Photosensitive resin composition
    4.
    发明专利

    公开(公告)号:JP5290686B2

    公开(公告)日:2013-09-18

    申请号:JP2008248842

    申请日:2008-09-26

    Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a surface protection film and an inter-layer insulation film with excellent flatness owing to a high film remaining ratio after a heat treatment. SOLUTION: The photosensitive resin composition contains (a) 100 pts.mass of an alkaline soluble resin having at least one repeating unit selected from the group consisting of formula (1) and a specific polyamide residue having a hydroxy group, (b) 0.01-20 pts.mass of a compound to generate an acid by irradiation with radiation, (c) 0.1-50 pts.mass of a compound having a group crosslinkable by an acid, and (d) 10-500 pts.mass of a compound having a (meth)acryloyl group. COPYRIGHT: (C)2010,JPO&INPIT

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