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公开(公告)号：EP4420167A1
公开(公告)日：2024-08-28
申请号：EP22884728.1
申请日：2022-10-21
Applicant: Illumina Inc.
Inventor： EMADI, Arvin , BILLA, Ravi , REZAEI, Mohsen , HETHERINGTON, Craig
IPC: H01L27/146 , G01J1/42 , G01J1/44
CPC classification number: H01L27/14643 , H01L27/14629 , G01N21/6454 , H01L27/1463 , H01L27/1464 , H01L27/14663 , G01N21/05 , H01L21/6835 , H01L2221/683520130101
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公开(公告)号：EP4437585A1
公开(公告)日：2024-10-02
申请号：EP22817284.7
申请日：2022-11-16
Applicant: Universiteit Gent , Imec VZW
Inventor： CUYVERS, Stijn , ROELKENS, Gunther , VAN GASSE, Kasper , KUYKEN, Bart
IPC: H01L21/78 , H01L21/683
CPC classification number: H01L21/78 , H01L21/6835 , H01L2221/6832220130101 , H01L2221/683520130101 , H01L2221/6836820130101 , H01L2221/6838120130101 , H01L2221/6835420130101
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公开(公告)号：EP4411843A2
公开(公告)日：2024-08-07
申请号：EP24169398.5
申请日：2018-05-07
Applicant: The Regents of the University of California
Inventor： KAMIKAWA, Takeshi , GANDROTHULA, Srinivas , LI, Hongjian , COHEN, Daniel A.
IPC: H01L33/20
CPC classification number: H01L33/0075 , H01L33/20 , H01S5/0217 , H01S5/34333 , H01S2304/1220130101 , H01L33/0093 , H01L21/02389 , H01L21/0254 , H01L21/02647 , H01L21/02458 , H01L2224/3224520130101 , H01L2224/8319220130101 , H01L2224/8389520130101 , H01L2224/3222520130101 , H01L2224/8344420130101 , H01L2224/8320320130101 , H01L2224/0561120130101 , H01L2224/0564420130101 , H01L2924/1574720130101 , H01L2924/103320130101 , H01L2224/0402620130101 , H01L24/05 , H01L24/29 , H01L24/32 , H01L2224/8380520130101 , H01L24/83 , H01L2224/8301320130101 , H01L2224/8302220130101 , H01L2224/2911120130101 , H01L2224/2914420130101 , H01L2224/8344720130101 , H01L2224/8044420130101 , H01L2224/8001320130101 , H01L2224/8020320130101 , H01L2224/8089520130101 , H01L24/80 , H01L2224/0824520130101 , H01L2224/0822520130101 , H01L24/08 , H01L2224/0420130101 , H01L2224/034520130101 , H01L24/03 , H01L2224/8000620130101 , H01L2224/8300520130101 , H01L2224/0823820130101 , H01L2224/0825820130101 , H01L2224/0555820130101 , H01L21/6835 , H01L24/06 , H01L2224/0618120130101 , H01L2924/1204220130101 , H01L2224/920220130101 , H01L2224/9420130101 , H01L24/94 , H01L24/92 , H01L2224/9214220130101 , H01L2224/921220130101 , H01L2221/6838120130101 , H01L2221/6831820130101 , H01L2221/683520130101 , H01L2221/6836320130101 , H01L2224/80420130101 , H01L2224/804920130101 , H01L2224/051820130101 , H01L2224/0514420130101 , H01L2224/0566920130101 , H01L2224/0518420130101 , H01L2224/0513920130101 , H01L2224/0566420130101 , H01L2224/0565520130101 , H01L2224/0563920130101 , H01L2224/0516420130101 , H01L2224/0516620130101 , H01L2224/0516920130101 , H01L2224/056820130101 , H01L2224/0568420130101 , H01L2224/0566620130101 , H01L2224/0515520130101 , H01S5/0203 , H01L2224/29120130101
Abstract: A method of removing a substrate, comprising: forming a growth restrict mask with a plurality of striped opening areas directly or indirectly upon a GaN-based substrate; and growing a plurality of semiconductor layers upon the GaN-based substrate using the growth restrict mask, such that the growth extends in a direction parallel to the striped opening areas of the growth restrict mask, and growth is stopped before the semiconductor layers coalesce, thereby resulting in island-like semiconductor layers. A device is processed for each of the island-like semiconductor layers. Etching is performed until at least a part of the growth restrict mask is exposed. The devices are then bonded to a support substrate. The GaN-based substrate is removed from the devices by a wet etching technique that at least partially dissolves the growth restrict mask. The GaN substrate that is removed then can be recycled.
