公开(公告)号：EP2688149B1

公开(公告)日：2018-05-16

申请号：EP11854537.5

申请日：2011-11-18

申请人： Kuang-chi Innovative Technology Ltd. ,  Kuang-Chi Institute of Advanced Technology

发明人： LIU, Ruopeng ,  XU, Guanxiong ,  LUAN, Lin ,  JI, Chunlin ,  ZHAO, Zhiya ,  LI, Yuefeng ,  YUE, Yutao

IPC分类号： H01Q15/00 ,  H05K1/02 ,  H05K3/46

CPC分类号： H05K9/0073 ,  H01Q15/0086 ,  H05K1/0236 ,  H05K1/024 ,  H05K3/4694 ,  H05K2201/09972

摘要： A metamaterial for deflecting an electromagnetic wave is disclosed, which comprises a functional layer. The functional layer comprises a plurality of sheet layers parallel to each other, and each of the sheet layers comprises a sheet-like substrate and a plurality of man-made microstructures arranged in an array on the sheet-like substrate. The sheet-like substrate comprises a plurality of unit blocks, and each of the man-made microstructures and a corresponding one of the unit blocks occupied thereby form a unit cell. Refractive indices of the unit cells arranged in a first direction in each of the sheet layers decrease gradually. Each of the unit cells has an anisotropic electromagnetic parameter. Through use of the metamaterial of the present disclosure, deflection of the electromagnetic wave can be achieved.

公开(公告)号：EP2421342B1

公开(公告)日：2013-09-11

申请号：EP11181849.8

申请日：2009-10-15

申请人： FUJITSU LIMITED

发明人： Mizukoshi, Masataka ,  Ishizuki, Yoshikatsu

IPC分类号： H05K1/14 ,  H05K3/20 ,  H05K3/46

CPC分类号： H05K3/20 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/10175 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K1/142 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09972 ,  H05K2203/025 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/1052 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/16225

摘要： [Problems] In an electronic component and a method of manufacturing the same, forming a finer conductive pattern than conventional counterpart [Means of Solving] A method of manufacturing an electronic component includes the steps of forming a resin layer over an underlying layer, pressing a conductor plate including a pattern formed on one major surface thereof against the resin layer, and embedding the pattern in the resin layer, and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern.

公开(公告)号：EP2384102A4

公开(公告)日：2012-08-08

申请号：EP09834606

申请日：2009-10-15

申请人： FUJITSU LTD

发明人： MIZUKOSHI MASATAKA ,  ISHIZUKI YOSHIKATSU

IPC分类号： H05K3/20 ,  H05K3/46

CPC分类号： H05K3/20 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/10175 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K1/142 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09972 ,  H05K2203/025 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/1052 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/16225

摘要： [Problems] In an electronic component and a method of manufacturing the same, forming a finer conductive pattern than conventional counterpart [Means of Solving] A method of manufacturing an electronic component includes the steps of forming a resin layer over an underlying layer, pressing a conductor plate including a pattern formed on one major surface thereof against the resin layer, and embedding the pattern in the resin layer, and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern.

公开(公告)号：EP2421342A2

公开(公告)日：2012-02-22

申请号：EP11181849.8

申请日：2009-10-15

申请人： FUJITSU LIMITED

发明人： Mizukoshi, Masataka ,  Ishizuki, Yoshikatsu

IPC分类号： H05K3/20 ,  H05K3/46

CPC分类号： H05K3/20 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/10175 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K1/142 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09972 ,  H05K2203/025 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/1052 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/16225

摘要： [Problems] In an electronic component and a method of manufacturing the same, forming a finer conductive pattern than conventional counterpart.
[Means of Solving] A method of manufacturing an electronic component includes the steps of arranging a plurality of underlying substrates (131,132) each of which includes a recess portion (138a) formed on one major surface thereof; fitting a protrusion (140a) of a pattern formed on one major surface (140x) of a conductor plate (140) into the recess portion of each of the underlying substrates, and connecting the plurality of the underlying substrates through the conductor plate; forming a resin layer (139) on the one major surface of each of a plurality of the underlying substrates; and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern.

