公开(公告)号：EP3054752B1

公开(公告)日：2019-10-30

申请号：EP14849338.0

申请日：2014-09-30

申请人： Taiyo Ink Mfg. Co., Ltd.

发明人： SHIMURA Masayuki ,  FURUTA Yoshiyuki ,  YUMOTO Masao

IPC分类号： H05K3/28 ,  B41M5/00 ,  C08F2/48 ,  C09D4/02 ,  C09D11/30 ,  C09D11/10 ,  C09D11/101 ,  C09D4/06 ,  C08F220/10 ,  C09D133/06

公开(公告)号：EP1923741A3

公开(公告)日：2011-09-14

申请号：EP07022181.7

申请日：2007-11-15

申请人： TAIYO INK MFG. CO., LTD.

发明人： Shibasaki, Yoko ,  Kato, Kenji ,  Arima, Masao

IPC分类号： G03F7/038 ,  G03F7/029 ,  G03F7/031

CPC分类号： G03F7/0388 ,  G03F7/029 ,  G03F7/031

摘要： There are provided a photosensitive composition used in one-shot exposure of exposing it via a photomask to light from a UV lamp or in direct writing with light from a UV lamp or laser light to form a patterned latent image to be developed with an alkaline aqueous solution, wherein a difference between maximum absorbance and minimum absorbance, in a wavelength range of 355 to 405 nm, of a dry coating thereof before light exposure is within 0.3 per 25 µm film thickness of the dry coating, and a dry film obtained by applying the photosensitive composition onto a carrier film and then drying it.

公开(公告)号：EP1887425A4

公开(公告)日：2010-09-22

申请号：EP06747034

申请日：2006-05-31

申请人： TAIYO INK MFG CO LTD

发明人： KATO KENJI ,  SHIBASAKI YOKO ,  ARIMA MASAO ,  MINEGISHI SHOUJI

IPC分类号： G03F7/031 ,  C08F2/50 ,  C08F299/00 ,  G03F7/004 ,  G03F7/027 ,  H05K3/28

CPC分类号： G03F7/029 ,  C08F283/10 ,  C08F290/00 ,  C08F299/00 ,  G03F7/031 ,  H05K3/287

公开(公告)号：EP1886800A4

公开(公告)日：2009-02-11

申请号：EP06747025

申请日：2006-05-30

申请人： TAIYO INK MFG CO LTD

发明人： USHIKI SHIGERU ,  MAKITA SHOHEI ,  KUSAMA MASATOSHI

IPC分类号： B32B7/14 ,  B29C65/52 ,  C09J11/06 ,  C09J157/00 ,  C09J163/00 ,  G02B6/00

CPC分类号： G02B6/138 ,  B29C65/1403 ,  B29C65/1496 ,  B29C65/4835 ,  B29C65/4845 ,  B29C65/4865 ,  B29C65/4875 ,  B29C65/4885 ,  B29C65/489 ,  B29C65/52 ,  B29C66/45 ,  B29C66/71 ,  B32B37/1292 ,  C08K5/0025 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/14 ,  C09J7/35 ,  C09J7/385 ,  C09J133/00 ,  C09J163/00 ,  C09J2201/28 ,  C09J2205/102 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  G03F7/038 ,  H05K3/305 ,  H05K3/321 ,  H05K2203/0514 ,  H05K2203/0525 ,  Y10T428/24174 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24628 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/31855 ,  Y10T428/31935 ,  B29C65/00

摘要： An adhesive pattern (4) is formed by applying a photocurable and thermosetting adhesive comprising as indispensable ingredients (A) a carboxyl group-containing photosensitive prepolymer having both a carboxyl group and an ethylenically unsaturated bond in its molecule and an acid value in the range of 30 to 160 mg KOH/g, (B) an epoxy resin, and (C) a photopolymerization initiator onto a surface of a substrate (1) as a member to be bonded to form a coating film; selectively exposing the coating film to an active energy ray through a photomask (3) according to a predetermined pattern, thereafter removing an unexposed portion by development with an aqueous alkaline solution. Then, a sheet member (5) as a joining member is pressed onto the adhesive pattern mentioned above, and the adhesive pattern is thermally cured to obtain a laminated structure.

公开(公告)号：EP1545171A4

公开(公告)日：2007-05-30

申请号：EP03764152

申请日：2003-07-09

申请人： TAIYO INK MFG CO LTD

发明人： OHNISHI SHIGEKATSU

IPC分类号： H05K1/09 ,  H05K3/02 ,  H05K3/40 ,  H05K3/06

CPC分类号： H05K3/02 ,  H05K1/092 ,  H05K3/4061 ,  H05K2203/0514 ,  H05K2203/0793

摘要： A technique of forming a pattern on a ceramic green sheet that attains cost reduction and is excellent in productivity. This forming technique is characterized by filling, without the use of a mask, the via holes of a ceramic green sheet having via holes with alkali soluble conductive paste (a), the alkali soluble conductive paste (a) comprising a binder soluble in an alkali aqueous solution and conductive particles as main components, subsequently applying alkali soluble photosensitive conductive paste (b) for wiring pattern onto the ceramic green sheet, and thereafter subjecting the same to drying, pattern exposure and development.