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公开(公告)号：EP4162522B1
公开(公告)日：2024-06-12
申请号：EP21731232.1
申请日：2021-04-26
IPC: H01L21/683
CPC classification number: H01L21/6835 , H01L2221/683520130101 , H01L2221/6838120130101
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Patent Agency Ranking
公开(公告)号：EP3903337B1
公开(公告)日：2024-06-12
申请号：EP19842758.5
申请日：2019-12-27
IPC: B23K26/53 , H01L21/02 , H01L21/304 , H01L23/544 , H01L21/683 , H01L21/762 , H01L21/78 , B23K103/00 , C30B29/36 , C30B33/06
CPC classification number: C30B29/36 , C30B33/06 , H01L21/02002 , H01L21/304 , H01L21/76254 , H01L21/7806 , H01L21/6835 , H01L2221/6832720130101 , H01L23/544 , H01L2223/5443320130101 , H01L2221/683520130101 , B23K26/53 , B23K2103/5620180801
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公开(公告)号：EP3619748B1
公开(公告)日：2024-04-17
申请号：EP18794585.2
申请日：2018-05-07
IPC: H01L21/683 , H01L23/00 , H01L33/00 , H01S5/02 , H01L21/02 , H01S5/343 , H01L33/46 , H01L33/32 , H01L33/20
CPC classification number: H01L33/0075 , H01L33/20 , H01S5/0217 , H01S5/34333 , H01S2304/1220130101 , H01L33/0093 , H01L21/02389 , H01L21/0254 , H01L21/02647 , H01L21/02458 , H01L2224/3224520130101 , H01L2224/8319220130101 , H01L2224/8389520130101 , H01L2224/3222520130101 , H01L2224/8344420130101 , H01L2224/8320320130101 , H01L2224/0561120130101 , H01L2224/0564420130101 , H01L2924/1574720130101 , H01L2924/103320130101 , H01L2224/0402620130101 , H01L24/05 , H01L24/29 , H01L24/32 , H01L2224/8380520130101 , H01L24/83 , H01L2224/8301320130101 , H01L2224/8302220130101 , H01L2224/2911120130101 , H01L2224/2914420130101 , H01L2224/8344720130101 , H01L2224/8044420130101 , H01L2224/8001320130101 , H01L2224/8020320130101 , H01L2224/8089520130101 , H01L24/80 , H01L2224/0824520130101 , H01L2224/0822520130101 , H01L24/08 , H01L2224/0420130101 , H01L2224/034520130101 , H01L24/03 , H01L2224/8000620130101 , H01L2224/8300520130101 , H01L2224/0823820130101 , H01L2224/0825820130101 , H01L2224/0555820130101 , H01L21/6835 , H01L24/06 , H01L2224/0618120130101 , H01L2924/1204220130101 , H01L2224/920220130101 , H01L2224/9420130101 , H01L24/94 , H01L24/92 , H01L2224/9214220130101 , H01L2224/921220130101 , H01L2221/6838120130101 , H01L2221/6831820130101 , H01L2221/683520130101 , H01L2221/6836320130101 , H01L2224/80420130101 , H01L2224/804920130101 , H01L2224/051820130101 , H01L2224/0514420130101 , H01L2224/0566920130101 , H01L2224/0518420130101 , H01L2224/0513920130101 , H01L2224/0566420130101 , H01L2224/0565520130101 , H01L2224/0563920130101 , H01L2224/0516420130101 , H01L2224/0516620130101 , H01L2224/0516920130101 , H01L2224/056820130101 , H01L2224/0568420130101 , H01L2224/0566620130101 , H01L2224/0515520130101 , H01S5/0203 , H01L2224/29120130101
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公开(公告)号：EP3747062B1
公开(公告)日：2024-08-21
申请号：EP19704394.6
申请日：2019-01-30