摘要翻译： [问题]在电子部件及其制造方法中，形成比常规对应物更细的导电图案。 [解决方法]电子部件的制造方法包括以下步骤：配置多个下面的基板（131,132），每个基板包括形成在其一个主表面上的凹部（138a）; 将形成在导体板（140）的一个主表面（140x）上的图案的突起（140a）装配到每个下面的基板的凹部中，并且通过导体板连接多个下面的基板; 在多个下面的基底中的每一个的一个主表面上形成树脂层（139）; 并进行抛光，化学机械抛光，或者通过在导体板的另一个主表面上使用金刚石钻头进行切割，直到出现树脂层，并将图案留在树脂层中作为导体图案。

公开(公告)号：EP2384102A1

公开(公告)日：2011-11-02

申请号：EP09834606.7

申请日：2009-10-15

申请人： Fujitsu Limited

发明人： MIZUKOSHI, Masataka ,  ISHIZUKI, Yoshikatsu

IPC分类号： H05K3/20 ,  H05K3/22 ,  H05K3/46

CPC分类号： H05K3/20 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/10175 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K1/142 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09972 ,  H05K2203/025 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/1052 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/16225

摘要： [Problems] In an electronic component and a method of manufacturing the same, forming a finer conductive pattern than conventional counterpart
[Means of Solving] A method of manufacturing an electronic component includes the steps of forming a resin layer over an underlying layer, pressing a conductor plate including a pattern formed on one major surface thereof against the resin layer, and embedding the pattern in the resin layer, and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern.

摘要翻译： 在电子部件及其制造方法中，形成比传统的对应物更细的导电图案[解决方法]电子部件的制造方法包括以下步骤：在下层上形成树脂层，按压 导体板包括在其一个主表面上形成的图案抵靠树脂层，并且将图案嵌入树脂层中，并且通过在导体板的另一个主表面上使用金刚石钻头进行抛光，化学机械抛光或切割 直到出现树脂层，并将图案留在树脂层中作为导体图案。

公开(公告)号：EP2141972A1

公开(公告)日：2010-01-06

申请号：EP08740252.5

申请日：2008-04-11

申请人： Murata Manufacturing Co. Ltd.

发明人： YUDA, Kazuyuki ,  IEKI, Tsutomu

IPC分类号： H05K3/46

CPC分类号： H05K1/141 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/183 ,  H05K1/187 ,  H05K3/007 ,  H05K3/20 ,  H05K3/284 ,  H05K3/303 ,  H05K3/46 ,  H05K3/4694 ,  H05K3/4697 ,  H05K2201/0715 ,  H05K2201/0979 ,  H05K2201/09972 ,  H05K2203/016 ,  H05K2203/167 ,  Y10T29/4913 ,  H01L2224/0401

摘要： [Problem] To provide a reliable component-embedded module that allows a reduction in cost and an increase in yield.
[Solving Means] A component-embedded module A includes a module substrate 1 having wiring electrodes 2 on the upper surface thereof, first circuit components 7 mounted on the wiring electrodes 2, a sub-module 10 disposed on an area on which no wiring electrodes 2 are formed, and an insulating resin layer 20 formed on the entire upper surface of the module substrate in such a manner that the insulating resin layer 20 covers at least parts of the first circuit components and sub-module. The second circuit components 15 including an integrated circuit element are mounted on the sub-module 10 or embedded therein. Via conductors 3 are formed through the module substrate 1 from the lower surface thereof and are directly coupled to terminal electrodes 14 on the lower surface of the sub-module 10. By using a substrate having a wiring accuracy higher than that of the module substrate 1, a reliable component-embedded module is obtained.

摘要翻译： [问题]提供可靠的组件嵌入式模块，其允许降低成本并提高产量。 组件嵌入式模块A包括在其上表面上具有布线电极2的模块基板1，安装在布线电极2上的第一电路部件7，设置在没有布线电极的区域上的子模块10 形成绝缘树脂层20，绝缘树脂层20以绝缘树脂层20覆盖第一电路部件和子模块的至少一部分的方式形成在模块基板的整个上表面上。 包括集成电路元件的第二电路部件15安装在子模块10上或嵌入其中。 通孔导体3通过模块基板1从其下表面形成，并且直接耦合到子模块10的下表面上的端子电极14.通过使用布线精度高于模块基板1的布线精度的基板 ，获得了可靠的组件嵌入式模块。

公开(公告)号：EP0602257B1

公开(公告)日：1997-09-10

申请号：EP92121216.3

申请日：1992-12-12

申请人： International Business Machines Corporation

发明人： Arnold, Hans ,  Lück, Peter, Dipl.-Ing. ,  Mohr, Günther, Dipl.-Ing. ,  Zur Nieden, Theis, Dipl.-Phys. Dr.

