摘要:
PROBLEM TO BE SOLVED: To suppress occurrence of abnormality in an unit block and deterioration of the throughput of an application/development device when performing maintenance, and to suppress the installation area of a processing block.SOLUTION: The application/development device comprises: delivery parts for application processing to be provided between stacked unit blocks for pre-stage processing and respective stacked unit blocks for post-stage processing and to deliver substrates between transport mechanisms of both unit blocks; an auxiliary transfer mechanism provided so as to elevate and lower freely in order to convey the substrates between the delivery parts for application processing of each stage; unit blocks for development stacked on the unit blocks for the pre-stage processing and the unit blocks for post-stage processing respectively. Substrate delivery between respective layers can avoid unusable unit blocks to convey substrates. In addition, the unit blocks for development stacked on the unit blocks for the pre-stage processing and the unit blocks for post-stage processing can suppress an installation area thereof.
摘要:
A positive resist composition comprising: (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid; (B) a compound which generates an acid upon irradiation with actinic rays or a radiation; (C) a fluorine-containing compound containing at least one group selected from the groups (x) to (z); and (F) a solvent, and a method of pattern formation with the composition: (x) an alkali-soluble group; (y) a group which decomposes by an action of an alkaline developing solution to enhance a solubility in an alkaline developing solution; and (z) a group which decomposes by an action of an acid.
摘要:
PROBLEM TO BE SOLVED: To provide a coating development device and a coating development method that perform liquid processing on respective substrates of a substrate group comprising a plurality of substrates one after another, and shorten a processing time even when different process flows share one liquid processing module. SOLUTION: The coating development device includes: a first liquid processing module M4 that performs first liquid processing on the respective substrates one after another using a first chemical and performs second liquid processing on the respective substrates one after another using the first chemical again; a buffer module BUF where the substrates after the first liquid processing and before the second liquid processing are temporarily stored one after another; and a second liquid processing module M5 that performs third liquid processing, using a second chemical, on the respective substrates to be subjected to the second liquid processing one after another after taking the substrates out of the buffer module BUF. Here, the third liquid processing on an initial substrate of the substrate group is started before the first liquid processing on a final substrate of the substrate group ends so that the second liquid processing on the initial substrate can be performed immediately after the first liquid processing on the final substrate. COPYRIGHT: (C)2011,JPO&INPIT
摘要:
To provide a method for manufacturing a resist pattern designed to reduce a manufacturing cost by improving efficiency in the use of a resist material, a method for removing a resist pattern, and a method for manufacturing a semiconductor device. The present invention includes a step of forming a resist pattern by discharging a composition containing photosensitizer on a object to be processed under reduced pressure. The present invention includes a step of etching the object to be processed using the resist pattern as a mask, a step of irradiating the resist pattern through a photomask with light within a photosensitive wavelength region of a photosensitizer, and a step of removing the resist pattern on the object to be processed.
摘要:
The present invention is directed to a pattern forming method, comprising: applying, to a substrate, a resist composition of which solubility in a positive developer which is an alkali developer increases and solubility in a negative developer containing an organic solvent decreases upon irradiation with actinic rays or radiation, so as to form a resist film; exposing the resist film; and developing the resist film with the negative developer, wherein the resist composition contains a resin having a monocyclic or polycyclic alicyclic hydrocarbon structure and being capable of increasing a solubility of the resin in an alkali developer and decreasing a solubility of the resin in an organic solvent under an action of an acid, and the resin contains at least one member selected from the group consisting of a repeating unit having an alicyclic hydrocarbon-containing partial structure represented by any one of the following formulae (pI) to (pV): in formulae (pI) to (pV), R 11 represents a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group or a sec-butyl group; Z represents an atomic group necessary for forming a cycloalkyl group together with the carbon atom; R 12 to R 16 each independently represents a linear or branched alkyl group having a carbon number of 1 to 4 or a cycloalkyl group, provided that at least one of R 12 to R 14 or either one of R 15 and R 16 represents a cycloalkyl group; R 17 to R 21 each independently represents a hydrogen atom, a linear or branched alkyl group having a carbon number of 1 to 4 or a cycloalkyl group, provided that at least one of R 17 to R 21 represents a cycloalkyl group and that either one of R 19 and R 21 represents a linear or branched alkyl group having a carbon number of 1 to 4 or a cycloalkyl group; R 22 to R 25 each independently represents a hydrogen atom, a linear or branched alkyl group having a carbon number of 1 to 4 or a cycloalkyl group, provided that at least one of R 22 to R 25 represents a cycloalkyl group; and R 23 and R 24 may combine with each other to form a ring.
摘要:
PROBLEM TO BE SOLVED: To provide a method of manufacturing resist patterns for aiming at reducing manufacturing costs by improving the efficiency of using resist materials, and to provide a method of removing resist patterns and a method of manufacturing semiconductor devices. SOLUTION: The method of manufacturing the semiconductor devices includes a step of discharging a composition including a photosensitizer onto a workpiece to form a resist pattern under reduced pressure. Also, the method includes a step of etching the workpiece with the resist pattern as a mask, or a step of irradiating the resist pattern with light in a photosensitive wavelength range of the photosensitizer via a photomask, a step of etching the workpiece with the resist pattern as a mask, and a step of removing the resist pattern on the workpiece. COPYRIGHT: (C)2010,JPO&INPIT