公开(公告)号：EP3001783A4

公开(公告)日：2017-01-11

申请号：EP13885129

申请日：2013-05-20

申请人： MEIKO ELECTRONICS CO LTD

发明人： TODA MITSUAKI ,  MATSUMOTO TOHRU ,  SHIMIZU RYOICHI

IPC分类号： H01L23/12 ,  H01L23/28

CPC分类号： H01L23/5389 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3107 ,  H01L23/5384 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/2402 ,  H01L2224/24247 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/75745 ,  H01L2224/82001 ,  H01L2224/8201 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82986 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3641 ,  H05K1/188 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/40252 ,  H01L2924/40501 ,  H01L2924/403 ,  H01L2924/07802 ,  H01L2924/00014

公开(公告)号：EP3001783A1

公开(公告)日：2016-03-30

申请号：EP13885129.0

申请日：2013-05-20

申请人： Meiko Electronics Co., Ltd.

发明人： TODA, Mitsuaki ,  MATSUMOTO, Tohru ,  SHIMIZU, Ryoichi

IPC分类号： H05K3/46 ,  H01L23/12 ,  H01L23/28

CPC分类号： H01L23/5389 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3107 ,  H01L23/5384 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/2402 ,  H01L2224/24247 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/75745 ,  H01L2224/82001 ,  H01L2224/8201 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82986 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3641 ,  H05K1/188 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/40252 ,  H01L2924/40501 ,  H01L2924/403 ,  H01L2924/07802 ,  H01L2924/00014

摘要： A device embedded substrate (1) includes: an insulating layer (3); a first metal layer (4) and a second metal layer (5) that are formed such that the insulating layer (3) is sandwiched therebetween; a device (2) that is embedded in the insulating layer (3), and in which a connection terminal non-formation surface (2c) where a connection terminal (2a) is not formed is located on a side close to the first metal layer (4); an adhesive layer (6) that is located on the connection terminal non-formation surface (2c) of the device (2); and a conductive via (7) that electrically connects the second metal layer (5) and the connection terminal (2a) of the device (2), wherein an area of the adhesive layer (6) on a surface side in contact with the device (2) is smaller than an area of the connection terminal non-formation surface (2c) of the device (2).

摘要翻译： 一种器件嵌入式衬底（1）包括：绝缘层（3）; 形成为使绝缘层（3）夹在其间的第一金属层（4）和第二金属层（5） 嵌入在绝缘层（3）中的未形成有连接端子（2a）的连接端子非形成面（2c）的装置（2）位于靠近第一金属层的一侧 （4）; 位于所述装置（2）的所述连接端子非形成表面（2c）上的粘合层（6）; 以及电连接所述第二金属层（5）和所述装置（2）的连接端子（2a）的导电通孔（7），其中所述粘合剂层（6）在与所述装置 （2）的面积比装置（2）的连接端子非形成面（2c）的面积小。