公开(公告)号：JP2004296915A

公开(公告)日：2004-10-21

申请号：JP2003089038

申请日：2003-03-27

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KONDO KOJI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer circuit board having a low dielectric constant, and suitable for a high frequency circuit.
SOLUTION: The multilayer circuit boards 100, 101 laminate a plurality of thermoplastic resin films formed conductor patterns 20, 30, in which a high frequency conductor pattern 30 formed a high frequency circuit is contained, made of metal foil. In an insulating base material 10 formed by sticking the resin films mutually, the multilayer circuit boards 100, 101 are constituted by forming holes 40, 41 around the high frequency conductor pattern 30.
COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2004111701A

公开(公告)日：2004-04-08

申请号：JP2002273113

申请日：2002-09-19

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  MASUDA GENTARO ,  UEHARA TOSHIHISA ,  TOBARI OSAMU

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board which improves adhesive properties of plating to an inner wall of a through hole and durable reliability.
SOLUTION: In the printed wiring board in which a resin film and a conductor pattern 22 are alternatively laminated, a hole 25 is formed in the resin film at a position on an outer periphery of a through hole forming region, a conductive member 51 is provided in the hole 25 so that the member 51 is formed as a part of the inner wall of a through hole 41. The member 51 couples a conductor pattern 22a surrounding the hole 41. Accordingly, a through hole plating 43 plated in the hole 41 connects the pattern 22a and the member 51 and thereby a structure in which the plating 43 is reinforced is provided.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004087944A

公开(公告)日：2004-03-18

申请号：JP2002248897

申请日：2002-08-28

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KUMAGAI MASANOBU ,  KAI KOJI ,  OKADA MASAO

IPC: B32B37/10 ,  B29C43/20 ,  B29C43/32 ,  B29L9/00 ,  H05K3/00 ,  H05K3/46 ,  B32B31/20

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a logomark-bearing board, and the same logomark-bearing board, wherein its irregularities pressing is made possible, without altering its pressing die. SOLUTION: The manufacturing method of a logomark-bearing board comprises a process for so forming a logo pattern 4 corresponding to a logomark 9 on a resin film 2 softened and deformed, when heating/pressing the resin film 2 as to use the material of the logo pattern 4, whose deformed quantity is less than the resin film 2, when heating/pressing the material of the logo pattern 4, a process for laminating a plurality of resin films, inclusive of the resin film 2 having the logo pattern 4, and a heating/pressing process for so heating/pressing the laminated resin films by using a pressing mold 8 as to bond them to each other. In the heating/pressing process, buffering materials 7, subjected to elastic deformations correspondingly to the logo pattern 4, are so provided in at least one space between the lamination surface of the laminated resin films and the pressing die 8 as to form irregular logomarks 9 in the lamination surfaces of the laminated resin films. Therefore, the logomark-bearing board, having the logomark 9 formed by irregularities can be formed easily, without creating newly the pressing die 8 for each logomark 9. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：为了提供可以在不改变其压模的情况下使不规则压制成为可能的可放置轴承板的制造方法以及相同的标记承载板。 解决方案：对于承载板的制造方法包括在对树脂膜2进行加热/加压以使用该树脂膜2时，在树脂膜2上形成对应于logomark 9的标志图案4软化变形的工序 当加热/压制标志图案4的材料时，其变形量小于树脂膜2的标识图案4的材料，包括具有标志图案的树脂膜2的多个树脂膜的层压工序 以及通过使用压模8将它们彼此粘合来加热/挤压层压树脂膜的加热/压制工艺。 在加热/压制过程中，对应于标识图案4进行弹性变形的缓冲材料7设置在叠层树脂膜的层压表面和压模8之间的至少一个空间中以形成不规则的逻辑9 在层叠树脂膜的层压面上。 因此，可以容易地形成具有由不规则形成的木马标记9的对角板承载板，而不会为每个木马9重新制造压模8.版权所有（C）2004，JPO

