公开(公告)号：EP3631848B1

公开(公告)日：2024-10-16

申请号：EP18805731.9

申请日：2018-05-11

发明人： LI, Wenguang ,  PAPANU, James S. ,  LEI, Wei-Sheng ,  KUMAR, Prabhat ,  EATON, Brad ,  KUMAR, Ajay ,  LERNER, Alexander N.

IPC分类号： H01L21/78 ,  H01L21/027 ,  H01L21/308 ,  H01L21/311

公开(公告)号：EP4437585A1

公开(公告)日：2024-10-02

申请号：EP22817284.7

申请日：2022-11-16

申请人： Universiteit Gent ,  Imec VZW

发明人： CUYVERS, Stijn ,  ROELKENS, Gunther ,  VAN GASSE, Kasper ,  KUYKEN, Bart

IPC分类号： H01L21/78 ,  H01L21/683

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L2221/6832220130101 ,  H01L2221/683520130101 ,  H01L2221/6836820130101 ,  H01L2221/6838120130101 ,  H01L2221/6835420130101

公开(公告)号：EP3857617B1

公开(公告)日：2024-07-31

申请号：EP19778932.4

申请日：2019-09-24

IPC分类号： H01L31/18 ,  H01L21/78 ,  H01L31/05

CPC分类号： H01L31/18 ,  H01L21/78 ,  H01L31/05 ,  Y02E10/50

公开(公告)号：EP4402717A1

公开(公告)日：2024-07-24

申请号：EP22870910.1

申请日：2022-09-13

申请人： Adeia Semiconductor Bonding Technologies Inc.

发明人： UZOH, Cyprian, Emeka ,  WORKMAN, Thomas ,  GUEVARA, Gabriel, Z. ,  SUWITO, Dominik ,  GAO, Guilian

IPC分类号： H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  H01L21/18

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L2221/6832720130101 ,  H01L2221/6838120130101 ,  H01L21/67144

公开(公告)号：EP4384858A1

公开(公告)日：2024-06-19

申请号：EP22764417.6

申请日：2022-08-11

申请人： LiGenTec SA

发明人： SACCHETTO, Davide ,  ZERVAS, Michael ,  NAVICKAITE, Gabriele

IPC分类号： G02B6/12 ,  G02B6/13 ,  G02B6/132 ,  G02B6/136 ,  H01L21/78

CPC分类号： H01L21/78 ,  G02B6/12 ,  G02B6/132 ,  G02B6/136

公开(公告)号：EP4376064A1

公开(公告)日：2024-05-29

申请号：EP22306743.0

申请日：2022-11-25

申请人： Murata Manufacturing Co., Ltd.

发明人： LALLEMAND, Florent ,  LE CORNEC, François ,  LEMENAGER, Maxime ,  TANAY, Florent

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  H01L28/92

摘要： A method for obtaining an integrated device comprising:
forming a metal barrier layer (102) above a substrate,
forming an anodizable metal layer on the metal barrier layer,
anodizing a first region and a second region of the anodizable metal layer to obtain respectively a first porous region (PRA) and a second porous region (PRB) both comprising a plurality of substantially straight pores (105) that extend from a top surface of the porous region, perpendicularly to the top surface of the porous region, towards the metal barrier layer,
forming an etching mask (107) above at least the first porous region (PRA) having an opening (OP) above the second porous region,
etching the bottom ends of pores of the second porous region through the opening of the etching mask to obtain pores that form a device region, and pores in the first porous region that form a dicing line, the integrated device being delimited at least by the dicing line.

公开(公告)号：EP4350773A1

公开(公告)日：2024-04-10

申请号：EP22811584.6

申请日：2022-05-23

申请人： Samsung Display Co., Ltd.

发明人： LEE, Seung Kyu ,  KIM, Won Tae ,  KIM, Hyung June

IPC分类号： H01L27/15 ,  H01L27/12 ,  H01L33/50 ,  H01L33/52 ,  H01L33/48 ,  H01L33/00 ,  H01L25/075 ,  H01L33/64 ,  H01L21/78

摘要： A mother panel for a display panel includes: a mother substrate including a display panel area and a dummy area surrounding the display panel area, the mother substrate having a cutting line defined thereon, wherein the cutting line is configured to be irradiated by a laser along a boundary between the display panel area and the dummy area; and a first heat dissipation pattern on the mother substrate, extending from the display panel area to the dummy area to overlap the cutting line, and including a first rod portion including a plurality of lower rods spaced apart from each other and a first body portion in the dummy area and contacting the first rod portion.

公开(公告)号：EP3803972B1

公开(公告)日：2024-03-20

申请号：EP19810608.0

申请日：2019-03-29

发明人： AGARWAL, Rahul ,  BHAGAVAT, Milind, S.

IPC分类号： H01L21/98 ,  H01L25/065 ,  H01L21/768 ,  H01L21/78 ,  H01L21/683 ,  H01L21/60

公开(公告)号：EP4138116B1

公开(公告)日：2024-03-13

申请号：EP20931548.0

申请日：2020-04-13

发明人： FUJIKAWA, Masahiro ,  YAGYU, Eiji

IPC分类号： H01L21/18 ,  H01L21/683 ,  H01L21/78

公开(公告)号：EP3916767B1

公开(公告)日：2024-03-06

申请号：EP20832764.3

申请日：2020-01-16

发明人： WU, Ping-Heng

IPC分类号： H01L21/78 ,  H01L23/00 ,  H01L23/58 ,  H01L25/00 ,  H01L29/06