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1.发明公开METHOD FOR MANUFACTURING CERAMIC MULTILAYERED BOARD 有权VERFAHREN ZUR HERSTELLUNG EINER KERAMISCHEN MEHRSCHICHTIGEN LEITERPLATTE
公开(公告)号：EP1392093A1
公开(公告)日：2004-02-25
申请号：EP02771763.6
申请日：2002-05-21
CPC分类号： B32B18/00 , C04B35/6342 , C04B35/63424 , C04B35/638 , C04B35/645 , C04B37/008 , C04B37/047 , C04B2235/6567 , C04B2235/6581 , C04B2235/963 , C04B2237/34 , C04B2237/341 , C04B2237/343 , C04B2237/68 , C04B2237/70 , C04B2237/704 , C04B2237/708 , H01L21/4857 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K3/386 , H05K3/4611 , H05K3/4667 , H01L2924/00
摘要： A manufacturing method of ceramic multi-layer boards including a step of forming adhesive layer (12) on ceramic board (11), and adhesive layer (12) integrates board 11 and ceramic green sheet 14. Little shrinkage in an in-plane direction is observed after firing, so that the ceramic multi-layer boards having highly dimensional accuracy are manufactured.
摘要翻译： 包括在陶瓷板（11）上形成粘合剂层（12）的步骤的陶瓷多层板的制造方法以及粘合剂层（12）将板11和陶瓷生片14整合在一起。面内方向的收缩小 在烧制后观察，制造具有高尺寸精度的陶瓷多层板。
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公开(公告)号：EP2868642B1
公开(公告)日：2016-09-28
申请号：EP13809977.5
申请日：2013-06-26
申请人： Tosoh Corporation
发明人： YAMASHITA, Isao , IMAI, Kohei , YAMAUCHI, Shoichi , TSUKUMA, Koji
CPC分类号： B32B18/00 , B32B5/16 , B32B7/12 , B32B15/16 , B32B15/20 , B32B17/06 , B32B37/12 , B32B37/18 , B32B2264/102 , B32B2307/306 , B32B2307/4026 , B32B2307/54 , B32B2307/554 , B32B2307/558 , B32B2307/72 , B32B2439/00 , B32B2457/00 , C04B35/486 , C04B35/4885 , C04B35/63452 , C04B35/645 , C04B37/008 , C04B37/028 , C04B37/047 , C04B2235/3217 , C04B2235/3222 , C04B2235/3224 , C04B2235/3225 , C04B2235/3248 , C04B2235/3262 , C04B2235/3272 , C04B2235/3275 , C04B2235/3279 , C04B2235/3418 , C04B2235/6562 , C04B2235/77 , C04B2235/96 , C04B2235/9661 , C04B2237/348 , C04B2237/40 , C04B2237/401 , C04B2237/70 , C04B2237/704 , C04B2237/706 , C04B2237/708 , G04B37/22 , H04M1/0202 , H05K5/02 , Y10T428/1317 , Y10T428/24967
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公开(公告)号：EP0429670A1
公开(公告)日：1991-06-05
申请号：EP90909362.7
申请日：1990-06-15
发明人： SAKURAMOTO, Takafumi Nitto Denko Corporation , TOMINAGA, Takashi Nitto Denko Corporation , ASHIDA, Megumi Nitto Denko Corporation
CPC分类号： C23C26/00 , C04B35/63424 , C04B35/645 , C04B37/008 , C04B37/047 , C04B41/4572 , C04B41/52 , C04B2235/6562 , C04B2235/6567 , C04B2237/343 , C04B2237/70 , C04B2237/704 , C04B41/48 , C04B41/5022 , C04B41/5025 , C04B41/522 , C04B41/0072 , C04B41/45 , C04B41/4511 , C04B41/50 , C04B41/53
摘要： A method of producing a fired pattern by firing a firing pattern bonded to an object via an inorganic powder sheet formed by binding inorganic powders of glass, ceramic, etc., with the use of a resin binder, wherein said sheet is bonded to said object by applying heat and/or pressure thereto or with the use of a pressure-sensitive adhesive.
