：2007-05-04
发明人： Kawashima, Isamu , Sato, Hideshi , Kino, Hideo , Ametani, Minoru
IPC分类号： H01L21/677 , B65G49/07
CPC分类号： H01L21/67769
摘要： A cassette conveyance apparatus (10) includes: a first conveyance means (20) for conveying a first cassette (40) in a horizontal and vertical direction; and a second conveyance means (30) for conveying a second cassette (50) in a horizontal and vertical direction . In the cassette conveyance apparatus (10), the first and second cassettes are circulated between a predetermined wafer accommodation position (P1), at which a wafer (2) is accommodated in the cassette, and a predetermined cassette replacement position (P0) at which a cassette accommodating a plurality of wafers is replaced with an empty cassette. Due to the foregoing, the wafers are continuously accommodated in the cassette without stopping an operation of a pretreatment step.
摘要翻译： 盒输送装置（10）包括：用于在水平和垂直方向上输送第一盒（40）的第一输送装置（20） 以及用于在水平和垂直方向上输送第二盒（50）的第二传送装置（30）。 在盒输送装置（10）中，第一和第二盒在预定的晶片容纳位置（P1）和晶片（2）容纳在盒中的预定的晶片容纳位置（P1）和预定的盒更换位置（P0）之间循环， 容纳多个晶片的盒被空盒替换。 由于上述原因，晶片被连续地容纳在盒中，而不停止预处理步骤的操作。
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2.发明公开Wafer backside processing method and corresponding processing apparatus 审中-公开Verfahren zur Behandlung derRückseiteeines Wafers und entsprechende Behandlungsvorrichtung
公开(公告)号：EP1538663A3
公开(公告)日：2006-05-24
申请号：EP04027591.9
申请日：2004-11-19
发明人： Kawashima, Isamu
IPC分类号： H01L21/3065 , H01L21/304 , H01L21/316 , H01L21/00 , B24B7/22
CPC分类号： H01L21/0209 , H01L21/31662
摘要： There are provided a wafer processing method comprising the steps of grinding an underside (21) of a wafer which is provided, on its front surface (29), with a plurality of semiconductor devices (10); polishing a ground surface (22) formed by the grinding operation; and carrying out a plasma-processing for a polished surface (23) formed by the polishing operation under a predetermined gaseous atmosphere in a plasma chamber, to form an oxide layer on the polished surface, and a wafer processing method comprising the steps of carrying out a first plasma-processing for a polished surface formed by the polishing operation under a first gaseous atmosphere (CF 4 or SF 6 ) in a plasma chamber, to clean the polished surface; and carrying out a second plasma-processing for the polished surface after the cleaning operation under a second gaseous atmosphere (O 2 ) in the plasma chamber, to form an oxide layer on the polished surface, and a wafer processing apparatus for carrying out these methods. Thus, the wafer can be processed while the occurrence of an electrical failure in a thin wafer is restricted.
摘要翻译： 提供了一种晶片处理方法，包括以下步骤：研磨在其前表面（29）上设置有多个半导体器件（10）的晶片的下侧（21）; 研磨通过研磨操作形成的地面（22）; 并对在等离子体室中的预定气氛下的抛光操作形成的抛光表面（23）进行等离子体处理，以在抛光表面上形成氧化物层，以及晶片处理方法，包括以下步骤： 在等离子体室中的第一气态气氛（CF 4或SF 6）下通过研磨操作形成的抛光表面的第一等离子体处理，以清洁抛光表面; 以及在等离子体室中的第二气态气氛（O 2）下在清洗操作之后对抛光表面进行第二等离子体处理，以在抛光表面上形成氧化物层，以及用于执行这些方法的晶片处理装置 。 因此，可以在薄晶片中发生电气故障的同时对晶片进行处理。
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公开(公告)号：EP1859917A3
公开(公告)日：2008-05-28
申请号：EP07108403.2
申请日：2007-05-17
发明人： Kawashima, Isamu , Sato, Hideshi , Kino, Hideo , Ametani, Minoru
IPC分类号： B29C63/02
CPC分类号： B29C63/02 , B29C63/0004 , B29L2031/3425 , B65H37/002 , Y10T156/10 , Y10T156/1705 , Y10T156/1712 , Y10T156/1734
摘要： A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3) ; a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.
