PHENOL RESIN COMPOSITION, PROCESS FOR PRODUCTION THEREOF, CURABLE RESIN COMPOSITION, CURED PRODUCTS TEHREOF, AND PRINTED WIRING BOARD
    7.
    发明公开
    PHENOL RESIN COMPOSITION, PROCESS FOR PRODUCTION THEREOF, CURABLE RESIN COMPOSITION, CURED PRODUCTS TEHREOF, AND PRINTED WIRING BOARD 审中-公开
    PHENOLHARZZUSAMMENSETZUNG,HERSTELLUNGSVERFAHRENDAFÜR,HÄRBAREHARZZUSAMMENSETZUNG,GEHÄRTETEPRODUKTE DARAUS UNDBESTÜCKTELEITERPLATTE

    公开(公告)号:EP2532710A4

    公开(公告)日:2017-05-03

    申请号:EP11739622

    申请日:2011-01-19

    摘要: The present invention provides a curable resin composition exhibiting excellent performance as a cured product, such as excellent heat resistance and flame retardancy, and further exhibiting excellent interlayer adhesive strength when applied to a printed circuit board. A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n = 1 and n = 2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.

    摘要翻译: 本发明提供固化性树脂组合物,该固化性树脂组合物作为固化物表现出优异的性能,例如优异的耐热性和阻燃性,并且当应用于印刷电路板时还表现出优异的层间粘合强度。 用作环氧树脂固化剂的酚醛树脂组合物包括由通式(1)表示的萘酚酚醛清漆树脂(a1)(其中R 1和R 2各自独立地表示氢原子,烷基或烷氧基 ,n是重复单元和1以上的整数)和通式(2)表示的化合物(a2)(式中,R 1和R 2分别独立地表示氢原子,烷基或烷氧基 组),其中组合物中存在的通式(1)中n = 1和n = 2的化合物的总比例为10-35%,通式(1)中n的平均值为 在3.0〜7.0的范围内,组合物中的化合物(a2)的含量为1〜6%。