公开(公告)号：EP2624290A2

公开(公告)日：2013-08-07

申请号：EP13166078.9

申请日：2009-04-03

申请人： The Charles Stark Draper Laboratory, Inc.

发明人： Racz, Livia M. ,  Tepolt, Gary B. ,  Thompson, Jeffrey C. ,  Langdo, Thomas A. ,  Mueller, Andrew J.

IPC分类号： H01L21/68 ,  H01L23/538 ,  H01L25/10 ,  H01L21/60 ,  B81C1/00 ,  H01L23/13

CPC分类号： H01L21/486 ,  B81B2207/012 ,  B81C1/00333 ,  B81C2201/019 ,  B81C2201/0191 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49124 ,  H01L2924/00

摘要： An interposer comprises a substrate and a plurality of posts. Each of the posts extends substantially through a thickness of the substrate. A method for forming an interposer comprises forming a fill hole in a first side of a substrate and a cavity in a second side of the substrate. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity. An encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts.

摘要翻译： 内插器包括基板和多个柱。 每个柱基本上延伸穿过衬底的厚度。 一种用于形成中介层的方法包括在衬底的第一侧中形成填充孔并且在衬底的第二侧中形成空腔。 腔体与填充孔流体连通。 多个柱形成在空腔中。 通过填充孔将密封剂注入空腔中以封装多个柱。

公开(公告)号：EP2624289A3

公开(公告)日：2014-04-16

申请号：EP13166066.4

申请日：2009-04-03

申请人： The Charles Stark Draper Laboratory, Inc.

发明人： Racz, Livia M. ,  Tepolt, Gary B. ,  Thompson, Jeffrey C. ,  Langdo, Thomas A. ,  Mueller, Andrew J.

IPC分类号： H01L21/68 ,  H01L23/538 ,  H01L25/10 ,  H01L21/60 ,  B81C1/00 ,  H01L23/13 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L21/486 ,  B81B2207/012 ,  B81C1/00333 ,  B81C2201/019 ,  B81C2201/0191 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49124 ,  H01L2924/00

摘要： An electronic module comprises a substrate having a plurality of cavities. A die is encapsulated within each cavity. A post defines at least a portion of an electrical connection through the substrate.

公开(公告)号：EP2624290A3

公开(公告)日：2014-04-16

申请号：EP13166078.9

申请日：2009-04-03

申请人： The Charles Stark Draper Laboratory, Inc.

发明人： Racz, Livia M. ,  Tepolt, Gary B. ,  Thompson, Jeffrey C. ,  Langdo, Thomas A. ,  Mueller, Andrew J.

IPC分类号： H01L21/68 ,  H01L23/538 ,  H01L25/10 ,  H01L21/60 ,  B81C1/00 ,  H01L23/13 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L21/486 ,  B81B2207/012 ,  B81C1/00333 ,  B81C2201/019 ,  B81C2201/0191 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49124 ,  H01L2924/00

摘要： An interposer comprises a substrate and a plurality of posts. Each of the posts extends substantially through a thickness of the substrate. A method for forming an interposer comprises forming a fill hole in a first side of a substrate and a cavity in a second side of the substrate. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity. An encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts.

公开(公告)号：EP2624289A2

公开(公告)日：2013-08-07

申请号：EP13166066.4

申请日：2009-04-03

申请人： The Charles Stark Draper Laboratory, Inc.

发明人： Racz, Livia M. ,  Tepolt, Gary B. ,  Thompson, Jeffrey C. ,  Langdo, Thomas A. ,  Mueller, Andrew J.

IPC分类号： H01L21/68 ,  H01L23/538 ,  H01L25/10 ,  H01L21/60 ,  B81C1/00 ,  H01L23/13

CPC分类号： H01L21/486 ,  B81B2207/012 ,  B81C1/00333 ,  B81C2201/019 ,  B81C2201/0191 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49124 ,  H01L2924/00

摘要： An electronic module comprises a substrate having a plurality of cavities. A die is encapsulated within each cavity. A post defines at least a portion of an electrical connection through the substrate.

摘要翻译： 电子模块包括具有多个空腔的基板。 模具被封装在每个腔内。 支柱限定通过基板的电连接的至少一部分。