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4.发明公开Wafer backside processing method and corresponding processing apparatus 审中-公开一种用于晶片的背面的治疗和相应的处理装置处理
公开(公告)号：EP1538663A2
公开(公告)日：2005-06-08
申请号：EP04027591.9
申请日：2004-11-19
发明人： Kawashima, Isamu
IPC分类号： H01L21/3065 , H01L21/304 , H01L21/316 , H01L21/00 , B24B7/22
CPC分类号： H01L21/0209 , H01L21/31662
摘要： There are provided a wafer processing method comprising the steps of grinding an underside (21) of a wafer which is provided, on its front surface (29), with a plurality of semiconductor devices (10); polishing a ground surface (22) formed by the grinding operation; and carrying out a plasma-processing for a polished surface (23) formed by the polishing operation under a predetermined gaseous atmosphere in a plasma chamber, to form an oxide layer on the polished surface, and a wafer processing method comprising the steps of carrying out a first plasma-processing for a polished surface formed by the polishing operation under a first gaseous atmosphere (CF 4 or SF 6 ) in a plasma chamber, to clean the polished surface; and carrying out a second plasma-processing for the polished surface after the cleaning operation under a second gaseous atmosphere (O 2 ) in the plasma chamber, to form an oxide layer on the polished surface, and a wafer processing apparatus for carrying out these methods. Thus, the wafer can be processed while the occurrence of an electrical failure in a thin wafer is restricted.
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5.发明公开Device for calculating the quantity of light and method thereof 有权Verfahren und Vorrichtung zum Berechnen einer Lichtmenge
公开(公告)号：EP1498935A1
公开(公告)日：2005-01-19
申请号：EP04254154.0
申请日：2004-07-12
发明人： Kawashima, Isamu
CPC分类号： H01L21/67253 , G01J1/429 , G01J1/48 , H01L21/67092 , H01L21/67132
摘要： A method of calculating a quantity of light by measuring, by using an adhering force measuring unit (71), the adhering force of an ultraviolet light-curable tape (11 or 21) relying upon the quantity of ultraviolet light with which the ultraviolet light-curable tape is irradiated from an ultraviolet light irradiation unit (61), and calculating, by using a calculation unit, the quantity of ultraviolet light corresponding to a predetermined adhering force, from the measured adhering force of the ultraviolet light-curable tape, and a device therefor. The predetermined adhering force may have been stored in advance in the storage unit or the predetermined adhering force may be determined in advance relying upon at least either one of the kind of the ultraviolet light-curable tape or the elapsed time of the ultraviolet light-curable tape. Then, the quantity of light necessary for the ultraviolet light-curable tape that is used is automatically calculated to avoid a problem caused by an insufficient quantity of light or an excess quantity of light.
摘要翻译： 一种通过使用粘附力测量单元（71）测量紫外光固化带（11或21）的粘附力的方法来计算光量，所述紫外光固化带依赖于紫外光的量， 从紫外线照射单元（61）照射固化胶带，并且通过使用计算单元，根据所测量的紫外光固化胶带的粘附力，计算与预定粘合力相对应的紫外光量，以及 设备。 可以预先将预定的附着力存储在存储单元中，或者可以预先根据紫外线固化胶带的种类或紫外光固化胶带的经过时间来预先确定预定粘合力 胶带。 然后，自动计算所使用的紫外光固化带所需的光量，以避免由于光量不足或过多的光量引起的问题。
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6.发明公开Surface protection film peeling method and surface protection film peeling device 审中-公开一种用于剥离的表面保护膜的方法，以及装置，用于提取的表面保护膜
公开(公告)号：EP1858060A1
公开(公告)日：2007-11-21
申请号：EP07108402.4
申请日：2007-05-17
发明人： Kawashima, Isamu , Sato, Hideshi , Kino, Hideo , Ametani, Minoru
CPC分类号： H01L21/67132 , B29C63/0013 , Y10T156/1168 , Y10T156/1978
摘要： A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.
