公开(公告)号：EP2777092B1

公开(公告)日：2018-05-23

申请号：EP12798343.5

申请日：2012-11-05

Applicant: Radio Design Limited

Inventor： SLEIGH, Philip ,  GOSTLING, Martin

IPC: H01Q1/24 ,  H03H7/46 ,  H01P1/213

CPC classification number: H03H7/463 ,  H03H7/52 ,  H04B1/52

Abstract: This invention relates to combining apparatus for apparatus which is used for the transmission and/or receiving of data signals in, for example, a wireless communication network. The combining apparatus ensures the required isolation and separation of the frequency sub bands used for the transmission of signals from a plurality of base transceiver stations and ensures that all received signals in a predetermined frequency band within which the sub bands are located are made available for use as required by the said base transceiver stations while, at the same time, allowing the required performance, size and/or expense of the filters used in the combining apparatus to be reduced.

公开(公告)号：EP3208883A1

公开(公告)日：2017-08-23

申请号：EP17155007.2

申请日：2017-02-07

Applicant: Thomson Licensing

Inventor： KNUTSON, Paul

IPC: H01P1/213 ,  H03H7/01

CPC classification number: H04B1/0057 ,  H01P1/213 ,  H03H7/463 ,  H04B1/006 ,  H04L12/66 ,  H04N7/17309 ,  H04N21/6118 ,  H04N21/6168

Abstract: A communication device comprises a processor; and a diplexer comprising a low pass filter passing signals with frequency below a first frequency threshold, the low pass filter having a first input and a first output, and a second filter being one of a high pass filter and a band pass filter passing signals with frequency above a second frequency threshold, the second filter having a second input and a second output; and a switch controllable by the processor for connecting the second input to a termination in a first state and connecting the second input to the first input in a second state responsive to a control signal from the processor, wherein the first output is coupled to the second output and the first input is configured to receive an input signal having a frequency range covering at least the first frequency threshold.

Abstract translation: 通信设备包括处理器; 以及双工器，其包括使低于第一频率阈值的频率的信号通过的低通滤波器，所述低通滤波器具有第一输入和第一输出，以及第二滤波器是高通滤波器和带通滤波器中的一个， 频率高于第二频率阈值，所述第二滤波器具有第二输入和第二输出; 以及可由所述处理器控制的开关，用于响应于来自所述处理器的控制信号而将所述第二输入连接到处于第一状态的终端并将所述第二输入连接到处于第二状态的所述第一输入，其中所述第一输出耦合到所述第二 输出，并且第一输入被配置为接收具有覆盖至少第一频率阈值的频率范围的输入信号。

公开(公告)号：EP3166225A1

公开(公告)日：2017-05-10

申请号：EP16197736.8

申请日：2016-11-08

Applicant: Handy International Co., Ltd.

Inventor： Tajima, Motoyuki ,  Sato, Takahiro

IPC: H03H9/72 ,  H04B1/52 ,  H03H7/46 ,  H03H9/70

CPC classification number: H01P5/19 ,  H01Q1/50 ,  H03H7/463 ,  H03H9/706 ,  H03H9/725 ,  H04B1/52 ,  H04L5/14 ,  H05K1/0237 ,  H05K1/111

Abstract: Disclosed herein is a duplexer device having a plurality of duplexers mounted on a substrate for mounting a duplexer, for achieving an excellent isolation characteristic. The duplexer device includes a substrate for mounting a duplexer, the substrate having a rectangular shape including a first side, a second side neighboring the first side and connected to the first side, a third side facing the second side and neighboring the first side, and a fourth side connected to the second and the third sides and facing the first side, and a plurality of pads being formed on a surface of the substrate; a first duplexer configured to be mounted on the substrate for mounting a duplexer and to include a first antenna terminal, a first transmission terminal and a first reception terminal; and a second duplexer configured to be mounted on the substrate for mounting a duplexer and to include a second antenna terminal, a second transmission terminal and a second reception terminal. The first antenna terminal and the second antenna terminal are electrically connected to pads for an antenna, respectively, which belong to the plurality of pads and are disposed along the first side. The first reception terminal and the second reception terminal are electrically connected to pads for reception, respectively, which belong to the plurality of pads and are disposed along the second side. The first transmission terminal and the second transmission terminal are electrically connected to pads for transmission, respectively, which belong to the plurality of pads and are disposed along the third side.

