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    ELECTROLESS COPPER OR COPPER ALLOY PLATING BATH AND METHOD FOR PLATING
    2.
    发明公开
    ELECTROLESS COPPER OR COPPER ALLOY PLATING BATH AND METHOD FOR PLATING 审中-公开

    公开(公告)号：EP3578683A1

    公开(公告)日：2019-12-11

    申请号：EP18176836.7

    申请日：2018-06-08

    申请人： Atotech Deutschland GmbH

    发明人： KULKO, Roman-David ,  ZARWELL, Sebastian ,  KLAEDEN, Kilian ,  PETER, Anna ,  BECK, Birgit

    IPC分类号： C23C18/40 ,  C23C18/48

    摘要： An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, comprising
    a) copper ions;
    b) at least one reducing agent suitable for reducing copper ions to metallic copper;
    c) at least one complexing agent for copper ions;
    characterized in that the electroless copper plating bath further comprises
    d) at least one compound according to formula (1):

    wherein
    Z 1 and Z 2 are independently selected from the group consisting of hydrogen; carboxylic acid group; carboxylate group; sulfonic acid group; sulfonate group; carboxamide group; nitrile group; nitro group; substituted or non-substituted trialkylammonium group; substituted or non-substituted 2-carboxyvinyl group; substituted or non-substituted 2-vinylcarboxylate group; substituted or non-substituted 2-(trialkylammonium)vinyl group; substituted or non-substituted hydroxamic acid group; and substituted or non-substituted oxime group;
    with the proviso that at least one of Z 1 and Z 2 is not hydrogen;
    and
    wherein R 1 , R 2 , R 3 and R 4 are defined as follows:
    i. R 1 , R 2 , R 3 and R 4 are hydrogen; or
    ii. R 1 with R 2 are forming together a substituted or non-substituted aromatic ring moiety, R 3 and R 4 are hydrogen; or
    iii. R 3 with R 4 are forming together a substituted or non-substituted aromatic ring moiety, R 1 and R 2 are hydrogen; or
    iv. R 1 with R 2 as well as R 3 with R 4 are forming together a substituted or non-substituted aromatic ring moiety, respectively.


    The invention further concerns a method for depositing at least a copper or copper alloy layer on a surface of a substrate, a layer system and a kit-of-parts for providing the inventive electroless copper plating bath.

    A process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath that permits said alloy to deposit and the alloy obtained by means of said process
    7.
    发明公开
    A process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath that permits said alloy to deposit and the alloy obtained by means of said process 有权
    一种用于锡和基于钌合金电解液的电解析出方法，以允许所述合金的通过所述方法获得的沉积，并且该合金

    公开(公告)号：EP2757180A1

    公开(公告)日：2014-07-23

    申请号：EP13425013.3

    申请日：2013-01-18

    申请人： Valmet S.p.A.

    发明人： Bussetti, Samuele

    IPC分类号： C25D3/60 ,  C23C18/48 ,  C25D3/56

    CPC分类号： C25D3/60 ,  C25D3/56

    摘要： The invention refers to the electrolytic deposit of a tin- and ruthenium-based alloy having good features of corrosion resistance. In particular, the invention refers to an ecologically compatible process to realize the electrolytic deposit of said alloy and to the operative conditions to make said deposit.
    Moreover, the invention refers to the electrolytic bath from which said alloy is made to electro-deposit. In particular, said electrolytic bath is advantageously distinguished by the total absence of toxic metals and cyanides.
    The invention refers also to said alloy obtained through said process, as well as to the object/manufactured article covered with said alloy obtained through said process.

    摘要翻译： 本发明涉及一种具有耐蚀性良好的特征的基于钌TiN和合金的电解沉积。 特别地，该发明涉及到生态相容过程中实现所述合金的电解沉积和操作条件以使所述沉积物。 更过，本发明涉及到电解浴从其中所述合金被制成电沉积。 特别地，所述电解浴有利地由完全没有有毒金属和氰化物的区分。 因此，本发明涉及获得通过所述过程，以及以覆盖着通过所述方法获得的，所述合金的对象/制成品所述合金。