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公开(公告)号:EP4193814B1
公开(公告)日:2024-06-05
申请号:EP21791371.4
申请日:2021-10-14
CPC classification number: H05K1/0204 , H05K1/142 , H05K3/4694 , H05K1/0306 , H05K2201/018720130101 , H05K2201/0903620130101 , H05K2201/0906320130101 , H05K2201/0915420130101 , H05K2201/1010620130101 , H05K2201/1041620130101 , H05K2201/0916320130101 , H05K2201/20920130101 , H05K2201/04820130101 , H05K2201/06820130101 , C04B37/023 , C04B2237/34320130101 , C04B2237/3420130101 , C04B2237/36520130101 , C04B2237/36820130101 , C04B2237/36620130101 , C04B2237/40720130101 , C04B2237/40220130101 , C04B2237/40320130101 , C04B2237/0420130101 , C04B2237/12220130101
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公开(公告)号:EP4417592A1
公开(公告)日:2024-08-21
申请号:EP24152712.6
申请日:2024-01-18
Applicant: General Electric Company
Inventor: MAGNANT, Jerome Geoffrey , WEAVER, Jared Hogg
IPC: C04B37/00
CPC classification number: C04B2237/59520130101 , C04B37/006 , C04B37/005 , C04B2237/1020130101 , C04B2237/59220130101 , C04B2237/8420130101 , C04B2237/0420130101 , C04B2237/1220130101
Abstract: Unitary ceramic components, along with methods of their formation, are provided. The unitary ceramic component (100) may include a first densified ceramic component (110); a second densified ceramic component (120); and a series-hybrid joint (200) (200) coupling the first densified ceramic component (110) to the second densified ceramic component (120), where the series-hybrid joint (200) (200) comprises a first bonding area (210) coupling the first densified ceramic component (110) and the second densified ceramic component (120), and a second bonding area (220) coupling the first densified ceramic component (110) and the second densified ceramic component (120), where the first bonding area (210) exhibits properties that are different from the second bonding area (220). The first bonding interface (210) has a strength that is greater than the second bonding interface (220), whereas the second bonding interface (220) has a hermeticity that is greater than the first bonding interface (210), or a chemical resistance that is greater than the first bonding interface (210).
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