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    Method of bonding between the resin material
    12.
    发明专利
    Method of bonding between the resin material 有权

    公开(公告)号：JP4185405B2

    公开(公告)日：2008-11-26

    申请号：JP2003155148

    申请日：2003-05-30

    Applicant: トヨタ自動車株式会社 ,  株式会社 レーザックス ,  株式会社ファインディバイス

    Inventor： 秀生 中村 ,  精次郎 副田 ,  京司 国府田

    IPC: B29C65/16

    CPC classification number: B29C65/1635 ,  B29C65/1616 ,  B29C65/1654 ,  B29C65/168 ,  B29C65/1687 ,  B29C66/301 ,  B29C66/73921

    Abstract: PROBLEM TO BE SOLVED: To weld resins without focusing every time even when a laser beam irradiation position is fluctuated up and down intricately depending on surface configuration of a resin material. SOLUTION: In a method of jointing between resins having a process of laminating a laser-permeable resin material 32 on a laser-absorbing resin material 30 and arranging it, a process of melting facing surfaces of both the resin materials 30, 32 by irradiating a laser beam L on the surface side of the laser-permeable resin material 32 to heat the laser-absorbing resin material 30, and a process of welding the molten resin material and another resin material, a fiber laser is employed as the laser beam L. By this, since the fiber laser shows extremely high parallelism, even when the position to be jointed is fluctuated up and down in the Z-axis due to existing irregularity and level difference on the surface of the resin material, it is possible to continue fabrication without focusing every time. As a result it is possible to enhance efficiency of the jointing work and simplify a fabricating device. COPYRIGHT: (C)2005,JPO&NCIPI

    Semiconductor module of the cooling device
    16.
    发明专利
    Semiconductor module of the cooling device 有权

    公开(公告)号：JP5348264B2

    公开(公告)日：2013-11-20

    申请号：JP2012047392

    申请日：2012-03-02

    Applicant: トヨタ自動車株式会社

    Inventor： 秀生 中村 ,  右 山本

    IPC: H01L23/40 ,  H01L23/34 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18

    CPC classification number: H01L2224/48091 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To solve a problem of a conventional cooling device of a semiconductor module that a brazing material joining an insulation substrate with a metal layer in a power semiconductor module is remelted by heat melting a brazing material joining the power semiconductor module with a heat radiator or the like, and a joining end part between the insulation substrate and the metal layer is peeled. SOLUTION: An upper electrode 63, a lower electrode 66, and a top plate 32 of a cooler 3 are formed by members of the same material, a brazing material 22b joining an insulation substrate 12 with the upper electrode 63 and the lower electrode 66 and a brazing material 22b joining the lower electrode 66 with the top plate 32 are formed by members of the same material. A contact prevention material 69, which is for preventing the brazing material 22b joining the lower electrode 66 with the top plate 32 from contacting with a joining interface between at least the lower electrode 66 and the insulation substrate 12, is applied to a peripheral part of the lower electrode 66. COPYRIGHT: (C)2012,JPO&INPIT

    Laser bonding method
    18.
    发明专利
    Laser bonding method 有权

    公开(公告)号：JP4739063B2

    公开(公告)日：2011-08-03

    申请号：JP2006050400

    申请日：2006-02-27

    Applicant: トヨタ自動車株式会社 ,  東海興業株式会社

    Inventor： 秀生 中村 ,  浩一 原 ,  康恭 竹内

    IPC: B23K26/20 ,  B23K26/00 ,  B23K26/32 ,  B23K101/40 ,  B23K103/22

    Abstract: PROBLEM TO BE SOLVED: To provide a laser joining method where different kinds of metals having different laser reflectivities and thermal conductivities can be efficiently lap-welded in high quality. SOLUTION: In the laser joining method where a lower plate 10 made of an iron based material and an upper plate 11 made of a copper based material having a laser reflectivity and a thermal conductivity higher than those of the iron based material are lapped, and a laser L is emitted from the side of the upper plate 11, so as to lap-weld both the plates, a recessed hole 12 is beforehand formed in the upper plate 11, the laser L is emitted in such a manner that an emission pattern is formed at the bottom of the recessed hole 12, and the thin part 12a at the bottom of the recessed hole 12 is concentrically heated and melted. Since the thin part 12 is heated and melted, the upper plate 11 can be efficiently heated and melted even without so increasing the energy density of the laser, thus the phenomenon of energy over on the side of the lower plate 10 is eliminated, pitting in the lower plate 10 is prevented, and further, the gasification of low boiling point components causing the generation of blow holes is suppressed as well. COPYRIGHT: (C)2007,JPO&INPIT

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