COMPOSITION FOR POLISHING
    4.
    发明公开
    COMPOSITION FOR POLISHING 审中-公开
    ZUSAMMENSETZUNG ZUM POLIEREN

    公开(公告)号:EP3211053A4

    公开(公告)日:2017-09-06

    申请号:EP15852540

    申请日:2015-10-15

    申请人: FUJIMI INC

    摘要: Provided is a polishing composition capable of keeping a good polishing removal rate stably. The polishing composition includes silica particles as abrasives and a basic compound as a polishing removal accelerator. The silica particles have a density of silanol groups that is 1.5 to 6.0 pieces/nm 2 . The polishing composition has an adsorption ratio parameter A that is 1.2 or less, the adsorption ratio parameter representing concentration dependency of an amount of adsorption of the basic compound to the silica particles as the ratio of high-concentration adsorption amount/low-concentration adsorption amount.

    摘要翻译: 本发明提供能够稳定地保持良好的研磨去除率的研磨用组合物。 研磨用组合物含有作为研磨材料的二氧化硅粒子和作为研磨除去促进剂的碱性化合物。 二氧化硅粒子的硅烷醇基的密度为1.5〜6.0个/ nm 2。 研磨用组合物的吸附率参数A为1.2以下,吸附率参数表示碱性化合物相对于二氧化硅粒子的吸附量的浓度依赖性,作为高浓度吸附量/低浓度吸附量 。

    COMPOSITION FOR POLISHING
    5.
    发明公开
    COMPOSITION FOR POLISHING 审中-公开
    抛光组合物

    公开(公告)号:EP3211053A1

    公开(公告)日:2017-08-30

    申请号:EP15852540.2

    申请日:2015-10-15

    摘要: Provided is a polishing composition capable of keeping a good polishing removal rate stably. The polishing composition includes silica particles as abrasives and a basic compound as a polishing removal accelerator. The silica particles have a density of silanol groups that is 1.5 to 6.0 pieces/nm 2 . The polishing composition has an adsorption ratio parameter A that is 1.2 or less, the adsorption ratio parameter representing concentration dependency of an amount of adsorption of the basic compound to the silica particles as the ratio of high-concentration adsorption amount/low-concentration adsorption amount.

    摘要翻译: 本发明提供能够稳定地保持良好的研磨去除率的研磨用组合物。 研磨用组合物含有作为研磨材料的二氧化硅粒子和作为研磨除去促进剂的碱性化合物。 二氧化硅粒子的硅烷醇基的密度为1.5〜6.0个/ nm 2。 研磨用组合物的吸附率参数A为1.2以下,吸附率参数表示碱性化合物相对于二氧化硅粒子的吸附量的浓度依赖性,作为高浓度吸附量/低浓度吸附量 。