公开(公告)号：EP3775325B1

公开(公告)日：2024-08-28

申请号：EP19711378.0

申请日：2019-03-22

IPC分类号： C25D3/60 ,  C25D3/64 ,  C25D7/00 ,  C25D3/32 ,  C07D213/32 ,  C07D277/26 ,  C07D401/14 ,  C07D409/14 ,  C07D417/14

CPC分类号： H05K3/423 ,  C07D213/32 ,  C07D277/26 ,  C07D401/14 ,  C07D409/14 ,  C07D417/14 ,  C25D3/32 ,  C25D3/60 ,  C25D3/64 ,  C25D7/00

公开(公告)号：EP3705608B8

公开(公告)日：2024-07-03

申请号：EP18873736.5

申请日：2018-11-01

IPC分类号： C25D7/06 ,  C25D3/32 ,  C25D21/18 ,  C25D5/50

CPC分类号： C25D21/18 ,  C25D3/32 ,  C25D5/505 ,  C25D7/0614

公开(公告)号：EP4263916A1

公开(公告)日：2023-10-25

申请号：EP21835314.2

申请日：2021-12-15

申请人： BASF SE

发明人： FRISCHHUT, Sabine ,  WATANABE, Soichi ,  FLUEGEL, Alexander ,  ARNOLD, Marco ,  GORGES, Jan Niclas

IPC分类号： C25D3/32 ,  C25D3/60 ,  C25D7/00

公开(公告)号：EP3255180B1

公开(公告)日：2022-12-28

申请号：EP16746740.6

申请日：2016-02-08

发明人： GOTO, Yasuto ,  FUTABA, Takashi

IPC分类号： C25D5/26 ,  C25D3/30 ,  C25D9/10 ,  C25D3/32 ,  C25D5/36

公开(公告)号：EP3781729A1

公开(公告)日：2021-02-24

申请号：EP19715960.1

申请日：2019-04-11

申请人： BASF SE

发明人： FLUEGEL, Alexander ,  ARNOLD, Marco ,  ENGELHARDT, Nadine ,  KIENLE, Marcel Patrik

IPC分类号： C25D3/32 ,  C25D3/60 ,  H01L21/288 ,  H01L23/00

公开(公告)号：EP3702493A1

公开(公告)日：2020-09-02

申请号：EP18871709.4

申请日：2018-10-23

申请人： Mitsubishi Materials Corporation

发明人： WATANABE Mami ,  SUSUKI Kyoka ,  NAKAYA Kiyotaka

IPC分类号： C25D3/32 ,  C25D3/60 ,  C25D5/50 ,  C25D7/00 ,  H01L21/60 ,  H05K3/34

摘要： A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent.

Here, in the Formula (1), X is C a H 2a (a is 1 or 3) and m is 2 to 12.

公开(公告)号：EP3036224B1

公开(公告)日：2019-04-17

申请号：EP13897823.4

申请日：2013-11-20

申请人： Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

发明人： DUAN, Lingli ,  LI, Yang ,  SUN, Tong ,  FENG, Shaoguang ,  CHEN, Chen ,  NIAZIMBETOVA, Zuhra I. ,  RZEZNIK, Maria Anna

IPC分类号： C07D235/20 ,  C07D235/08 ,  C25D3/00 ,  C25D7/12 ,  C25D3/02 ,  C25D3/38 ,  C25D3/32 ,  C25D7/00 ,  H05K3/24

公开(公告)号：EP2444527B1

公开(公告)日：2019-02-20

申请号：EP11185970.8

申请日：2011-10-20

申请人： Rohm and Haas Electronic Materials LLC

发明人： Hayashi, Shinjiro ,  Sakai, Makoto

IPC分类号： C25D3/32 ,  H05K3/06

公开(公告)号：EP3238861A4

公开(公告)日：2018-08-01

申请号：EP15873226

申请日：2015-12-24

申请人： SENJU METAL INDUSTRY CO

发明人： KAWASAKI HIROYOSHI ,  KONDO SHIGEKI ,  IKEDA ATSUSHI ,  ROPPONGI TAKAHIRO ,  HAGIWARA TAKASHI ,  SOMA DAISUKE ,  TSURUTA KAICHI ,  SATO ISAMU ,  KAWAMATA YUJI

IPC分类号： B22F1/02 ,  B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  B23K35/22 ,  B23K35/26 ,  B23K101/40 ,  C22C9/00 ,  C22C13/00 ,  C25D3/18 ,  C25D3/32 ,  C25D3/56 ,  C25D3/60 ,  C25D5/10 ,  C25D5/12 ,  C25D5/18 ,  C25D7/00

CPC分类号： B23K35/262 ,  B22F1/025 ,  B22F9/08 ,  B22F2301/10 ,  B22F2301/15 ,  B23K1/00 ,  B23K3/06 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/3033 ,  C22C9/00 ,  C22C13/00 ,  C23C18/32 ,  C25D3/18 ,  C25D3/32 ,  C25D3/562 ,  C25D3/60 ,  C25D5/10 ,  C25D5/12 ,  C25D5/18 ,  C25D7/00

摘要： Provided are a joining member and a solder material that have a high sphericity, a solder paste, formed solder, a flux coated material and a solder joint. An Ni-plated Cu ball 10 according to this invention includes a cu ball 12 and an Ni plated layer 14 that coats the Cu ball 12. The Ni plated layer 14 contains brightener and has an average grain diameter of crystal grains of 1 µm or less. The Ni-plated Cu ball 10 has a spherical diameter of 1 to 230 µm and a sphericity of 0.95 or more. By containing the brightener in the Ni plated layer 14, a surface of the Ni-plated Cu ball 10 can be smoothed and the sphericity of 0.95 or more can be achieved. This makes it possible to prevent misalignment of Cu core ball 10 when the Cu core ball is mounted on electrode and to prevent any deterioration of the self-alignment property of the Cu core ball.

公开(公告)号：EP3093376B1

公开(公告)日：2018-03-21

申请号：EP16162541.3

申请日：2016-03-29

申请人： BTICINO S.P.A.

发明人： Mazzocchi, Caterina ,  Lauro, Gianluigi

IPC分类号： C25D5/10 ,  C25D5/44 ,  C25D7/06 ,  C25D3/32 ,  C25D3/38

CPC分类号： C25D5/10 ,  C25D3/32 ,  C25D3/38 ,  C25D5/44 ,  C25D7/0607

摘要： A process for continuous electrochemical tinning of an aluminum wire (1), comprises the steps of: providing an aluminum wire (1), performing the pickling of the aluminum wire (1), by passing it through a pickling tank (4) containing a pickling solution, performing carburization of the aluminum wire (1) by passing it through a carburization tank (5) containing a carburization solution, performing the alkaline copper plating of the aluminum wire (1) by passing it through an alkaline copper plating tank 6 containing an alkaline copper plating solution, performing acid copper plating of the aluminum wire (1) by passing it through an acid copper plating tank (7) containing an acid copper plating solution, performing tinning of the aluminum wire (1) by passing it through a tinning tank (8) containing tinning solution.