摘要翻译： 烧制图案通过将加热或加压的烧成片（a）通过树脂粘合剂粘合到物体上并进行烧成处理来制造。 （a）在通过用树脂粘合剂粘合无机粉末如玻璃，陶瓷等而形成的无机粉末片的一面上设置有焙烧图案。 通过使用含有无机着色剂（1-100重量份）和无机粉末（99-0重量份）的烧成油墨形成烧成图案。 烧制图案也可以通过将无机粉末状片材（b）通过树脂 - 粘合剂将热和/或压力施加到物体上来形成，在该无机粉末片材上形成烧成图案，然后对其进行 它进行烧伤治疗。 通过经由粘合层将铁基基材（c）和烧成片8（a）接合，然后烧成该预粘合体而制造另一种烧制图案。 高浓度 的氧化铝通过烘烤铁基底而形成在铁型基底的表面上。 Al，从而形成氧化铝。 除了无机粉末以外，烧成片还可以含有金属，合金或金属或合金氧化物或无机着色剂如二氧化硅，CaCO 3，TiO 2，氧化锆，CaO，氧化铝等的粉末或纤维。树脂粘合剂是烃树脂， 缩醛树脂或丙烯酸树脂（丙烯酸树脂）。
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公开(公告)号：EP2868642A4
公开(公告)日：2016-03-09
申请号：EP13809977
申请日：2013-06-26
申请人： TOSOH CORP
发明人： YAMASHITA ISAO , IMAI KOHEI , YAMAUCHI SHOICHI , TSUKUMA KOJI
CPC分类号： B32B18/00 , B32B5/16 , B32B7/12 , B32B15/16 , B32B15/20 , B32B17/06 , B32B37/12 , B32B37/18 , B32B2264/102 , B32B2307/306 , B32B2307/4026 , B32B2307/54 , B32B2307/554 , B32B2307/558 , B32B2307/72 , B32B2439/00 , B32B2457/00 , C04B35/486 , C04B35/4885 , C04B35/63452 , C04B35/645 , C04B37/008 , C04B37/028 , C04B37/047 , C04B2235/3217 , C04B2235/3222 , C04B2235/3224 , C04B2235/3225 , C04B2235/3248 , C04B2235/3262 , C04B2235/3272 , C04B2235/3275 , C04B2235/3279 , C04B2235/3418 , C04B2235/6562 , C04B2235/77 , C04B2235/96 , C04B2235/9661 , C04B2237/348 , C04B2237/40 , C04B2237/401 , C04B2237/70 , C04B2237/704 , C04B2237/706 , C04B2237/708 , G04B37/22 , H04M1/0202 , H05K5/02 , Y10T428/1317 , Y10T428/24967
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5.发明公开A method for making a glass supported system, such glass supported system, and the use of a glass support therefor 审中-公开Verfahren zur Herstellung einesglasgestütztenSystems，glasgestütztesSystem und Verwendung einerGlasstützedafür
公开(公告)号：EP2112130A1
公开(公告)日：2009-10-28
申请号：EP08007746.4
申请日：2008-04-22
发明人： Unnikrishnan, Sandeep , Jansen, Henricus Venantius , Berenschot, Johan Willem , Fazal, Imran , Louwerse, Marcus Cornelis , Mogulkoc, Berker , Sanders, Remco , De Boer, Meint Jelle , Elwenspoek, Michael Curt
CPC分类号： C04B37/001 , C03C27/00 , C04B35/634 , C04B37/042 , C04B37/045 , C04B37/047 , C04B2235/656 , C04B2235/6567 , C04B2237/32 , C04B2237/343 , C04B2237/52 , C04B2237/62 , C04B2237/708 , C04B2237/765
摘要： The invention relates to a method for making a glass supported micro or nano system, comprising the steps of:
i) providing a glass support;
ii) mounting at least one system on at least one glass support; and
iii) bonding the system to the glass support, such that the system is circumferentially supported within the confinement of the glass support, to a glass supported system, and to the use of a glass support therefor.摘要翻译： 本发明涉及一种制备玻璃支撑的微米或纳米系统的方法，包括以下步骤：i）提供玻璃支撑体; ii）将至少一个系统安装在至少一个玻璃支架上; 以及iii）将系统粘合到玻璃支撑件上，使得该系统在玻璃支撑件的限制，玻璃支撑系统的周边支撑，以及使用其玻璃支撑件。
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6.发明公开METHOD FOR MANUFACTURING CERAMIC MULTILAYERED BOARD 有权VERFAHREN ZUR HERSTELLUNG EINER KERAMISCHEN MEHRSCHICHIGGEN LEITERPLATTE
公开(公告)号：EP1392093A4
公开(公告)日：2004-12-15
申请号：EP02771763
申请日：2002-05-21
CPC分类号： B32B18/00 , C04B35/6342 , C04B35/63424 , C04B35/638 , C04B35/645 , C04B37/008 , C04B37/047 , C04B2235/6567 , C04B2235/6581 , C04B2235/963 , C04B2237/34 , C04B2237/341 , C04B2237/343 , C04B2237/68 , C04B2237/70 , C04B2237/704 , C04B2237/708 , H01L21/4857 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K3/386 , H05K3/4611 , H05K3/4667 , H01L2924/00
摘要： A manufacturing method including the step of forming an adhesive layer (12) over the surface of a ceramic substrate (11) enables the manufacture of a ceramic multilayered circuit board of a high dimensional precision comprising a monolithic block of the ceramic substrate (11) and a ceramic green sheet (14) with almost no in−plane shrinkage after baking.
