公开(公告)号：EP1419679A1

公开(公告)日：2004-05-19

申请号：EP02766025.7

申请日：2002-08-16

Applicant: Raytheon Company

Inventor： DEARDEN, Timothy E.,Raytheon Company ,  STITT, Jeffrey J.,Raytheon Company ,  QUAN, Clifton,Raytheon Company

IPC: H05K1/18 ,  H05K3/32 ,  H01L23/66

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10348 ,  H05K2201/10371 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2203/1147

Abstract: An RF interconnect is incorporated in RF module packages (50) for direct attachment onto a multi-layer PWB (100) using compressible center conductor (fuzz button) interconnects. The module has circuitry operating at microwave frequencies. The module package includes a metal housing (52) including a metal bottom wall structure (54). The module includes a plurality of RF interconnects, which provide RF interconnection between the package (50) and the PWB (100). Each interconnect includes a feedthrough center pin (72) protruding through an opening formed in the metal bottom wall, with isolation provided by a dielectric feedthrough insulator (74). The center pin is surrounded with a ring of shield pins (76) attached to the external surface of the bottom wall of the module housing. The pins are insertable in holes (116a, 116b) formed in the PWB (100), and make contact with fuzz button interconnects (130, 132) disposed in the holes (116a, 116b). Circuitry (148, 150) connects the fuzz button interconnects (130, 132) to appropriate levels (120, 122, 124) of the PWB signal conduction.

公开(公告)号：EP1642484A1

公开(公告)日：2006-04-05

申请号：EP03738850.1

申请日：2003-07-07

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (publ)

Inventor： NILSSON, Mattias ,  JOHANSSON, Stefan

IPC: H05K3/36 ,  H05K3/40

CPC classification number: H05K3/368 ,  G01R31/046 ,  H05K1/0268 ,  H05K1/117 ,  H05K3/325 ,  H05K3/4614 ,  H05K2201/10348 ,  H05K2201/10378 ,  H05K2203/162

Abstract: A retainer board (25, 27, 28) having at least one hole (10) in which a wire button contact (5) is inserted, wherein the hole (10) is plated and at least one conductor (20) is connected to the plated hole for providing outside access. Moreover a method for testing stacked circuit boards are disclosed comprising the steps of detachably arranging at least two circuits boards (11, 12, 29), testing the individual functionality of the circuit boards (11, 12) and if approved, assembling the circuit boards (11, 12) and the first retainer board (25, 27, 28), and asserting whether the overall functionality of the arrangement is approved.