Abstract translation: 本文公开了一种双工器装置，其具有安装在用于安装双工器的基板上的多个双工器，以实现优异的隔离特性。 所述双工器装置包括用于安装双工器的基板，所述基板具有矩形形状，所述矩形包括第一侧，与所述第一侧相邻且与所述第一侧相连的第二侧，面向所述第二侧并与所述第一侧相邻的第三侧，以及 连接到所述第二侧和所述第三侧并且面向所述第一侧的第四侧，以及在所述基板的表面上形成的多个焊盘; 第一双工器，被配置为安装在基板上用于安装双工器并且包括第一天线端子，第一发送端子和第一接收端子; 以及第二双工器，被配置为安装在用于安装双工器的基板上并且包括第二天线端子，第二发送端子和第二接收端子。 第一天线端子和第二天线端子分别电连接到属于多个焊盘并且沿着第一侧布置的用于天线的焊盘。 第一接收端子和第二接收端子分别电连接到属于多个焊盘并且沿着第二侧布置的用于接收的焊盘。 第一传输端子和第二传输端子分别电连接到属于多个焊盘并且沿着第三侧布置的用于传输的焊盘。

公开(公告)号：EP2963731A4

公开(公告)日：2016-10-12

申请号：EP14756716

申请日：2014-02-24

Applicant: KYOCERA CORP

Inventor： YOSHIKAWA HIROMICHI ,  HORIUCHI MASAFUMI ,  NAKAMATA KATSURO

IPC: H01P1/205 ,  H01P1/213

CPC classification number: H01P1/2002 ,  H01P1/2056 ,  H01P1/2136 ,  H01P7/04 ,  H01Q1/50 ,  H03H7/463

Abstract: There are provided a dielectric filter with excellent electrical characteristics, a duplexer, and a communication device using the dielectric filter. A dielectric filter includes a dielectric block (30) provided with first through holes (31a-31g); inner conductors (41a-41g) disposed on inner surfaces of the first through holes (31a-31g); second through holes (32a-32f); a terminal electrode (51a) connected to an inner conductor (41a) located at on end; a terminal electrode (51b) connected to an inner conductor (41g) located at the other end; and an outer conductor (21a, 21b) surrounding the dielectric block (30), being connected to a reference potential, wherein the first through holes (31a-31g) are located on a second main surface (30b) side, and the second through holes (32a-32f) are located on a first main surface (30a) side with respect to the first through holes (31a-31g). A duplexer and a communication device use this dielectric filter.

公开(公告)号：EP3005562A1

公开(公告)日：2016-04-13

申请号：EP14734338.8

申请日：2014-06-02

Applicant: Qualcomm Incorporated

Inventor： ZUO, Chengjie ,  KIM, Jonghae ,  KIM, Daeik, D. ,  VELEZ, Mario, Francisco ,  YUN, Changhan ,  LAN, Je-Hsiung ,  MIKULKA, Robert, P. ,  NOWAK, Matthew, M.

IPC: H03H7/46

CPC classification number: H03H7/463 ,  H03H3/00 ,  Y10T29/4902

Abstract: Systems for reducing magnetic coupling in integrated circuits (ICs) are disclosed. Related components and methods are also disclosed. The ICs have a plurality of inductors. Each inductor generates a magnetic flux that has a discernible axis. To reduce magnetic coupling between the inductors, the flux axes are designed so as to be non-parallel. In particular, by making the flux axes of the inductors non-parallel to one another, magnetic coupling between the inductors is reduced relative to the situation where the flux axes are parallel. This arrangement may be particularly well suited for use in diplexers having a low pass and a high pass filter.