摘要翻译： 包括在陶瓷衬底（11）的表面上形成粘合层（12）的步骤的制造方法能够制造包括陶瓷衬底（11）的整体块的高尺寸精度的陶瓷多层电路板和 陶瓷生片（14）在烘烤后几乎没有面内收缩。
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公开(公告)号：EP2678145A4
公开(公告)日：2015-05-13
申请号：EP12749635
申请日：2012-02-24
申请人： SCHOTT CORP
发明人： LEIGHTON KATHERINE T , ALESHIRE EDGAR L , WEGERT THEODORE A , SERAFIN WIKTOR , SNIVELY CHRISTOPHER M , CARBERRY JOHN , URRUTI ERIC , NEILL REBECCA S
CPC分类号： B32B18/00 , B32B17/10018 , B32B17/10036 , B32B17/10302 , B32B17/10761 , B32B17/1077 , B32B27/365 , B32B2307/412 , B32B2369/00 , C04B35/63408 , C04B35/6342 , C04B35/63424 , C04B35/63456 , C04B35/63488 , C04B37/008 , C04B37/028 , C04B37/047 , C04B2235/32 , C04B2235/483 , C04B2235/6581 , C04B2235/9653 , C04B2237/34 , C04B2237/341 , C04B2237/346 , C04B2237/36 , C04B2237/366 , C04B2237/368 , C04B2237/402 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/407 , C04B2237/704 , C04B2237/706 , C04B2237/72 , C04B2237/80 , F41H5/0407 , Y10T428/23 , Y10T428/239 , Y10T428/31507
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8.发明公开
公开(公告)号：EP2868642A1
公开(公告)日：2015-05-06
申请号：EP13809977.5
申请日：2013-06-26
申请人： Tosoh Corporation
发明人： YAMASHITA, Isao , IMAI, Kohei , YAMAUCHI, Shoichi , TSUKUMA, Koji
CPC分类号： B32B18/00 , B32B5/16 , B32B7/12 , B32B15/16 , B32B15/20 , B32B17/06 , B32B37/12 , B32B37/18 , B32B2264/102 , B32B2307/306 , B32B2307/4026 , B32B2307/54 , B32B2307/554 , B32B2307/558 , B32B2307/72 , B32B2439/00 , B32B2457/00 , C04B35/486 , C04B35/4885 , C04B35/63452 , C04B35/645 , C04B37/008 , C04B37/028 , C04B37/047 , C04B2235/3217 , C04B2235/3222 , C04B2235/3224 , C04B2235/3225 , C04B2235/3248 , C04B2235/3262 , C04B2235/3272 , C04B2235/3275 , C04B2235/3279 , C04B2235/3418 , C04B2235/6562 , C04B2235/77 , C04B2235/96 , C04B2235/9661 , C04B2237/348 , C04B2237/40 , C04B2237/401 , C04B2237/70 , C04B2237/704 , C04B2237/706 , C04B2237/708 , G04B37/22 , H04M1/0202 , H05K5/02 , Y10T428/1317 , Y10T428/24967
摘要： [Problem] To provide a composite plate comprising a zirconia sintered body and a base material, or a zirconia sintered body and a base material comprising at least one among a group includes strengthened glass, Bakelite, aluminum, andmagnesium, said composite plate being capable of being suitably used in a case or a watch member, etc, for a mobile electronic device that is light weight and has excellent shock resistance and abrasion resistance.