IPC分类号： H05K1/00 ,  H05K3/46 ,  H05K1/02

CPC分类号： H01L23/5383 ,  H01L21/4857 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/113 ,  H05K3/0017 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0352 ,  H05K2201/09509 ,  H05K2201/09918 ,  H05K2201/09972 ,  H05K2201/10674 ,  H05K2203/054 ,  H05K2203/0574 ,  H05K2203/068 ,  H05K2203/107

公开(公告)号：EP3158835A4

公开(公告)日：2018-06-13

申请号：EP15809672

申请日：2015-05-08

申请人： INTEL CORP

发明人： WELLS KEVIN E ,  STAMEY RICHARD C

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/42 ,  H05K3/46

CPC分类号： G06F1/16 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/421 ,  H05K3/4694 ,  H05K2201/041 ,  H05K2201/09972 ,  H05K2201/10159 ,  H05K2201/10719 ,  Y02P70/613 ,  Y10T29/49128 ,  H01L2924/00

摘要： Described are apparatuses for modular printed circuit boards (PCB) and methods for producing modular PCBs. An apparatus may include a first PCB module with a first pattern of routing structures on one or more layers of the first PCB module. The apparatus may further include a second PCB module with a second pattern of routing structures on one or more layers of the second PCB module. The second pattern of routing structures may be aligned with and electrically coupled to the first pattern of routing structures without connectors. Other embodiments may be described and/or claimed.

公开(公告)号：EP3081056A1

公开(公告)日：2016-10-19

申请号：EP14825088.9

申请日：2014-12-12

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： SCHWARZ, Timo ,  ZLUC, Andreas ,  LANGER, Gregor ,  STAHR, Johannes

IPC分类号： H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K1/183 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73267 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/185 ,  H05K3/30 ,  H05K3/46 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/10106 ,  H05K2203/0191 ,  H05K2203/1469 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method for embedding a component in a printed circuit board or an intermediate printed circuit board product, wherein the printed circuit board or the intermediate printed circuit board product has at least one insulating layer of a prepreg material and the component is fixed by the resin of the prepreg material, is characterized by the following steps: a) providing a composite (100) of the layers of the printed circuit board or the intermediate printed circuit board product (200), wherein this composite includes at least one curable prepreg material, b) producing a clearance (4) in the composite (100) for receiving the component (6) to be embedded, c) covering at least the region of the clearance (4) with a first temporary carrier layer (5) on a first side of the composite, d) positioning the component (6) to be embedded in the clearance (4) by means of the first temporary carrier layer (5), e) covering at least the region of the clearance (4) on the second side of the composite (100) with a second temporary carrier layer (9), f) pressing the composite (100) to the component (6) while curing the curable prepreg material, g) removing the temporary carrier layers (5, 9).

公开(公告)号：EP2965596A2

公开(公告)日：2016-01-13

申请号：EP14713023.1

申请日：2014-03-05

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： KASPER, Alexander ,  DROFENIK, Dietmar ,  SHIVARUDRAPPA, Ravi Hanyal ,  GÖSSLER, Michael

IPC分类号： H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K3/46 ,  H01L27/13

CPC分类号： H05K1/0298 ,  H05K1/028 ,  H05K1/09 ,  H05K1/115 ,  H05K1/162 ,  H05K3/0047 ,  H05K3/10 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4682 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0355 ,  H05K2201/096 ,  H05K2203/061 ,  H05K2203/063

摘要： A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1') and application of a dielectric insulating foil (3, 3') to at least one subarea of the conducting foil; b) applying a structure of conducting paths (4, 4') to the insulating layer (3, 3'); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (1, 1') plus insulating layer (3, 3') and conducting paths (4, 4') by interposing a prepreg layer (5, 85; 18, 18'), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method.

摘要翻译： 一种用于生产印刷电路板（13，15，16），在段多层子区域，通过下面的步骤为特征的方法：a）提供至少一个导电箔（1，1“）和介电绝缘薄膜的应用（3 ，3“），以在导电箔的至少一个子区域; b）将导电路径（4，4的结构 '）到绝缘层（3，3'）; c）提供一个另外的印刷电路板结构; d）中进一步印刷电路板结构的与所述导电箔（1，1接合“）加绝缘层（3，3”）和导电通过插入半固化层（5，85的路径（4,4“）; 18， 18“），以及e）在零件层叠接合在步骤d）下压制压力和热量; 和印刷电路板产生的雅丁于该方法。