公开(公告)号：JP2003332749A

公开(公告)日：2003-11-21

申请号：JP2002223645

申请日：2002-07-31

Applicant: Denso Corp ,  株式会社デンソー

Inventor： MIYAKE TOSHIHIRO ,  TAKEUCHI SATOSHI ,  KONDO KOJI ,  AOYAMA MASAYUKI ,  HARADA TOSHIICHI ,  YAZAKI YOSHITARO ,  TADA KAZUO ,  SHIRAISHI YOSHIHIKO ,  KONISHI SEIJI ,  YAMAZAKI KATSUMI

IPC: H01L23/12 ,  H05K1/16 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4632 ,  H01L2924/0002 ,  H05K1/162 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4688 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09672 ,  H05K2203/0361 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a passive device built-in substrate, as well as its fabrication method, that has passive devices built-in such as a capacitor, resistance, etc., and whose structure and manufacturing steps are simplified. SOLUTION: The passive device built-in substrate has multiple resin films 23 including thermoplastic resin, conductor patterns 22 laminated alternately with these multiple resin films 23, and electrically conductible compositions 51 that electrically connect the conductor patterns 22 embedded in via holes 24 formed in each resin film 23 and set on both sides of each resin film 23. A pair of conductor patterns 22a and 22b are arranged on both sides of the resin film 23 at opposite positions with only the resin film 23 between, thus building a passive device functioning as a capacitor 30 in a multilayer substrate. Accordingly, there is no need to use any special materials and others for building the capacitor 30, and its structure is very streamlined. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供一种内置无源器件的内置基板及其制造方法，其具有诸如电容器，电阻等内置的无源器件，其结构和制造步骤被简化 。 解决方案：无源器件内置衬底具有包括热塑性树脂的多个树脂膜23，与这些多个树脂膜23交替层叠的导体图案22，以及电连接嵌入通孔24中的导体图案22的导电组合物51 每个树脂膜23上形成并设置在每个树脂膜23的两侧。一对导体图案22a和22b布置在树脂膜23的两侧，只有树脂膜23在相对的位置，从而构成被动 器件在多层衬底中用作电容器30。 因此，不需要使用任何特殊的材料和其他来构建电容器30，并且其结构非常流线。 版权所有（C）2004，JPO

公开(公告)号：JP2003273511A

公开(公告)日：2003-09-26

申请号：JP2002100113

申请日：2002-04-02

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KAMIYA YASUTAKA ,  NAKAMURA KAZUYOSHI ,  SAKAI YOSHIAKI ,  KAJINO HIDETADA ,  ASANUMA SHINTARO

IPC: B29C43/18 ,  B29C43/20 ,  B29C43/32 ,  B29L9/00 ,  H05K1/11 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To bond a plurality of resin films in a batch by a heading/pressurizing process by preventing the occurrence of displacement in a conductor pattern formed on a resin film. SOLUTION: A plurality of single-sided conductor pattern films 21 are laminated, and heated/pressurized from both sides so that the conductor pattern films 21 can be bonded to each other to form a multi-layer board 100. In heating/ pressurizing those conductive pattern films, members 12a and 12b for press having buffering effects are interposed between thermal press boards 10a and 10b and the single-sided conductor pattern films 21. Thus, pressures to be applied to the respective parts of the laminated single-sided conductor pattern films 21 can be made almost uniform. Therefore, the whole laminated single-sided conductive pattern films 21 are almost simultaneously deformed so that the displacement in a conductor pattern 22 formed on each of those films 21 can be prevented. COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：通过防止在形成在树脂膜上的导体图案中发生位移，通过航向/加压工艺来批量地粘合多个树脂膜。 解决方案：多个单面导体图案膜21被层叠并从两侧加热/加压，使得导体图案膜21可以彼此接合以形成多层板100.在加热/ 对这些导电图案膜进行加压，在热压板10a和10b与单面导体图案膜21之间插入具有缓冲效果的用于压制的构件12a和12b。因此，施加到层压单面的各个部分的压力 可以使导体图案膜21几乎均匀。 因此，整个层叠的单面导电图案膜21几乎同时变形，从而可以防止形成在每个膜21上的导体图案22中的位移。 版权所有（C）2003，JPO

公开(公告)号：JP2003037361A

公开(公告)日：2003-02-07

申请号：JP2001222060

申请日：2001-07-23

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KAMIYA YASUTAKA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer board, where laminated resin films can be prevented from getting out of position, and the laminated conductor patterns of the multilayer board are surely interconnected. SOLUTION: Laminated resin films 23 are partially melted by heating so as to be temporarily fixed before the resin films 23 are positioned, laminated, and bonded together through a thermocompression bonding process in a case of laminating resin films 23 of thermoplastic resin into a multilayer board 10. By this setup, the laminated resin films 23 can be easily, surely, and temporarily fixed, so that the laminated resin films 23 can be prevented from getting out of position.