摘要翻译： 用于剥离附着于哪个的背表面上的晶片（20）的前表面上的膜（11）一种薄膜剥离装置的切割带（3）附着，将晶片用的安装架（36）集成到 一个主体，包括：一可移动台（31），它可以水平地移动到支撑晶片和所述安装框架而表面保护膜被朝向上方; 一个被安装框架，在晶片中的一个（28）在晶片之间露出覆盖装置（80）用于覆盖所述切割带的粘合面（3a）的端部，所有; 以及用于在晶片的端部粘附剥离带（4）膜中的粘合装置（46）。 将膜从晶片的前表面通过从晶片的另一端（29）移动所述可动台到一个端部的剥离胶带附着后剥离。 由于上述原因，而将剥离用带被粘附到切割胶带阻止，该膜可以从在一个较短的时间周期在晶片的前表面剥离。
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公开(公告)号：EP1232835B1
公开(公告)日：2007-04-18
申请号：EP02002773.6
申请日：2002-02-07
发明人： Kawashima, Isamu
CPC分类号： B24B37/345 , B25B11/005 , H01L21/6838
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公开(公告)号：EP1498935B1
公开(公告)日：2006-04-26
申请号：EP04254154.0
申请日：2004-07-12
发明人： Kawashima, Isamu
CPC分类号： H01L21/67253 , G01J1/429 , G01J1/48 , H01L21/67092 , H01L21/67132
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9.发明公开
公开(公告)号：EP1859917A2
公开(公告)日：2007-11-28
申请号：EP07108403.2
申请日：2007-05-17
发明人： Kawashima, Isamu , Sato, Hideshi , Kino, Hideo , Ametani, Minoru
IPC分类号： B29C63/02
CPC分类号： B29C63/02 , B29C63/0004 , B29L2031/3425 , B65H37/002 , Y10T156/10 , Y10T156/1705 , Y10T156/1712 , Y10T156/1734
摘要： A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3) ; a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.
摘要翻译： 胶带粘接装置（10）包括：用于拉出带（3）的拉丝辊（42）; 用于固定从拉丝辊拉出的一部分带的胶带固定装置（47）; 用于从带固定装置和牵引辊之间的拉丝辊中抽出预定量的由胶带固定装置固定的胶带的胶带拉伸装置; 以及用于将位于带固定装置的下游的胶带粘附到待粘合物体（20,36）上的条带粘合装置（49,31,37），在条带的固定操作 磁带固定装置被释放。 由带拉伸装置引出的带的长度最好不小于被粘物的直径。 由于上述原因，可以防止在胶带粘附时在带上形成褶皱。
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公开(公告)号：EP1232835A3
公开(公告)日：2004-02-04
申请号：EP02002773.6
申请日：2002-02-07
发明人： Kawashima, Isamu
CPC分类号： B24B37/345 , B25B11/005 , H01L21/6838
摘要： Wafers (26) are prevented from getting damaged on delivery thereof from a sucking and carrying device to a table (48, 52, 54). A wafer (26) before planarization sucked and held by a sucking board (68, 80) is positioned above a table (48, 52, 54). Next, wafer (26) is vacuum-attracted by the table (48, 52, 54), and the table (48, 52, 54) is moved upward by that attraction power in a direction to suck the wafer (26) so as to vacuum-suck it on the table (48, 52, 54). Subsequently, the wafer (26) is sucked and held only by the table (48, 52, 54) by releasing the sucking and holding thereof by the sucking board (68, 80).
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