-
1.发明公开
公开(公告)号：EP4403594A1
公开(公告)日：2024-07-24
申请号：EP24150149.3
申请日：2024-01-03
IPC分类号： C08G73/12 , C08K5/3445 , C08L79/08 , C09J4/00 , H01L23/29 , H01L23/00 , C08F290/06 , C08L71/12 , C09D4/00 , G03F7/00 , G03F7/027 , H05K1/03 , H05K3/02
CPC分类号： C08L79/085 , C08G73/12 , H01L23/293 , C08L79/08 , C09J4/00 , H01L24/29 , C08K5/3445 , C08F290/062 , C08G73/124 , C09D4/00 , G03F7/00 , G03F7/027 , H05K1/0346 , H05K3/022 , C08G73/127
摘要： Provided are a curable maleimide resin composition and others, in which the curable maleimide resin composition is one that does not employ an aprotic polar solvent such as NMP, can be cured at a temperature lower than 250°C which is a temperature at which a normal polyimide cures, and can particularly be turned into a cured product having a superior adhesiveness to copper. The curable maleimide resin composition contains:
(A) a maleimide compound that has a bisphenol structure and a number average molecular weight of 5,000 to 50,000;
(B) a reaction initiator; and
(C) a diaminotriazine ring-containing imidazole.-
公开(公告)号：EP4294855A1
公开(公告)日：2023-12-27
申请号：EP22705391.5
申请日：2022-02-11
-
公开(公告)号：EP3279262B1
公开(公告)日：2023-11-08
申请号：EP16772710.6
申请日：2016-03-28
发明人： YAMAGUCHI, Takashi , ABE, Shinichi
IPC分类号： C08L61/34 , C08G14/073 , C08G59/56 , C08G73/00 , C08G73/12 , C08L63/00 , C09J9/02 , C09J11/00 , C09J161/34 , C09J179/04 , H01L21/288 , C08L79/02
-
公开(公告)号：EP4267652A1
公开(公告)日：2023-11-01
申请号：EP20835677.4
申请日：2020-12-25
申请人： Daicel Corporation
发明人： OKANO, Yoshimichi , NAKATANI, Kouji , LIU, Feng
-
公开(公告)号：EP4151672A1
公开(公告)日：2023-03-22
申请号：EP21805023.5
申请日：2021-05-11
IPC分类号： C08G73/12 , C08G73/18 , C09D179/04 , C09D179/08 , C09J179/08
摘要： Provided are an amide compound and a nitrogen-containing heterocyclic ring-containing compound which have a specific repeating unit and a crosslinking site represented by Formula (2):
-C≡CX 1
at a molecular end.-
公开(公告)号：EP4038129A1
公开(公告)日：2022-08-10
申请号：EP20871569.8
申请日：2020-10-02
申请人： Global Biolife Inc.
发明人： THOMPSON, Daryl L.
-
7.发明公开
公开(公告)号：EP3790882A1
公开(公告)日：2021-03-17
申请号：EP19825819.6
申请日：2019-06-27
IPC分类号： C07D491/08 , C08G73/12 , C08G59/68 , C09J179/08
-
公开(公告)号：EP3556826B1
公开(公告)日：2021-03-03
申请号：EP19736956.4
申请日：2019-01-04
发明人： Kim, Seongku , Jo, Jung Ho
IPC分类号： C09K19/56 , G02F1/1337 , C08G73/14 , C08G73/12 , C08G73/16
-
公开(公告)号：EP3505510A1
公开(公告)日：2019-07-03
申请号：EP17843856.0
申请日：2017-08-11
申请人： LG Chem, Ltd.
发明人： YUN, Cheolmin , SUH, Jun Sik , KIM, Kyungjun
IPC分类号： C07C233/80 , C07C233/66 , C07C255/63 , C07C231/02 , C08G73/10 , C08G73/12 , G02B1/04 , G02B1/10
摘要： The present invention provides a novel diamine compound capable of producing a polymer which exhibits greatly enhanced mechanical properties and heat resistance while maintaining transparency. A film including a polymer produced using the diamine compound has excellent transparency, heat resistance, mechanical strength and flexibility, and thus can be used in various fields, such as in a device substrate, a display cover substrate, an optical film, an Integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), a tape, a touch panel and an optical disc protection film, and the like.
-
公开(公告)号：EP2555053B1
公开(公告)日：2017-10-18
申请号：EP12190387.6
申请日：2008-02-05
发明人： Arimoto, Shinji , Fujita, Yoji , Ike, Rinsei
IPC分类号： G03F7/023 , C08F290/06 , C08F299/02 , C08G73/10 , C08G73/22 , G03F7/004 , G03F7/022 , H01L21/027 , C08F290/14 , C08F299/06 , C08G73/12 , C08G73/14 , C08L79/08 , C08L61/06
CPC分类号： C08F290/06 , C08F290/14 , C08F299/02 , C08F299/06 , C08G73/101 , C08G73/1014 , C08G73/1017 , C08G73/121 , C08G73/122 , C08G73/123 , C08G73/124 , C08G73/125 , C08G73/126 , C08G73/127 , C08G73/14 , C08L61/00 , C08L61/06 , C08L79/085 , G03F7/0236 , C08L2666/20 , C08L2666/16
-
-
-
-
-
-
-
-
-
搜索结果
558 条记录 (耗时 0.017 秒)
