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    Moisture-curable adhesive composition and laminate using the same
    45.
    发明专利
    Moisture-curable adhesive composition and laminate using the same 有权
    水分可固化粘合剂组合物和使用它的层压板

    公开(公告)号：JP2013237778A

    公开(公告)日：2013-11-28

    申请号：JP2012111694

    申请日：2012-05-15

    Applicant: Cemedine Co Ltd ,  セメダイン株式会社

    Inventor： NISHIMURA KANA ,  SUMITANI MASANORI

    IPC: C09J171/02 ,  C09J11/04 ,  C09J201/10 ,  E04B1/76 ,  F24D19/02

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive composition which satisfies all of high thermal conductivity, high tensile adhesion strength, high handleability and working efficiency, and high safety, and is suitable for adhesive application of a floor heating panel.SOLUTION: A moisture-curable adhesive composition contains: 100 parts mass of a polyoxyalkylene polymer having 1.5 or more crosslinkable silyl groups in one molecule thereof and 4,000-30,000 number-average molecular weight (Mn); and 400-700 parts mass of a thermally conductive filler. It is preferable that the number of the crosslinkable silyl groups contained in one molecule is 1.5-5 and the crosslinkable silyl group is shown by general formula (1) (wherein R is a 1-20C substituted or unsubstituted univalent organic group and Rs can be the same or different from one another when a plurality of Rs exist; X is a hydroxyl group or a hydrolyzable group or Xs can be the same or different from one another when a plurality of Xs exist; n is an integer of 1-3).

    Abstract translation: 要解决的问题：提供一种满足高导热性，高拉伸粘合强度，高操作性和工作效率以及高安全性的粘合剂组合物，并且适用于地板加热板的粘合剂应用。 可固化粘合剂组合物包含：100份质量的在一分子中具有1.5个或更多个交联性甲硅烷基的聚氧化烯聚合物和4,000-30,000数均分子量（Mn）; 和400-700质量份的导热填料。 一分子中所含的交联性甲硅烷基的数量优选为1.5〜5，通式（1）表示交联性甲硅烷基（其中，R为1-20C取代或未取代的一价有机基团，Rs可以为 存在多个Rs时相同或不同; X为羟基或可水解基团，或者当存在多个X时X可以相同或不同; n为1-3的整数） 。

    Bonding method
    47.
    发明专利
    Bonding method 有权

    公开(公告)号：JP5335507B2

    公开(公告)日：2013-11-06

    申请号：JP2009072152

    申请日：2009-03-24

    Applicant: シャープ化学工業株式会社

    Inventor： 弘武 永江 ,  幹男 村上

    IPC: C09J5/04 ,  C09J171/00 ,  C09J201/10

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesion method in which delicate position adjustment of an adherend, such as an interior panel, adhered once is made possible while securing adhesion strength required for temporary fixing with only an adhesive without using a double-sided adhesive tape and thereafter, adhesion strength of permanently fixing the adherend can be imparted. SOLUTION: The adhesive comprising an adhesive A containing a first polymer having an alkyldialkoxysilyl group at the molecular end and an adhesive B containing a second polymer having a trialkoxysilyl group at the molecular end is used, and the curing speed, obtained when the adhesive A and the adhesive B are mixed, is larger than the curing speed obtained when the adhesive A or the adhesive B is cured in a single form. An unmixed area, where at least one of the adhesive A and the adhesive B is applied, is formed on the adherend surface of at least one adherend, and a mixed area, where the adhesive A and the adhesive B are mixed, is formed immediately before bonding adherends to each other or by bonding the adherends to each other, and then the adherends are bonded to each other. COPYRIGHT: (C)2011,JPO&INPIT

    Reactive hot-melt resin composition and the reactive hot-melt adhesive
    48.
    发明专利
    Reactive hot-melt resin composition and the reactive hot-melt adhesive 有权