IPC: H01L21/78 , H01L21/683 , H01L23/544 , H01L27/12
CPC classification number: H01L21/7806 , H01L21/6835 , H01L27/1218 , H01L27/1266 , H01L23/544 , H01L21/6836 , H01L2221/683520130101 , H01L2221/6838120130101 , H01L2223/544220130101 , H01L2223/5442620130101 , H01L2223/5443320130101 , H01L2223/5448620130101 , Y02E10/549 , Y02P70/50
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公开(公告)号：EP4403678A2
公开(公告)日：2024-07-24
申请号：EP24177158.3
申请日：2019-12-27
Applicant: Wolfspeed, Inc.
Inventor： DONOFRIO, Matthew , EDMOND, John , KONG, Hua-Shuang , BALKAS, Elif
IPC: C30B33/06
CPC classification number: C30B29/36 , C30B33/06 , H01L21/02002 , H01L21/304 , H01L21/76254 , H01L21/7806 , H01L21/6835 , H01L2221/6832720130101 , H01L23/544 , H01L2223/5443320130101 , H01L2221/683520130101 , B23K26/53 , B23K2103/5620180801
Abstract: A crystalline material processing method including bonding a first crystalline carrier to a first surface of a crystalline material, wherein the crystalline material comprises a substrate having a subsurface laser damage region at a depth relative to a first surface of the substrate. The crystalline material processing method also includes bonding a second crystalline carrier to a second surface of the crystalline material and following the bonding steps, fracturing the crystalline material along or proximate to the subsurface laser damage region to yield a bonded assembly comprising the first crystalline carrier and a portion of the crystalline material removed from the substrate.
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公开(公告)号：EP4385066A1
公开(公告)日：2024-06-19
申请号：EP21755982.2
申请日：2021-08-09
Applicant: X-Celeprint Limited , LEONHARD KURZ Stiftung & Co. KG
Inventor： COK, Ronald S. , TRINDADE, António José , SCHARFENBERG, Michael , SCHULZ, Christian , ROITHMEIER, Gabriele
IPC: H01L21/683 , H01L21/67 , H01L23/00 , H01L33/00 , H01L27/15
CPC classification number: H01L33/0095 , H01L27/153 , H01L21/67144 , H01L21/6835 , H01L2221/6835420130101 , H01L2221/6836820130101 , H01L2221/6838120130101 , H01L2221/683520130101 , H01L2221/6831820130101 , H01L24/83 , H01L24/95 , H01L2224/3222520130101 , H01L2224/2422620130101 , H01L2224/3214520130101 , H01L2224/2414620130101 , H01L2224/9520130101 , H01L2224/95120130101 , H01L2224/9513320130101 , H01L2224/8319220130101 , H01L2224/2731220130101 , H01L2224/2762220130101 , H01L2224/8386220130101 , H01L2224/8387420130101 , H01L2224/7525120130101 , H01L23/544 , H01L2224/8312120130101 , H01L2224/8314320130101 , H01L2224/8320820130101 , H01L2224/8398620130101 , H01L24/33 , H01L2224/3318120130101 , H01L2224/7326720130101 , H01L2224/7321720130101 , H01L2224/922220130101 , H01L24/92 , H01L24/32 , H01L24/27 , H01L24/24 , H01L2224/7420130101 , H01L24/74 , H01L24/75 , H01L2224/756520130101 , H01L25/50 , H01L25/0655 , H01L25/16
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