公开(公告)号：EP2995002A1

公开(公告)日：2016-03-16

申请号：EP14728764.3

申请日：2014-05-02

Applicant: Qualcomm Incorporated

Inventor： ZUO, Chengjie ,  KIM, Daeik, D. ,  LAN, Je-Hsiung ,  KIM, Jonghae ,  VELEZ, Mario, Francisco ,  YUN, Changhan ,  BERDY, David, F. ,  MIKULKA, Robert, P. ,  NOWAK, Matthew, M. ,  ZHANG, Xiangdong ,  SEE, Puay, H.

IPC: H03H7/46

CPC classification number: H03H7/461 ,  H03H3/00 ,  H03H7/0115 ,  H03H7/463 ,  Y10T29/49016

Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.

公开(公告)号：EP2838195A1

公开(公告)日：2015-02-18

申请号：EP13180416.3

申请日：2013-08-14

Applicant: NXP B.V.

Inventor： van der Heijden, Mark

IPC: H03F3/217 ,  H03F1/02 ,  H03F1/56

CPC classification number: H03F3/68 ,  H01L2224/49113 ,  H01L2224/49175 ,  H03F1/0294 ,  H03F1/565 ,  H03F3/2176 ,  H03F2200/387 ,  H03F2200/391 ,  H03F2203/21139 ,  H03H7/463

Abstract: Lumped-element (L E , C E , L CHIR , C CHIR ) based class-E Chireix combiners are disclosed that are equivalents of a quarter-wave transmission line combiner. The proposed class-E equivalent power amplifier circuits that are used can be derived from a parallel tuned class-E implementation. The proposed low-pass equivalents can behave similarly in terms of class-E performance, but absorb the 90 degree transmission line.

Abstract translation: 公开了基于类别E Chireix组合器的集总元件（L E，C E，L CHIR，C CHIR），它们是四分之一波长传输线组合器的等同物。 所使用的所提出的E类等效功率放大器电路可以从并行调谐的E类实现中导出。 所提出的低通等效物可以在E级性能方面表现相似，但吸收90度传输线。

公开(公告)号：EP2797162A1

公开(公告)日：2014-10-29

申请号：EP14171885.8

申请日：2010-02-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wang, Haizhao ,  Si, Guangfu ,  Meng, Naier ,  Yang, Bo ,  Zhou, Puke ,  Guo, Shengxiang ,  Zhang, Yi ,  Sun, Weihua ,  Zhou, Jianjun ,  Zhang, Ke ,  Li, Hao ,  Zhang, Zhiwei ,  Zhang, Runxiao

IPC: H01P1/213 ,  H01P11/00 ,  H01L23/427 ,  H05K7/00

CPC classification number: H03H7/463 ,  H01P1/213 ,  H01P1/2136 ,  H01P1/2138 ,  H01P11/007 ,  H05K7/20409

Abstract: The present disclosure relates to telecommunication, and in particular, to a base station Radio Frequency (RF) duplexer, an RF module, and an RF system. A base station RF apparatus provided herein includes: an enclosure, an intermediate RF processing unit, and a duplexer. The enclosure is located on the duplexer; the intermediate RF processing unit is located inside a cavity enclosed by the enclosure and the duplexer, or on the duplexer; a duplexer cavity and a heat dissipation part exist on the surface of the duplexer; the opening of the duplexer cavity is opposite to or against the enclosure; the heat dissipation part is designed to dissipate heat of the intermediate RF processing unit; and the duplexer is integrally molded. The foregoing technical solution requires no external fasteners, reduces the time of production and assembly. In addition, waterproof design and shielding design are not required, and thus improves the reliability.

