公开(公告)号：EP0984846B1

公开(公告)日：2004-11-24

申请号：EP98903401.2

申请日：1998-01-12

申请人： RODEL, INC.

发明人： COOK, Lee, Melbourne ,  JAMES, David, B. ,  CHECHIK, Nina, G. ,  BUDINGER, William, D.

IPC分类号： B24D3/00

CPC分类号： B24B37/22 ,  B24B37/26 ,  B24D3/00 ,  B24D11/00 ,  B24D18/00

摘要： An innovative method of manufacturing polishing pads using photo-curing polymers (14) and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.

公开(公告)号：EP0706582B9

公开(公告)日：2004-11-03

申请号：EP94918171.3

申请日：1994-05-25

申请人： RODEL, INC.

发明人： BRANCALEONI, Gregory ,  COOK, Lee Melbourne

IPC分类号： C23F1/00 ,  H01L21/306 ,  C09G1/02

CPC分类号： H01L21/3212 ,  C09G1/02 ,  H01L21/31053 ,  Y10S451/905

摘要： Improved compositions for polishing silicon, silica or silicon-containing articles, including a composite of metal and silica, comprising an aqueous medium, abrasive particles, an oxidizing agent and an anion which suppresses the rate of removal of silica are provided. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of workpieces, as well as products produced by such methods, are also provided.

公开(公告)号：EP1011919A4

公开(公告)日：2000-11-02

申请号：EP98938386

申请日：1998-08-05

申请人： RODEL INC

发明人： ROBERTS JOHN V H ,  JENKINS CHARLES W ,  JAMES DAVID B

IPC分类号： B24B37/24 ,  B24D3/26 ,  B24D13/12 ,  B24D13/14 ,  H01L21/304 ,  B24B1/00 ,  B24B7/19 ,  B24B7/30

CPC分类号： B24B37/24 ,  B24D3/26

摘要： Polishing pads are provided having a polishing surface formed from a hydrophilic material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.

公开(公告)号：EP0868543A4

公开(公告)日：1998-12-09

申请号：EP96936459

申请日：1996-10-04

申请人： RODEL INC

发明人： WANG JIUN-FANG ,  SETHURAMAN ANANTHA ,  WANG HUEY-MING ,  COOK LEE MELBOURNE

IPC分类号： B24B37/00 ,  C09G1/02 ,  C09K3/14 ,  C23F1/00 ,  C23F3/00 ,  H01L21/304 ,  C03C15/00

CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1409 ,  C23F3/00

摘要： An aqueous slurry is provided for polishing or planarizing a work piece which contains a metal, the solids portion of said slurry being comprised of 1 to 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from the group consisting of aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.

摘要翻译： 提供含水浆料用于抛光或平面化含有金属的工件，所述浆料的固体部分包含约1-约50重量％的亚微米α-氧化铝，其余固体基本上不具有磨料 选自一种或多种选自水合铝，氢氧化铝，γ-氧化铝，δ-氧化铝，无定形氧化铝和无定形二氧化硅的组合物。 还提供了一种抛光包含金属的工件表面的方法，其中在化学机械抛光期间使用所述含水浆料作为抛光组合物。

公开(公告)号：EP0868543A1

公开(公告)日：1998-10-07

申请号：EP96936459.0

申请日：1996-10-04

申请人： RODEL, INC.

发明人： WANG, Jiun-Fang ,  SETHURAMAN, Anantha ,  WANG, Huey-Ming ,  COOK, Lee, Melbourne

IPC分类号： B24B37 ,  C09G1 ,  C09K3 ,  C23F1 ,  C23F3 ,  H01L21

CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1409 ,  C23F3/00

摘要： An aqueous slurry is provided for polishing or planarizing a workpiece which contains a metal, the solids portion of said slurry being comprised of about 1 to about 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from one or more of the group consisting of aluminum hydrates, aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.

公开(公告)号：EP0701499A4

公开(公告)日：1997-08-20

申请号：EP95915502

申请日：1995-03-30

申请人： RODEL INC

发明人： COOK LEE MELBOURNE ,  ROBERTS JOHN V H ,  JENKINS CHARLES WILLIAM ,  PILLAI RAJ RAGHAV

IPC分类号： A47L13/28 ,  B24B37/26 ,  B24D3/28 ,  B24D11/00 ,  B24D11/02 ,  B24D13/00 ,  H01L21/304

CPC分类号： B24B37/26 ,  A47L13/28 ,  B24D3/28 ,  B24D11/005 ,  B24D11/02 ,  B24D13/00

摘要： An improved polishing pad is provided comprising a solid uniform polymer sheet having no intrinsic ability to absorb or transport slurry particles having during use a surface texture or pattern which has both large and small flow channels present simultaneously which permit the transport of slurry across the surface of the polishing pad, where said channels are not part of the material structure but are mechanically produced upon the pad surface. In a preferred version of the invention, the pad texture consists of a macrotexture produced prior to use and a microtexture which is produced by abrasion by a multiplicity of small abrasive points at a regular selected interval during the use of the pad.