Abstract translation: 要解决的问题：提供一种制造多层板的方法，其中可以防止层压树脂膜脱离位置，并且多层板的层压导体图案可靠地互连。 解决方案：在将热塑性树脂的树脂薄膜23层合成多层板的情况下，通过加热将层压树脂薄膜23部分熔融，以便在树脂薄膜23定位，层压和粘接在一起之前暂时固定， 通过该设置，可以容易且可靠地暂时地固定层叠树脂膜23，从而可以防止层叠树脂膜23脱离位置。

公开(公告)号：JP2003014553A

公开(公告)日：2003-01-15

申请号：JP2001195372

申请日：2001-06-27

Applicant: Denso Corp ,  株式会社デンソー

Inventor： ARAI TAKESHI ,  KONDO KOJI ,  HARADA TOSHIICHI ,  ONOE TSUTOMU

IPC: G01K7/02

Abstract: PROBLEM TO BE SOLVED: To provide a temperature sensor having a plurality of independent thermocouples whose manufacturing process is not complex and whose costs can be reduced, and to provide a manufacturing method of the temperature sensor.
SOLUTION: First, a one-sided conductor pattern film 11 where a copper wire-like conductor pattern 12 is formed on one surface of a resin film 13 by etching and conductive paste 50 is filled into a via hole 14, and a one-sided conductor pattern film 21 where a nickel wire-like conductor pattern is formed on one surface of a resin film 23 by etching are stacked alternately and are heat-pressed, thus bonding each of the conductor pattern films 11 and 21, at the same time forming a coupling section where a pair of conductor patterns 11 and 21 is electrically connected. Then, the tip side is eliminated up to a position where the coupling section 60 is exposed, thus obtaining a temperature sensor 10 having a plurality of independent paired thermocouples.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：提供一种温度传感器，其具有多个独立的热电偶，其制造过程不复杂并且其成本可以降低，并且提供温度传感器的制造方法。 解决方案：首先，通过蚀刻和导电膏50在树脂膜13的一个表面上形成铜线状导体图案12的单面导体图案膜11被填充到通孔14中，并且单面 通过蚀刻在树脂膜23的一个表面上形成镍线状导体图案的导体图案膜21交替堆叠并被热压，从而接合每个导体图案膜11和21，同时形成 其中一对导体图案11和21电连接的耦合部分。 然后，将尖端侧消除到连接部60露出的位置，得到具有多个独立成对的热电偶的温度传感器10。

公开(公告)号：JP2002018569A

公开(公告)日：2002-01-22

申请号：JP2000205062

申请日：2000-07-06

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  MIKURA HIDEHIRO ,  AKITA NAOYUKI ,  MATSUNAGA YASUAKI ,  HARADA TOSHIICHI

IPC: B23K1/00 ,  B23K1/008 ,  B23K31/02 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To improve reliability in strength of a soldering part even through the soldering is performed at a low cost. SOLUTION: A printed board 13 is composed of lots of alley shaped electrodes 14 corresponding to the solder balls 12 of CSP parts 11. The electrode 14 is composed of (a) an electroless nickel plating layer 17 and further an electroless gold plating layer 18 formed on the surface of an electrode substrate 16 consisting of a coper foil. Solder paste 19 is printed and applied (b) to the electrode 14 of the printed board 13 and the CSP parts 11 are mounted. By performing a reflow soldering process in which the printed circuit board 13 is passed through the inside of a reflow furnace at a prescribed speed, a solder joint 20 is formed (d). At this time, by the control of the moving speed of the printed circuit board 13, a time required for the printed circuit board 13 passing through a reflow temperature band becoming 185 deg.C or over, that is, a time in which the solder paste 19 has been melted, is secured for 60 seconds or over, in this case about 90 to 100 seconds are secured.