Abstract translation: 本公开涉及电信，特别是涉及一种基站射频（RF）双工器，RF模块和RF系统。 本文提供的基站RF装置包括：外壳，中间RF处理单元和双工器。 外壳位于双工器上; 中间RF处理单元位于由外壳和双工器包围的腔内，或位于双工器上; 在双工器的表面上存在双工器腔和散热部分; 双工器腔的开口与外壳相对或相对; 散热部分设计用于散发中间RF处理单元的热量; 双工器整体模制。 上述技术方案不需要外部紧固件，减少生产和组装的时间。 另外，不需要防水设计和屏蔽设计，从而提高了可靠性。

公开(公告)号：EP2566050A1

公开(公告)日：2013-03-06

申请号：EP11774883.0

申请日：2011-04-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： TAKEUCHI Morio

IPC: H03H7/46 ,  H03H9/72 ,  H04B1/38

CPC classification number: H03H7/0138 ,  H03H7/463 ,  H03H9/0576 ,  H03H9/725 ,  H04B1/44

Abstract: To reduce unnecessary interference occurring between various types of signals.
A circuit substrate (10) where a duplexer is mounted. A substrate body (12) includes main surfaces (S1, S2). External electrodes (14a to 14c) are provided in the main surface (S1). External electrodes (16a to 16c) are provided in the main surface (S2). Signal paths (SL1 to SL3) connect the external electrodes (14a to 14c) to the external electrodes (16a to 16c), respectively. Ground conductors (22a, 22b) are embedded in the substrate body (12), and overlap with a mounting area (R) so as to contain the mounting area (R) where the duplexer is mounted, in a planar view seen from the z-axis direction. In a planar view seen from the z-axis direction, the signal paths (SL1 to SL3) extend from the inside of the mounting area (R) to the outside of the mounting area (R) between the main surface (S1) and the ground conductor (22b), pass through the outside of the mounting area (R), and are connected to the external electrodes (16a to 16c), respectively.

Abstract translation: 减少各种信号之间发生的不必要的干扰。 安装双工器的电路基板（10）。 衬底主体（12）包括主表面（S1，S2）。 外部电极（14a至14c）设置在主表面（S1）中。 在主表面（S2）中设置有外部电极（16a〜16c）。 信号路径（SL1〜SL3）分别将外部电极（14a〜14c）与外部电极（16a〜16c）连接。 接地导体（22a，22b）嵌入在基板主体（12）中，并且与安装区域（R）重叠，以便在从z看到的平面视图中包含安装双工器的安装区域（R） 方向。 在从z轴方向观察的平面图中，信号路径（SL1〜SL3）从安装区域（R）的内部延伸到主表面（S1）与安装区域 接地导体（22b）穿过安装区域（R）的外部，分别连接到外部电极（16a至16c）。

公开(公告)号：EP2421151A3

公开(公告)日：2012-10-10

申请号：EP11177704.1

申请日：2011-08-16

Applicant: NTT DoCoMo, Inc.

Inventor： Fukuda, Atsushi ,  Okazaki, Hiroshi ,  Narahashi, Shoichi

IPC: H03H7/38 ,  H03H7/46 ,  H03F1/56

CPC classification number: H03H7/38 ,  H03F3/19 ,  H03F3/245 ,  H03F3/60 ,  H03F2200/111 ,  H03F2200/171 ,  H03F2200/387 ,  H03F2200/414 ,  H03F2200/417 ,  H03H7/463 ,  H03H2007/386

Abstract: A multiband matching circuit of the present invention includes an inductive element (42) having one end connected to an input terminal (P2), a first switch (SWL) having one end connected to the other end of the inductive element and the other end grounded, a capacitive element (41) having one end connected to the input terminal (P2), a second switch (SWH) having one end connected to the other end of the capacitive element and the other end grounded, a first-band matching circuit (10L) that is connected between the other end of the inductive element (42) and a first output terminal (P1L) and performs impedance matching in a first frequency band, and a second-band matching circuit (10H) that is connected between the other end of the capacitive element (41) and a second output terminal (P1H) and performs impedance matching in a second frequency band higher than the first frequency band.