摘要翻译： 提供了一种改进的抛光垫，其包括固体均匀的聚合物片材，其不具有在使用期间吸收或输送具有同时存在的大和小流动通道的表面纹理或图案的浆料颗粒的固有能力，其允许浆料跨越 抛光垫，其中所述通道不是材料结构的一部分，而是在焊盘表面上机械地制造。 在本发明的优选方案中，垫纹理包括在使用之前产生的宏观纹理和在使用垫期间以规则选择的间隔由多个小磨料点磨损产生的微纹理。

公开(公告)号：EP0683709A1

公开(公告)日：1995-11-29

申请号：EP94907449.0

申请日：1994-02-08

申请人： Rodel, Inc.

发明人： JENSEN, Elmer, William

IPC分类号： B24B37 ,  H01L21

CPC分类号： B24B37/08 ,  B24B37/107 ,  B24B37/20

摘要： An apparatus for polishing semiconductor wafers (4) in which the polishing pads (1) are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross section along this linear dimension. In addition, the wafer holder (2) travels in a straight line parallel to the long linear dimension of the polishing pads (1).

公开(公告)号：EP0411413A3

公开(公告)日：1992-05-06

申请号：EP90113938.6

申请日：1990-07-20

申请人： Rodel, Inc.

发明人： Roberts, John V. H.

IPC分类号： C09G1/02 ,  C23F3/00 ,  C09K3/14

CPC分类号： C23F3/00 ,  C09K3/1463

摘要： The present invention relates to a method of polishing a metal surface using an aqueous polishing composition for metal surfaces comprising water, an abrasive agent, such as aluminum oxide, cerium oxide, zirconium oxide, tin oxide, silicon dioxide, silicon carbide, titanium dioxide and titanium carbide and a salt, or combination of salts, such as aluminum chloride, zirconyl nitrate, zirconyl sulfate, cerium nitrate, aluminum nitrate, aluminum bromide, aluminum iodide, aluminum chloride, zirconyl chloride, tin chloride, aluminum perchlorate, magnesium chloride, zinc chloride, magnesium perchlorate and iron chloride.

公开(公告)号：EP0411413A2

公开(公告)日：1991-02-06

申请号：EP90113938.6

申请日：1990-07-20

申请人： Rodel, Inc.

发明人： Roberts, John V. H.

IPC分类号： C09G1/02 ,  C23F3/00 ,  C09K3/14

CPC分类号： C23F3/00 ,  C09K3/1463

摘要： The present invention relates to a method of polishing a metal surface using an aqueous polishing composition for metal surfaces comprising water, an abrasive agent, such as aluminum oxide, cerium oxide, zirconium oxide, tin oxide, silicon dioxide, silicon carbide, titanium dioxide and titanium carbide and a salt, or combination of salts, such as aluminum chloride, zirconyl nitrate, zirconyl sulfate, cerium nitrate, aluminum nitrate, aluminum bromide, aluminum iodide, aluminum chloride, zirconyl chloride, tin chloride, aluminum perchlorate, magnesium chloride, zinc chloride, magnesium perchlorate and iron chloride.

摘要翻译： 本发明涉及使用包含水，研磨剂如氧化铝，氧化铈，氧化锆，氧化锡，二氧化硅，碳化硅，二氧化钛的金属表面的水性抛光组合物来研磨金属表面的方法，以及 碳化钛和盐，或盐的组合，例如氯化铝，硝酸氧锆，硫酸氧锆，硝酸铈，硝酸铝，溴化铝，碘化铝，氯化铝，氧氯化锆，氯化锡，高氯酸铝，氯化镁，锌 氯化物，高氯酸镁和氯化铁。

公开(公告)号：EP1210209A4

公开(公告)日：2004-06-30

申请号：EP00952699

申请日：2000-08-10

申请人： RODEL INC

发明人： ROBERTS JOHN V H ,  PINHEIRO BARRY SCOTT ,  JAMES DAVID B

IPC分类号： B24B37/20 ,  B24D3/28 ,  B24D7/12 ,  B24D13/14 ,  B24B37/04 ,  B24D11/00

CPC分类号： B24B37/205 ,  B24D3/28

摘要： A polishing pad (10) is formed as a one-piece article having a region (12) which is transparent and an adjacent region (14) which is opaque. The article (10) is formed by solidifying a flowable polymeric material which at least initially has a uniform composition. The flowable polymeric material is processed during a molding operation to provide the transparent region (12) and the adjacent opaque region (14). Types of polymeric material suitable for making the polishing pad (10) include a single thermoplastic material, a blend of thermoplastic materials, and a reactive thermosetting polymer.