CONDUCTIVE COMPOSITION FOR BONDING, BONDING STRUCTURE USING SAME, AND MANUFACTURING METHOD THEREOF

    公开(公告)号:EP4302904A1

    公开(公告)日:2024-01-10

    申请号:EP21929139.0

    申请日:2021-09-06

    摘要: A conductive composition for bonding includes a copper powder and a carboxylic acid mixed therewith. The carboxylic acid has a branched carbon chain in its structure. The copper powder comprises first copper particles and second copper particles. The first copper particles have a volume-based cumulative particle size D 50 of 0.11 µm or more and less than 1 µm at a cumulative volume of 50 vol% in a region of particle sizes of less than 1 µm in a particle size distribution of the copper powder that is determined using a scanning electron microscope. The second copper particles have a volume-based cumulative particle size D 50 of 1 µm or more and 10 µm or less at a cumulative volume of 50 vol% in a region of particle sizes of 1 µm or more in the particle size distribution of the copper powder that is determined using the scanning electron microscope. The carboxylic acid is contained in an amount of 6 parts by mass or more and 24 parts by mass or less per 100 parts by mass of the copper powder.

    CONDUCTIVE INK
    5.
    发明公开
    CONDUCTIVE INK 审中-公开

    公开(公告)号:EP4180490A1

    公开(公告)日:2023-05-17

    申请号:EP21837602.8

    申请日:2021-07-05

    摘要: An object of the present disclosure is to provide a conductive ink that is excellent in applicability and dispersibility of metal nanoparticles, and forms, through sintering, a sintered body which is excellent in substrate steady contact and conductivity. The conductive ink according to an embodiment of the present disclosure contains components (A), (B), and (C) below, wherein a content of the component (C) is from 0.1 to 5.0 parts by weight relative to 100 parts by weight of the component (A), and a viscosity at 25°C is 100 mPa•s or less: Component (A): surface-modified metal nanoparticles having a configuration in which surfaces of metal nanoparticles are coated with an organic protective agent; Component (B): a dispersion medium containing an alcohol (b-1) and a hydrocarbon (b-2); and Component (C): a polyvinyl acetal resin.

    CONDUCTIVE ANTI-ICING COATING SYSTEMS AND METHODS

    公开(公告)号:EP4129822A1

    公开(公告)日:2023-02-08

    申请号:EP22187919.0

    申请日:2022-07-29

    摘要: The present disclosure provides methods of coating a substrate. A method includes depositing a conductive coating including an electrically conductive material over the substrate to form a conductive layer having a sheet resistivity of about 10 Ω/□ to about 1000 Ω/□. The method includes depositing an anti-icing layer comprising nanomaterials over the conductive layer to form a coating system.

    SURFACE-TREATED METAL POWDER AND CONDUCTIVE COMPOSITION

    公开(公告)号:EP3909704A1

    公开(公告)日:2021-11-17

    申请号:EP19908463.3

    申请日:2019-11-08

    发明人: FURUSAWA, Hideki

    摘要: There is provided a more versatile technique that is useful for enhancing the sintering delay property of a metal powder. A metal powder surface-treated with at least one coupling agent comprising Si, Ti, Al or Zr, wherein a total adhesion amount of Si, Ti, Al and Zr is 200 to 10,000 µg with respect to 1 g of the surface-treated metal powder, wherein a 1% by mass aqueous solution of the coupling agent indicates a pH of 7 or less, and wherein a sintering starting temperature is 500 °C or higher.