公开(公告)号：EP2006895A4

公开(公告)日：2016-08-10

申请号：EP07713551

申请日：2007-03-05

申请人： TOSHIBA KK ,  TOSHIBA MATERIALS CO LTD

发明人： KATO HIROMASA ,  NABA TAKAYUKI ,  NAKAYAMA NORITAKA

IPC分类号： H01L21/52 ,  H01B1/02 ,  H01L23/00 ,  H01L23/373 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18 ,  H01L35/30 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L35/30 ,  H01L23/3735 ,  H01L23/473 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/351 ,  H05K1/0201 ,  H05K1/18 ,  H05K3/3463 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/01039

公开(公告)号：EP1835551A4

公开(公告)日：2011-11-23

申请号：EP05814548

申请日：2005-12-12

申请人： TOSHIBA KK ,  TOSHIBA MATERIALS CO LTD

发明人： HIRONO SHINSUKE ,  NABA TAKAYUKI ,  OKAMURA MASAMI

IPC分类号： H01L35/08 ,  H01L35/14 ,  H01L35/30 ,  H02N11/00

CPC分类号： H01L35/08

摘要： A thermoelectric conversion module (10) comprises first and second electrode members (13, 14), and thermoelectric elements (11, 12) arranged between the electrode members (13, 14). The thermoelectric elements (11, 12) are made of a half-Heusler material and are electrically and mechanically connected to the first and second electrode members (13, 14) via bonding parts (17). The bonding parts (17) include a bonding material which contains at least one selected from Ag, Cu and Ni as a main component and at least one of active metal selected from Ti, Zr, Hf, Ta, V and Nb in a range from 1 to 10% by mass.

摘要翻译： 热电转换模块（10）包括第一和第二电极部件（13,14）和布置在电极部件（13,14）之间的热电元件（11,12）。 热电元件（11,12）由半赫斯勒（Half-Heusler）材料制成，并且经由接合部件（17）电连接和机械连接到第一和第二电极部件（13,14）。 接合部分（17）包括含有选自Ag，Cu和Ni中的至少一种作为主要成分和选自Ti，Zr，Hf，Ta，V和Nb中的至少一种活性金属的接合材料，其范围为 1〜10质量％。

公开(公告)号：EP0798779A4

公开(公告)日：1998-05-13

申请号：EP96923082

申请日：1996-07-12

申请人： TOSHIBA KK

发明人： NABA TAKAYUKI

IPC分类号： H05K1/09 ,  B23K1/00 ,  B23K35/14 ,  B23K35/30 ,  C04B37/02 ,  H01L23/14 ,  H01L23/15 ,  H01L23/373 ,  H05K3/20 ,  H05K3/38

CPC分类号： B23K35/3006 ,  B23K1/0016 ,  B23K2201/40 ,  C04B37/026 ,  C04B2235/6581 ,  C04B2235/96 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H01L23/15 ,  H01L23/3735 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H05K3/38 ,  Y10T428/12493 ,  Y10T428/12806 ,  Y10T428/12819 ,  Y10T428/12882 ,  Y10T428/12896 ,  Y10T428/24926 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A ceramic circuit board composed of a ceramic board (2) and a metallic circuit board (3) joined to each other via a silver-copper brazing metal layer (5) containing at least one reactive metal selected among Ti, Zr, Hf, V, Nb and Ta, wherein the Vickers hardness of a reaction product layer (6) formed by the reaction between the brazing metal layer (5) and the ceramic board (2) is 1,100 or above. It is preferable that the brazing metal layer (5) further contains at least one element selected among In, Zn, Cd and Sn, and also contains 0.1-10.0 wt. % powdery carbon. It is thus possible to provide a highly reliable ceramic circuit board excellent in thermal cycle stability, i.e., effectively prevented from causing cracking even after reperated cold-hot cycles for long.