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    Method of fabricating printed circuit board
    61.
    发明专利
    Method of fabricating printed circuit board 有权
    制作印刷电路板的方法

    公开(公告)号：JP2006196863A

    公开(公告)日：2006-07-27

    申请号：JP2005242431

    申请日：2005-08-24

    Applicant: Mitsubishi Gas Chem Co Inc ,  Pi R & D Co Ltd ,  三菱瓦斯化学株式会社 ,  株式会社ピーアイ技術研究所

    Inventor： OMORI TAKAFUMI ,  NOZAKI MITSURU ,  NAGATA HIDEFUMI ,  YANO SHINJI

    IPC: H05K3/38 ,  H05K3/24

    Abstract: PROBLEM TO BE SOLVED: To provide a method of fabricating a printed circuit board excellent in an adhesive strength between a surface-layer conductor layer and a surface-layer insulating layer as well as extremely small in a surface roughness of the surface-layer insulating layer, and also suitable for formation of a fine circuit.
    SOLUTION: In the method of fabricating a printed circuit board through removing a surface-layer metal foil of a metal-foil-clad laminated plate and forming a conductor layer on a surface-layer insulating layer by plating, the metal-foil-clad laminated plate is a metal-foil-clad laminated plate that has a block copolymer polyimide resin layer arranged in contact with the surface-layer metal foil.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：为了提供一种制造表面层导体层和表面层绝缘层之间的粘合强度优异的印刷电路板的方法以及表面层导体层的表面粗糙度极小， 层绝缘层，并且也适合于形成精细电路。 解决方案：在通过去除覆盖金属箔的层压板的表面金属箔并通过电镀在表面绝缘层上形成导体层来制造印刷电路板的方法中，金属箔 单层叠层板是具有与表层金属箔接触地布置的嵌段共聚物聚酰亚胺树脂层的金属箔覆层压板。 版权所有（C）2006，JPO＆NCIPI

    Coating die using shim plate and coating method using the same
    64.
    发明专利
    Coating die using shim plate and coating method using the same 审中-公开
    使用薄板的涂料和使用它的涂料方法

    公开(公告)号：JP2004275810A

    公开(公告)日：2004-10-07

    申请号：JP2003067386

    申请日：2003-03-12

    Applicant: Pi R & D Co Ltd ,  株式会社ピーアイ技術研究所

    Inventor： ARAI MASAO ,  MIYAMURA MASATAKA ,  ITAYA HIROSHI

    IPC: B05D1/26 ,  B05C5/02 ,  B05C11/10

    Abstract: PROBLEM TO BE SOLVED: To provide a coating die constituted so as to simply replace a shim plate different in the shape of a slit becoming a coating solution route when a die head is used for coating a resin to obtain a predetermined thickness and width of a coating film, and a coating method using the same.
    SOLUTION: In the coating die, a metal or resin plate having a definite thickness is used as the shim plate for determining the shape of the slit of the die to determine the groove thickness of the slit by a combination of plate thicknesses. The slit for determining the flow of the coating solution is processed into an arbitrary shape according to a program using a numerical value control processing machine like a wire discharge processing machine or a laser processing machine, and the plates having arbitrary slits are superposed one upon another to control a three-dimensional flow. In order to determine the relative positions of a die body (upper and lower lip blocks) and a plurality of shims to set the slits to predetermined positions at the time of replacement of the shims, guide holes are formed to the lip blocks and the shim plate by the numerical value control processing machine. In order to perform the coating of two or more layers by one die set, the flat shim plate is held between shims having slits. When the coating solution is supplied to multiple line slits, holes becoming manifolds are bored in shim plates and the bored shim plates are combined when used.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种涂布模具，其构造成在使用模头来涂覆树脂以获得预定厚度时，简单地替换不同于狭缝形状的垫片，成为涂布溶液路线， 涂膜的宽度和使用其的涂布方法。 解决方案：在涂层模具中，使用具有确定厚度的金属或树脂板作为用于确定模具的狭缝形状的垫片，以通过板厚的组合来确定狭缝的槽厚度。 用于确定涂布溶液的流动的狭缝根据使用诸如放线加工机或激光加工机的数值控制处理机的程序加工成任意形状，并且具有任意狭缝的板彼此重叠 以控制三维流。 为了确定在更换垫片时的模具本体（上唇和下唇块）和多个垫片的相对位置以将狭缝设置到预定位置，导向孔形成到唇块和垫片 板由数值控制加工机。 为了通过一个模具进行两层或更多层的涂布，平垫片保持在具有狭缝的垫片之间。 当涂层溶液被供应到多个线缝隙时，形成歧管的孔在垫板中钻孔，并且当使用时组合钻孔垫片。 版权所有（C）2005，JPO＆NCIPI

    Blocked copolymer polyimide composition for electrodeposition
    65.
    发明专利
    Blocked copolymer polyimide composition for electrodeposition 有权
    用于电沉积的嵌段共聚物聚酰亚胺组合物

    公开(公告)号：JP2003327905A

    公开(公告)日：2003-11-19

    申请号：JP2002131043

    申请日：2002-05-07

    Applicant: Pi R & D Co Ltd ,  株式会社ピーアイ技術研究所

    Inventor： WIN MOO SOO ,  GOSHIMA TOSHIYUKI ,  KYO EIKA ,  ITAYA HIROSHI

    IPC: C09D179/08 ,  C09D5/44

    Abstract: PROBLEM TO BE SOLVED: To obtain a new composition for electrodeposition excellent in smoothness, heat resistance, chemical resistance and uniformity of a film thickness than those of conventional electrodeposited products.
    SOLUTION: This composition for the electrodeposition comprises a blocked copolyimide resin composed of a reaction product of two or more kinds of diamine components containing one kind of aromatic diamine with two or more kinds of acid dianhydrides containing an aromatic tetracarboxylic acid and the other components. The other components is composed of 30-70 wt.% water-soluble polar solvent, 5-20 wt.% alcohols, 5-40 wt.% ion exchange water and 2-10 wt.% solid content composed of a basic nitrogen-containing compound for neutralizing an acid radical of the polyimide resin.
    COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：为了获得与常规电沉积产品相比平滑度，耐热性，耐化学性和膜厚均匀性优异的电沉积组合物。 解决方案：该电沉积组合物包括由两种或多种含有一种芳族二胺与二种或更多种含有芳族四羧酸的酸二酐的二胺组分的反应产物组成的封端共聚酰亚胺树脂，另一种 组件。 其他组分由30-70重量％的水溶性极性溶剂，5-20重量％的醇，5-40重量％的离子交换水和2-10重量％的由碱性氮气 - 所述化合物用于中和所述聚酰亚胺树脂的酸基。 版权所有（C）2004，JPO

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