[Solution] A composite plate having a thickness of no more than 2 mm, and having laminated therein a zirconia sintered body, an adhesive layer, and a base material, the elasticity of the base material being no more than 100 GPa, and the apparent density of the composite plate being no more than 4.3 g/cm 3 ; or a composite plate having a thickness of no more than 2 mm and includes, laminated in order, a zirconia sintered body, an adhesive layer, and a base material includes at least one type among a group includes strengthened glass, Bakelite, aluminum, andmagnesium, the thickness ratio (zirconia sintered body thickness/base material thickness) between the zirconia sintered body and the base material being 0.1-1, and the apparent density of the composite plate being no more than 4.3 g/cm 3 .摘要翻译： 本发明提供一种包含氧化锆烧结体和基材的复合板，或氧化锆烧结体和包括强化玻璃，酚醛树脂，铝和镁中的至少一种的基材，所述复合板能够 适用于手机或手表部件等，重量轻且具有优异的抗冲击性和耐磨性的移动电子设备。 [解决方案]将厚度不大于2mm的层叠有氧化锆烧结体，粘合剂层和基材的复合板，基材的弹性为100GPa以下，表观密度 复合板的密度不超过4.3g / cm 3; 或厚度不大于2mm的复合板，依次层叠，氧化锆烧结体，粘合剂层和基材包括强化玻璃，酚醛树脂，铝和镁中的至少一种 ，氧化锆烧结体与基材的厚度比（氧化锆烧结体厚/基材厚度）为0.1〜1，复合板的表观密度为4.3g / cm 3以下。
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公开(公告)号：EP2678145A1
公开(公告)日：2014-01-01
申请号：EP12749635.4
申请日：2012-02-24
申请人： Schott Corporation
发明人： LEIGHTON, Katherine, T. , ALESHIRE, Edgar, L. , WEGERT, Theodore, A. , SERAFIN, Wiktor , SNIVELY, Christopher, M. , CARBERRY, John , URRUTI, Eric , NEILL, Rebecca, S.
CPC分类号： B32B18/00 , B32B17/10018 , B32B17/10036 , B32B17/10302 , B32B17/10761 , B32B17/1077 , B32B27/365 , B32B2307/412 , B32B2369/00 , C04B35/63408 , C04B35/6342 , C04B35/63424 , C04B35/63456 , C04B35/63488 , C04B37/008 , C04B37/028 , C04B37/047 , C04B2235/32 , C04B2235/483 , C04B2235/6581 , C04B2235/9653 , C04B2237/34 , C04B2237/341 , C04B2237/346 , C04B2237/36 , C04B2237/366 , C04B2237/368 , C04B2237/402 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/407 , C04B2237/704 , C04B2237/706 , C04B2237/72 , C04B2237/80 , F41H5/0407 , Y10T428/23 , Y10T428/239 , Y10T428/31507
摘要： A transparent laminate structure is provided that includes two transparent layers, a transparent interlayer, and an inorganic barrier layer. The two transparent layers each have an inner face and a side edge. The transparent interlayer is between and laminates the inner faces of the two transparent layers to one another. The transparent interlayer also extends over the side edges of the two transparent layers and laminates the inorganic barrier layer to at least the side edges of the two transparent layers.
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公开(公告)号：EP1392093B1
公开(公告)日：2006-04-05
申请号：EP02771763.6
申请日：2002-05-21
CPC分类号： B32B18/00 , C04B35/6342 , C04B35/63424 , C04B35/638 , C04B35/645 , C04B37/008 , C04B37/047 , C04B2235/6567 , C04B2235/6581 , C04B2235/963 , C04B2237/34 , C04B2237/341 , C04B2237/343 , C04B2237/68 , C04B2237/70 , C04B2237/704 , C04B2237/708 , H01L21/4857 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K3/386 , H05K3/4611 , H05K3/4667 , H01L2924/00
摘要： A manufacturing method including the step of forming an adhesive layer (12) over the surface of a ceramic substrate (11) enables the manufacture of a ceramic multilayered circuit board of a high dimensional precision comprising a monolithic block of the ceramic substrate (11) and a ceramic green sheet (14) with almost no in−plane shrinkage after baking.
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