    公开(公告)号：JP5290016B2

    公开(公告)日：2013-09-18

    申请号：JP2009075571

    申请日：2009-03-26

    Applicant: コニシ株式会社

    Inventor： 裕孝 五十嵐 ,  和洋 横山

    IPC: C09J201/10 ,  C08K5/098 ,  C08L23/04 ,  C08L101/10 ,  C08L101/12 ,  C09J11/06

    Abstract: PROBLEM TO BE SOLVED: To provide a reactive hot melt resin composition that exhibits the same heat resistance as one comprising a boron halide and/or a boron halide complex and substantially contains neither halogen compounds nor organic tin compounds. SOLUTION: The reactive hot melt resin composition comprises a curable resin (A) bearing a hydrolyzable silicon group in the molecule and a carboxylic acid metal salt (B). The carboxylic acid metal salt (B) is preferably contained in an amount of 0.01-10 pts.mass based on 100 pts.mass of the curable resin (A). The carboxylic acid metal salt (B) is preferably at least one compound selected from carboxylates of calcium, vanadium, iron, titanium, zirconium, cerium, aluminum, potassium, bismuth, barium and zinc. COPYRIGHT: (C)2011,JPO&INPIT

    One-component sealant
    49.
    发明专利
    One-component sealant 审中-公开
    单组分密封剂

    公开(公告)号：JP2013155374A

    公开(公告)日：2013-08-15

    申请号：JP2013027604

    申请日：2013-02-15

    Applicant: Kaneka Corp ,  株式会社カネカ

    Inventor： YANO MASAKO ,  WENDY SMITS

    IPC: C08L101/10 ,  C08K5/12 ,  C09J123/00 ,  C09J133/08 ,  C09J133/10 ,  C09J171/02 ,  C09J201/10 ,  C09K3/10

    Abstract: PROBLEM TO BE SOLVED: To provide a hardenable composition containing an organic polymer having a reactive silicon group as a constituent, produced by using a non-phthalic acid plasticizer, improving hardenability lowering during storage, and excelling in workability, hardenability in a deep section, and surface weatherability.SOLUTION: A hardenable composition includes: an organic polymer (A) having a reactive group containing silicon which is crosslinkable by forming a siloxane bond; and an ester compound (B) of a cycloalkane polycarboxylic acid.

    Abstract translation: 要解决的问题：提供一种可硬化组合物，其含有通过使用非邻苯二甲酸增塑剂制备的具有反应性硅基团的有机聚合物，其具有改善在储存期间的淬透性降低和优异的可加工性，深部的淬透性， 和表面耐候性。溶解性：可硬化组合物包括：具有可通过形成硅氧烷键可交联的含硅反应性基团的有机聚合物（A） 和环烷烃多元羧酸的酯化合物（B）。

    A composition comprising an organic polymer having a reactive silicon group
    50.
    发明专利
    A composition comprising an organic polymer having a reactive silicon group 有权

    公开(公告)号：JP5244413B2

    公开(公告)日：2013-07-24

    申请号：JP2008022534

    申请日：2008-02-01

    Applicant: 株式会社カネカ

    Inventor： 秀典 田中 ,  克勇 若林

    IPC: C08L101/10 ,  C08K5/09 ,  C08K5/31 ,  C08K5/54 ,  C09J11/06 ,  C09J201/10 ,  C09K3/10

    Abstract: PROBLEM TO BE SOLVED: To provide a composition mainly containing an organic polymer with a reactive silicon group, which provides a hardened product exhibiting excellent strength and stretching when used in combination with a silane coupling agent. SOLUTION: The composition contains an organic polymer (A) with a silicon group of the general formula (1):-[Si(R 1 2-b )(X 1 b )O] m Si(R 1 3-a )X 1 a , a silane coupling agent (B), acids (C), a basic compound comprising an amidine compound and/or a guanidine compound (D). In formula (1), R 1 represents a 1C-20C alkyl group, a 6C-20C aryl group, a 7C-20C aralkyl group, or a siloxy group represented by (R') 3 SiO-; R' is a 1C-20C hydrocarbon group; X 1 represents a hydroxy group or a hydrolyzable group; a and b are individually 0 or 1, m pieces of b may be different from each other and satisfy the following formula: a+Σb=1, m represents an integer from 0 to 19. COPYRIGHT: (C)2009,JPO&INPIT

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