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    BINDING CONDUCTOR PASTE
    8.
    发明公开
    BINDING CONDUCTOR PASTE 审中-公开

    公开(公告)号：EP4443444A1

    公开(公告)日：2024-10-09

    申请号：EP22901256.2

    申请日：2022-11-22

    申请人： Daicel Corporation

    发明人： NAGAI, Rumi ,  KOBATAKE, Takanori ,  FUJIWARA, Yoshihiko

    IPC分类号： H01B1/22 ,  B22F1/0545 ,  B22F1/10 ,  H01B1/00

    CPC分类号： B22F1/10 ,  H01B1/22 ,  H01B1/00 ,  B22F1/0545

    摘要： Provided is a conductive paste for bonding which is excellent in stability during continuous discharge and storage stability and can suppress generation of voids during formation of a sintered body. The conductive paste for bonding contains: metal nanoparticles (A) having an average particle size of 1 nm or more and less than 100 nm; and a dispersion medium containing an organic solvent (a), an organic solvent (b), and an organic solvent (c); wherein the metal nanoparticles (A) are coated on surfaces thereof with an organic protective agent containing an amine and dispersed in the dispersion medium, and the organic solvents (a) to (c) are different compounds and satisfy the following formulas (1) to (6): 150°C ≤ Ta ≤ 250°C (1); 150°C ≤ Tb ≤ 250°C (2); 250°C ≤ Tc ≤ 350°C (3); δa ≥ 10.0 (4); δc ≤ 9.0 (5); δc ≤ δb ≤ δa (6), where Ta to Tc represent boiling points of the organic solvents (a) to (c), respectively, and δa to δc represent Hansen solubility parameters of the organic solvents (a) to (c), respectively.