公开(公告)号：EP2659026A1

公开(公告)日：2013-11-06

申请号：EP11811464.4

申请日：2011-12-21

Applicant: Veeco Instruments Inc.

Inventor： MITROVIC, Bojan ,  WEI, Guanghua ,  ARMOUR, Eric, A. ,  PARANJPE, Ajit

IPC: C23C16/455 ,  C23C16/458 ,  H01L21/687

CPC classification number: C23C16/4585 ,  C23C16/45504 ,  C23C16/45508 ,  C23C16/45591 ,  C23C16/4584 ,  C23C16/46 ,  C30B25/165 ,  C30B29/06 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/68735 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68785

Abstract: Apparatus for treating wafers using a wafer carrier rotated about an axis is provided with a ring which surrounds the wafer carrier during operation. Treatment gasses directed onto a top surface of the carrier flow outwardly away from the axis over the carrier and over the ring, and pass downstream outside of the ring. The outwardly flowing gasses form a boundary over the carrier and ring. The ring helps to maintain a boundary layer of substantially uniform thickness over the carrier, which promotes uniform treatment of the wafers.

公开(公告)号：EP2659026B1

公开(公告)日：2015-06-17

申请号：EP11811464.4

申请日：2011-12-21

Applicant: Veeco Instruments Inc.

Inventor： MITROVIC, Bojan ,  WEI, Guanghua ,  ARMOUR, Eric, A. ,  PARANJPE, Ajit

IPC: C23C16/455 ,  C23C16/458 ,  H01L21/687

CPC classification number: C23C16/4585 ,  C23C16/45504 ,  C23C16/45508 ,  C23C16/45591 ,  C23C16/4584 ,  C23C16/46 ,  C30B25/165 ,  C30B29/06 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/68735 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68785

Abstract: Apparatus for treating wafers using a wafer carrier rotated about an axis is provided with a ring which surrounds the wafer carrier during operation. Treatment gasses directed onto a top surface of the carrier flow outwardly away from the axis over the carrier and over the ring, and pass downstream outside of the ring. The outwardly flowing gasses form a boundary over the carrier and ring. The ring helps to maintain a boundary layer of substantially uniform thickness over the carrier, which promotes uniform treatment of the wafers.

公开(公告)号：EP2735020A2

公开(公告)日：2014-05-28

申请号：EP12815170.1

申请日：2012-07-02

Applicant: Veeco Instruments Inc.

Inventor： PARANJPE, Ajit ,  ARMOUR, Eric A. ,  QUINN, William E.

IPC: H01L21/205

CPC classification number: C23C16/4582 ,  C23C16/54 ,  C30B25/025 ,  C30B35/00

Abstract: A multi-chamber CVD system includes a plurality of substrate carriers where each substrate carrier is adapted to support at least one substrate. A plurality of enclosures are each configured to form a deposition chamber enclosing one of the plurality of substrate carriers to maintain an independent chemical vapor deposition process chemistry for performing a processing step. A transport mechanism transports each of the plurality of substrate carriers to each of the plurality of enclosures in discrete steps that allow processing steps to be performed in the plurality of enclosures for a predetermined time. In some embodiments, the substrate carrier can be rotatable.

公开(公告)号：EP2471065A1

公开(公告)日：2012-07-04

申请号：EP10814294.4

申请日：2010-08-26

Applicant: Veeco Instruments Inc.

Inventor： PARANJPE, Ajit ,  LUSE, Todd, Arthur ,  FREMGEN, Roger, P. ,  SRINIVASAN, Narasimhan ,  ROOK, Katrina ,  DRUZ, Boris, L. ,  CELARU, Adrian

IPC: G11B5/65

CPC classification number: G11B5/855 ,  C23C14/042 ,  C23C14/046 ,  C23C14/505 ,  H01L21/67173 ,  H01L21/67709 ,  H01L21/67712 ,  H01L21/67718 ,  H01L21/67742 ,  H01L21/67754

Abstract: An inline processing system for patterning magnetic recording layers on hard discs for use in a hard disc drive. Discs are processed on both sides simultaneously in a vertical orientation, in round plate-like holders called MDCs. A plurality (as many as 10) discs are held in a dial carrier of the MDC, and transferred from one process station to another. The dial carrier of the MDC may be rotated and/or angled at up to 70° from normal in each process station, so that one or a plurality of process sources may treat the discs simultaneously. This configuration provides time savings and a reduction in the number and size of process sources needed. A mask enhancement process for patterning of magnetic media, and a filling and planarizing process used therewith, are also disclosed.