公开(公告)号：EP3271938A2

公开(公告)日：2018-01-24

申请号：EP16706510.1

申请日：2016-02-15

申请人： Pac Tech - Packaging Technologies GmbH

发明人： LÜDEKE, Heinrich ,  GEELHAAR, Ricardo

IPC分类号： H01L21/60 ,  H01L23/488 ,  B23K26/20

CPC分类号： H01L24/48 ,  B23K26/20 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/77 ,  H01L24/81 ,  H01L24/84 ,  H01L24/85 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/16225 ,  H01L2224/37026 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/40225 ,  H01L2224/40491 ,  H01L2224/40992 ,  H01L2224/40997 ,  H01L2224/4112 ,  H01L2224/45005 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48839 ,  H01L2224/48847 ,  H01L2224/73255 ,  H01L2224/77263 ,  H01L2224/77281 ,  H01L2224/77601 ,  H01L2224/77611 ,  H01L2224/77704 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/84214 ,  H01L2224/84424 ,  H01L2224/84439 ,  H01L2224/84444 ,  H01L2224/84447 ,  H01L2224/84455 ,  H01L2224/84464 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/84986 ,  H01L2224/85051 ,  H01L2224/85203 ,  H01L2224/85214 ,  H01L2224/85379 ,  H01L2224/8584 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2224/13099

摘要： The invention relates to a chip arrangement (10) and a method for forming a contact connection (11) between a chip (18), in particular a power transistor or the like, and a conductor material strip (14), said conductor material strip being formed on a non-conductive substrate (12) and the chip being arranged on the substrate or on a conductor material strip (15). A silver paste (29) or copper paste is applied to a chip contact surface (25) of the chip and of the conductor material strip (28), a contact conductor (30) is dipped into the silver paste or the copper paste on the chip contact surface and into the silver paste or the copper paste on the conductor material strip, and a solvent contained in the silver paste or the copper paste is at least partially evaporated by heating. The silver paste or the copper paste is then sintered by means of laser energy, thereby forming the contact connection.