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    BARE DIE INTEGRATION WITH PRINTED COMPONENTS
    6.
    发明公开
    BARE DIE INTEGRATION WITH PRINTED COMPONENTS 审中-公开
    BARE DIE与印刷组件的集成

    公开(公告)号：EP3188220A2

    公开(公告)日：2017-07-05

    申请号：EP16202082.0

    申请日：2016-12-02

    申请人： Palo Alto Research Center, Incorporated

    发明人： NG, Tse Nga ,  MEI, Ping ,  KRUSOR, Brent S. ,  WHITING, Gregory L. ,  READY, Steven E. ,  VERES, Janos

    IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/48

    CPC分类号： H05K1/028 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24991 ,  H01L2224/76151 ,  H01L2224/76155 ,  H01L2224/76252 ,  H01L2224/82051 ,  H01L2224/82181 ,  H01L2224/8285 ,  H01L2224/82986 ,  H05K1/0326 ,  H05K1/185 ,  H05K3/14

    摘要： Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer (302A). Then an electronic circuit component (304A) is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component (304A) is positioned into contact with the tacky layer (302A). A bonding material (306A) is then deposited to a portion of the adhesive layer (302A) that is not covered by the first side of the electronic circuit component (304A), to a depth which is sufficient to cover at least a portion of the electronic circuit component (304A). The bonding material (306A) is then fixed or cured into a fixed or cured bonding material, and the tacky layer (302A) is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material (306A), and circuit connections (308B) may be made.

    摘要翻译： 提供用于电子电路组件的制造工艺，以形成电子组件，所述电子电路组件例如裸管芯和封装集成芯片等。 电子电路部件的表面承载电子元件，例如导电迹线和/或包括接触垫的其它构造。 形成电子组件的方法包括提供粘性层（302A）。 然后提供具有第一侧和第二侧的电子电路组件（304A），其中第一侧承载电子元件。 电子电路部件（304A）的第一侧被定位成与发粘层（302A）接触。 然后将结合材料（306A）沉积到未被电子电路部件（304A）的第一侧所覆盖的粘合剂层（302A）的一部分，深度足以覆盖至少一部分 电子电路组件（304A）。 然后将结合材料（306A）固定或固化成固定或固化的结合材料，并且去除发粘层（302A）。 通过这些操作，电子电路部件通过固定或固化的结合材料（306A）保持固定连接，并且可以形成电路连接（308B）。