WELDING CONNECTION STRUCTURE FOR PIPE
    2.
    发明公开
    WELDING CONNECTION STRUCTURE FOR PIPE 审中-公开
    SCHWEISSVERBINDUNGSSTRUKTURFÜRROHRE

    公开(公告)号:EP2781815A1

    公开(公告)日:2014-09-24

    申请号:EP12849375.6

    申请日:2012-11-14

    Abstract: Provided is a welding connection structure for a pipe (1), in which the pipe has a double-pipe portion (2) at at least one end thereof and the double-pipe portion is formed by bending back a pipe wall (6) at the one end of the pipe inward and forming a bent-back portion in close contact with an outer pipe wall (4), and in which the pipe is connected by welding, at the double-pipe portion, to a mating member (11) to which the pipe is to be connected.

    Abstract translation: 本发明提供一种用于管道(1)的焊接连接结构,其中管道在其至少一端具有双管部分(2),并且双管部分通过将管壁(6)向后弯曲而形成 向内的管的一端形成与外管壁(4)紧密接触的弯曲部分,并且其中管道通过焊接在双管部分连接到配合构件(11)上, 管道要与之连接。

    METHOD OF PRODUCING A HEAT EXCHANGER AND A HEAT EXCHANGER
    7.
    发明公开
    METHOD OF PRODUCING A HEAT EXCHANGER AND A HEAT EXCHANGER 审中-公开
    VERFAHREN ZUR HERSTELLUNG EINESWÄRMETAUSCHERSUNDWÄRMETAUSCHER

    公开(公告)号:EP2676094A1

    公开(公告)日:2013-12-25

    申请号:EP12705041.7

    申请日:2012-01-24

    Applicant: Nissens A/S

    Inventor: NISSEN, Alan

    Abstract: Method of producing a heat exchanger comprising a number of thin plates (8) of aluminum by processing at least a portion of the edges (16), at least the ends, into a thickness allowing, and joining the edges (16) of said plates (8) to provide channels between each pair of said plates, whereafter manifolds for delivering liquid to and from the channels are secured to the processed portions of the edges (16) by welding. As a result there is obtained a heat exchanger, which is more flexible and cheaper in production than previously known.

    Abstract translation: 通过将至少一部分边缘(16)至少将端部加工成允许和连接所述板的边缘(16)的厚度来制造包括多个铝板的热板的方法, (8)以在每对所述板之间提供通道,然后用于将流体输送到通道和从通道输送液体的歧管通过焊接固定到边缘(16)的处理部分。 结果获得了一种热交换器,其在生产中比以前已知更灵活和便宜。

    LASER PROCESSING METHOD
    8.
    发明授权
    LASER PROCESSING METHOD 有权
    激光加工方法

    公开(公告)号:EP1742252B1

    公开(公告)日:2013-02-13

    申请号:EP05719830.1

    申请日:2005-03-02

    Abstract: A laser processing method is provided, which, when cutting a substrate formed with a laminate part including a plurality of functional devices into a plurality of chips, each chip including at least one of the functional devices, can cut the laminate part with a high precision together with the substrate. In this laser processing method, modified regions differing from each other in terms of easiness to cause the substrate 4 to fracture are formed along respective lines to cut 5a to 5d. Therefore, when an expandable tape is attached to the rear face of a substrate 4 and expanded, an object to be processed 1 is cut stepwise into a plurality of chips. Such stepwise cutting allows uniform tensile stresses to act on respective parts extending along the lines to cut 5a to 5d, whereby interlayer insulating films on the lines to cut 5a to 5d are cut with a high precision together with the substrate 4.

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