公开(公告)号：EP3067374A4

公开(公告)日：2017-07-26

申请号：EP14859821

申请日：2014-11-04

申请人： TAIYO INK MFG CO LTD

发明人： SHIMURA MASAYUKI ,  FURUTA YOSHIYUKI ,  YUMOTO MASAO

IPC分类号： C08F20/10 ,  C08F8/14 ,  C08F220/06 ,  C08F220/32 ,  C09D4/00 ,  H05K3/06 ,  H05K3/28

CPC分类号： C09D4/00 ,  C08F8/14 ,  C08F220/06 ,  C08F220/32 ,  C09D11/101 ,  C09D11/30 ,  C09D133/14 ,  H05K1/0313 ,  H05K3/0023 ,  H05K3/064 ,  H05K3/287 ,  H05K2203/0759

摘要： Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).

摘要翻译： 本发明提供一种在印刷布线板，特别是柔性基板等上显示良好的密合性且硬度高的固化性组合物， 该可固化组合物的抗蚀剂涂膜; 以及具有抗蚀剂涂布膜的抗蚀剂图案的印刷线路板。 该可固化组合物包含：（A）光产碱剂; （B-1）含环氧基的（甲基）丙烯酸酯化合物或（B-2）含羧基的（甲基）丙烯酸酯化合物; （C）光聚合引发剂; 和（D-2）热固性成分（不含（B-2）含羧基的（甲基）丙烯酸酯化合物）以外的（D-1） ）丙烯酸酯化合物）。

公开(公告)号：EP3054752A1

公开(公告)日：2016-08-10

申请号：EP14849338.0

申请日：2014-09-30

申请人： Taiyo Ink Mfg. Co., Ltd.

发明人： SHIMURA Masayuki ,  FURUTA Yoshiyuki ,  YUMOTO Masao

IPC分类号： H05K3/28 ,  B41M5/00 ,  C08F2/48 ,  C09D4/02 ,  C09D11/30

摘要： Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.

公开(公告)号：EP1857478A4

公开(公告)日：2008-05-14

申请号：EP06711602

申请日：2006-01-12

申请人： TAIYO INK MFG CO LTD

发明人： USHIKI SHIGERU ,  KUSAMA MASATOSHI ,  MAKITA SHOHEI

IPC分类号： C08F236/20 ,  B41J2/01 ,  B41M5/00 ,  C08F220/02 ,  C08F222/40 ,  C08F226/06 ,  C09D11/00 ,  H05K3/28

CPC分类号： H05K3/285 ,  C08F226/02 ,  C08F236/20 ,  C09D11/101 ,  C09D11/30 ,  H05K3/28 ,  H05K2203/013

摘要： A curable resin composition for ink-jet printing characterized by comprising (A) a bisallylnadiimide compound represented by the following general formula (1): [Chemical formula 1] (1) (wherein R1 represents C2-18 alkyl, aryl, or aralkyl), (B) a bismaleimide compound represented by the following general formula (2): [Chemical formula 2] (2) (wherein R2 represents C2-32 alkyl, aryl, or aralkyl), and (C) a diluent and having a viscosity at 25°C of 150 mPa·s or lower.

公开(公告)号：EP1341039A4

公开(公告)日：2006-09-20

申请号：EP01999859

申请日：2001-11-27

申请人： UNIV KANAGAWA ,  TAIYO INK MFG CO LTD

发明人： NISHIKUBO TADATOMI ,  KAMEYAMA ATSUSHI ,  SASAKI MASAKI ,  KUSAMA MASATOSHI

IPC分类号： C08F2/44 ,  C08F2/50 ,  C08F20/28 ,  C08F283/10 ,  C08F290/02 ,  C08F290/06 ,  C08G65/18 ,  C08G65/332 ,  C08L63/00 ,  C08L71/00 ,  C08L101/00 ,  G03F7/027 ,  G03F7/032 ,  G03F7/038

CPC分类号： G03F7/038 ,  C08F20/28 ,  C08F283/10 ,  C08F290/06 ,  C08F290/061 ,  C08G65/18 ,  C08G65/332 ,  C08L63/00 ,  C08L71/00 ,  G03F7/027 ,  C08L2666/22

摘要： A photocurable and thermosetting resin composition comprising (A) an actinic radiation curable resin bearing one or more structures represented by the general formula (1), (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting component: (1) wherein R1 is hydrogen or C¿1-6? alkyl; R?2, R3, and R4¿ are each hydrogen, C¿1-6? alkyl, aryl, aralkyl, cyano, fluoro, or furyl; and X is a polybasic acid anhydride residue.

公开(公告)号：EP1624001A4

公开(公告)日：2006-08-02

申请号：EP04731714

申请日：2004-05-07

申请人： TAIYO INK MFG CO LTD

发明人： KAKINUMA M ,  KUSAMA M ,  USHIKI S

IPC分类号： C08F220/10 ,  B41M5/00 ,  C08F2/00 ,  C08F2/46 ,  C08F10/00 ,  C08F20/00 ,  C09D11/00 ,  C09D11/322 ,  C09D11/324 ,  C09D11/38 ,  H05K3/28

CPC分类号： C09D11/101 ,  H05K3/287 ,  H05K2203/013

摘要： A photocuring/thermosetting inkjet composition contains (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in the molecule, (B) a photoreactive diluent other than the component (A) having a weight-average molecular weight of not more than 700, and (C) a photopolymerization initiator, and has a viscosity of not more than 150 mPa·s at 25˚C. A solder resist pattern is directly drawn on a printed wiring board by an inkjet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy beam and then further cured by heat.