Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive cover lay film having excellent mechanical properties. SOLUTION: The present invention relates to a resin composition containing a resin (A) and a plasticizer (B), characterized in that, when only the plasticizer (B) is heated, the heat-generation at starting temperture is T1(°C) and, when a composition (composition (a)) which is a mixture of the resin (A) and the plasticizer (B) is heated, the heat generation starting temparature is T2(°C) and a glass transition temperature of the resin composition is T3(°C), no heat generation is observed when the above composition (composition (a)) is heated, or the composition satisfies formula (1): T1+15°C COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an insulated conductor uniform in film thickness, excellent in heat resistance, also having a predetermined adhesion with a thin metallic wire, and further excellent in easiness in peeling electrodeposition coating.SOLUTION: In an insulated conductor, an electrodeposition coating 200 is formed on a surface of a thin metallic wire 100, the electrodeposition coating 200 comprising an insulator containing a block copolymer polyimide which has a siloxane skeleton in a molecular skeleton and has an anionic group in a molecule. The block copolymer polyimide contains 1,000 mg/eq or more and 2,000 mg/eq or less of a carboxy group as an acid value. A molecular weight of each siloxane skeleton in the molecular skeleton of the block copolymer polyimide is 1,000 or more and 1,500 or less.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a crystal silicon solar cell having a reverse side insulation layer composed of an organic material by using a fabrication process which is suitable for mass production and less likely to have adverse effects.SOLUTION: The crystal silicon solar cell manufacturing method according to the present invention includes a reverse side insulation layer formation step of forming a reverse side insulation layer composed of an organic material on the surface of the reverse side of a crystal silicon substrate by a printing method and a step of forming an electrode on a light-receiving surface side after the reverse side insulation layer is formed. Or the crystal silicon solar cell manufacturing method according to the present invention includes a reverse side insulation layer formation step of forming a reverse side insulation layer composed of an organic material on the surface of the reverse side of a crystal silicon substrate by a printing method, a step of forming an electrode on a light-receiving surface side after the reverse side insulation layer is formed, and a step of forming an electrode on the reverse side, where calcination for forming an electrode on the light-receiving surface side and calcination for forming an electrode on the reverse side are carried out at the same time.
Abstract:
PROBLEM TO BE SOLVED: To provide a polyimide electrodeposition coating material having such excellent storage stability as to avoid degeneration even in long-term storage and formable of an electrodeposited film having very high uniformity of film properties at a high electrodeposition rate at the point of use.SOLUTION: The polyimide electrodeposition coating material is a suspension type polyimide electrodeposition coating material in which particles of a block-copolymerized polyimide having a siloxane bond in a molecular skeleton and having an anionic group in a molecule are dispersed, wherein an average particle diameter (D1) of the particles of the block-copolymerized polyimide is 0.05-5 μm and the particles have a particle size distribution in which ≥55% (by the number of pieces) of the particles are included in the range of (D1-0.3×D1) μm to (D1+0.3×D1) μm.
Abstract:
PROBLEM TO BE SOLVED: To provide a metal foil polyimide laminate having high bending resistance and high tear strength under high adhesive force in a thin polyimide film. SOLUTION: The metal foil polyimide laminate comprises a metal foil on at least one surface of a polyimide film, wherein a ten-point average roughness of a metal foil surface adhered to a polyimide film is Rz=0.8 μm or less, thickness of the polyimide film is 13 μm or less and IPC bending resistance of a metal foil polyimide laminate is 1,000,000 cycles or more under bending speed of 60 cycles/min. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a coverlay excelling in a low-warpage property, a pattern fineness property, flexibility and flame resistance; and a printed wiring board using it. SOLUTION: In this coverlay, a silicon element, a phosphorous element and a sulfur element are present on a surface of thereof, and uniformly distributed in the surface; in an X-ray intensity ratio of the elements on the surface, the ratio of the average intensity of the phosphorous element to the average intensity of the silicon element is ≥0.005; and that to the average intensity of the sulfur element is ≥0.25. The coverlay is obtained from a photosensitive resin composition containing alkali-soluble polyimide having a siloxane skeleton and/or an alkali-soluble polyimide precursor and 1, 2-naphthoquinone diazide sulphonate compound and a phosphate ester compound and/or a phosphazene compound; and the alkali-soluble polyimide has a carboxyl group and/or a hydroxide group. The phosphate ester compound has 1-30C aliphatic organic group. COPYRIGHT: (C)2010,JPO&INPIT