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    Pattern inspection apparatus and semiconductor inspection system
    12.
    发明专利
    Pattern inspection apparatus and semiconductor inspection system 有权

    公开(公告)号：JP5010207B2

    公开(公告)日：2012-08-29

    申请号：JP2006220926

    申请日：2006-08-14

    Applicant: 株式会社日立ハイテクノロジーズ

    Inventor： 良一 松岡 ,  英光 納谷 ,  康隆 豊田 ,  拓路 酢谷

    IPC: H01L21/66 ,  G01N23/225

    CPC classification number: G06T7/0004 ,  G06T7/001

    Abstract: There is provided a pattern inspection apparatus that is capable of detecting a defect accurately and efficiently to inspect a pattern of a semiconductor device. The pattern inspection apparatus includes: a contour extraction means for extracting contour data of a pattern from a captured image of the semiconductor device; a non-linear part extraction means for extracting a non-linear part from the contour data; an angular part extraction means for extracting an angular part of a pattern from design data of the semiconductor device; and a defect detection section that compares a position of the non-linear part extracted by the non-linear part extraction section with a position of the angular part extracted by the angular part extraction section so as to detect a position of a defective part of a pattern.

    Inspection apparatus using a template matching method using the similarity distribution
    13.
    发明专利
    Inspection apparatus using a template matching method using the similarity distribution 有权
    空值

    公开(公告)号：JP4891712B2

    公开(公告)日：2012-03-07

    申请号：JP2006240375

    申请日：2006-09-05

    Applicant: 株式会社日立ハイテクノロジーズ

    Inventor： 美道 佐藤 ,  雄一 安部 ,  光二 池田 ,  康隆 豊田

    IPC: G06T7/00 ,  G06T1/00 ,  H01L21/027 ,  H01L21/66

    CPC classification number: G06K9/6203 ,  G06K2209/19 ,  G06T7/32 ,  G06T2207/10056 ,  G06T2207/30148

    Abstract: An inspection apparatus performing template matching of a search image capable of outputting a correct matching position even if a pattern similar to a template exists in the search image is provided. The inspection apparatus includes a template cutout means for cutting out a template from a template selection image, a marginal similarity calculation means for calculating marginal similarity distribution information, which is a similarity distribution of the template selection image to the template, a search image similarity calculation part for calculating search image similarity distribution information, which is a similarity distribution of the search image to the template, a similarity distribution-to-similarity distribution similarity calculation means for calculating similarity distribution-to-similarity distribution similarity information between the marginal similarity distribution information and the search image similarity distribution information, and a matching position determination part for determining a matching position based on the similarity distribution-to-similarity distribution similarity.

    Abstract translation: 提供了即使在搜索图像中存在类似于模板的图案，也能够执行能够输出正确的匹配位置的搜索图像的模板匹配的检查装置。 所述检查装置包括用于从模板选择图像切割模板的模板切除装置，用于计算作为模板选择图像与模板的相似度分布的边缘相似度分布信息的边缘相似度计算装置，搜索图像相似度计算 用于计算搜索图像与模板的相似度分布的搜索图像相似度分布信息的部分，用于计算边缘相似度分布信息之间的相似度分布与相似度分布相似度信息的相似度分布相似度分布相似度计算装置 以及搜索图像相似度分布信息，以及匹配位置确定部分，用于基于相似度分布与相似度分布相似度来确定匹配位置。

    Circuit pattern inspection method and a circuit pattern inspection system,
    14.
    发明专利
    Circuit pattern inspection method and a circuit pattern inspection system, 有权

    公开(公告)号：JP4659004B2

    公开(公告)日：2011-03-30

    申请号：JP2007209789

    申请日：2007-08-10

    Applicant: 株式会社日立ハイテクノロジーズ

    Inventor： 浩二 新井 ,  康成 早田 ,  康隆 豊田 ,  裕治 高木

    IPC: H01L21/66 ,  G01N23/225 ,  G03F1/84 ,  G03F1/86 ,  H01J37/22 ,  H01J37/244 ,  H01L21/027

    CPC classification number: H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A pattern data examination method and system capable of accurately and speedily examining a circuit pattern without failing to extract pattern contour data are provided. While pattern comparison is ordinarily made by using a secondary electron image, a contour of a pattern element is extracted by using a backscattered electron image said to be suitable for observation and examination of a three dimensional configuration of a pattern element, and pattern inspection is executed by using the extracted contour of the pattern element. More specifically, pattern inspection is executed by comparing a contour of a pattern element with design data such as CAD data to measure a difference between the contour and the data, and by computing, for example, the size of the circuit pattern element from the contour of a pattern. From two or more backscattered electron images formed by detecting backscattered electrons at two or more different spatial positions, pattern contour data contained in the backscattered electron images may be obtained.

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