公开(公告)号：JP2010219158A

公开(公告)日：2010-09-30

申请号：JP2009061922

申请日：2009-03-13

Applicant: Denso Corp ,  株式会社デンソー

Inventor： SUKEGAWA TAKUSHI ,  AKITA NAOYUKI

IPC: H05K3/34

CPC classification number: B23K1/008 ,  B23K2201/40 ,  B23K2201/42

Abstract: PROBLEM TO BE SOLVED: To provide a reflow soldering method that does not allow flux component to evaporate into atmospheric gas to prevent various problems resulting from that the flux contained in solder paste evaporates in the atmospheric gas and the flux component is hardened from occurring.
SOLUTION: A reflow soldering method includes: a step of carrying and installing a work to which reflow soldering should be carried out into a processing chamber which can be sealed; a step of sealing the processing chamber; a step of flowing inactive gas pressurized to a pressure higher than the saturated vapor pressure at a solder wax melting temperature of the flux contained in the solder wax attached to the work, into the processing chamber; a step of heating the work to a reflow soldering temperature and keeping the temperature of the work constant with maintaining the processing chamber to the pressure higher than the saturated vapor pressure; and a step of melting the solder wax attached to the work by the previous step to carry out reflow soldering.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种回流焊接方法，其不允许助熔剂组分蒸发到大气中，以防止由于焊料中所含的焊剂在大气中蒸发而导致的各种问题，并且助焊剂组分从 发生。 回流焊接方法包括：将要进行回流焊接的工件搬运和安装到可以密封的处理室中的步骤; 密封处理室的步骤; 将附着在工件上的焊料蜡中包含的焊剂的焊锡蜡熔融温度下升压至高于饱和蒸汽压的压力的惰性气体进入处理室的步骤; 将工件加热到回流焊接温度并保持工作温度恒定的步骤，同时使处理室保持高于饱和蒸汽压力的压力; 以及通过前一步骤熔化附着在工件上的焊料蜡以进行回流焊接的步骤。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2003324280A

公开(公告)日：2003-11-14

申请号：JP2002131060

申请日：2002-05-07

Applicant: Denso Corp ,  株式会社デンソー

Inventor： AKITA NAOYUKI ,  ECHIGO SUSUMU

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board which assures excellent interlayer connection reliability and includes a higher density multilayer structure manufactured at a lower cost.
SOLUTION: A conductor pattern 5 is formed on one surface of a resin sheet 1 composed of a thermosetting resin, and a via hole 5 reaching the conductor pattern is formed on the other surface. A plurality of processing resin sheets 6 are laminated by precipitating and filling a low melting point metal 4 as an interlayer connection material in the via hole 3 by plating. Each processing resin sheet 6 is bonded simultaneously by pressurization and heat treatment under the this condition. By the heat treatment and pressurization, the low melting point metal 4 is connected to the adjacent conductor pattern 5 by a metal coupling process. Accordingly, the printed circuit board 8 having an excellent interlayer connection property which enables high density wiring can be manufactured at a lower cost.
COPYRIGHT: (C)2004,JPO

Abstract translation: 解决的问题：提供确保优异的层间连接可靠性并且包括以较低成本制造的更高密度多层结构的印刷电路板的制造方法。 解决方案：导体图案5形成在由热固性树脂构成的树脂片1的一个表面上，并且在另一个表面上形成到达导体图案的通孔5。 通过电镀在通孔3中沉淀并填充作为层间连接材料的低熔点金属4来层叠多个加工树脂片6。 在这种条件下，通过加压和热处理将每个加工树脂片6同时粘合。 通过热处理和加压，低熔点金属4通过金属连接工艺连接到相邻的导体图案5。 因此，能够以更低的成本制造具有优异的层间连接性能的印刷电路板8，能够实现高密度布线。 版权所有（C）2004，JPO

公开(公告)号：JP2002094242A

公开(公告)日：2002-03-29

申请号：JP2000280489

申请日：2000-09-14

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  HIRAMATSU TOMOYUKI ,  MIKURA HIDEHIRO ,  AKITA NAOYUKI

IPC: H05K1/09 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a material for connecting layers capable of preventing the reliability of connection between the layers from being reduced in a heating process after connecting the layers and a method for manufacturing a printed multi-layer board using the material. SOLUTION: Paste 50 applied in a via hole, as shown in Fig. (a), has the first metallic particles 51 containing 42 weight % Sn and 58% Bi and the second metallic particles 52 of copper powder. When the paste 50 is heated to 180 deg.C, as shown in Fig. (b), the first metallic particles are melted and diffused into the outer peripheral portions of the second metallic particles 52 to form, with the copper, alloy layers 53 having a solid phase temperature of 250 deg.C or higher, and then the alloy layers 53 are bonded to each other to connect the layers. Therefore, because the alloy layer 53 is not melted in a heating process at about 230 deg.C after connecting the layers, it is possible to prevent the reliability of connection between the layers from being reduced.

公开(公告)号：JP2013008919A

公开(公告)日：2013-01-10

申请号：JP2011141930

申请日：2011-06-27

Applicant: Denso Corp ,  株式会社デンソー

Inventor： YAMAOKA TADASHI ,  ARAI TAKESHI ,  AKITA NAOYUKI ,  ASAI YASUTOMI

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/3135 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To increase the bonding strength of a coating film to a circuit component for suppressing the occurrence of separation between layers and a crack in a package.SOLUTION: A method for manufacturing a package into which a circuit component (20) is integrally sealed with a mold resin (40) comprises: a coating step where at least one part of the surface of the circuit component (20) opposed to the mold resin (40) is covered with a coating film (30) for suppressing the separation from the mold resin (40); and a molding step where the mold resin (40) is shaped, whereby the circuit component (20) covered with the coating film (30) is integrally sealed. In the coating step, a coating material (31) for forming the coating film (30) is exposed to plasma (33) and brought into its active condition before deposition on the surface of the circuit component (20), and then deposited on the surface of the circuit component (20) in an active condition.

Abstract translation: 要解决的问题：为了提高涂膜与电路部件的接合强度，以抑制层间的分离发生和包装中的裂纹。 解决方案：一种用于制造电路部件（20）与模制树脂（40）一体密封的封装的方法包括：涂覆步骤，其中所述电路部件（20）的表面的至少一部分相对 模塑树脂（40）被覆盖有用于抑制与模制树脂（40）分离的涂膜（30）。 以及模塑树脂（40）成形的成型步骤，由涂覆膜（30）覆盖的电路部件（20）被一体地密封。 在涂布步骤中，用于形成涂膜（30）的涂料（31）暴露于等离子体（33）中并在沉积到电路部件（20）的表面之前进入其活性状态，然后沉积在 处于活动状态的电路部件（20）的表面。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2007250772A

公开(公告)日：2007-09-27

申请号：JP2006071235

申请日：2006-03-15

Applicant: Denso Corp ,  株式会社デンソー

Inventor： SUGURO HAJIME ,  AKITA NAOYUKI

IPC: H05K1/18

Abstract: PROBLEM TO BE SOLVED: To provide an electronic control apparatus which can be miniaturized while ensuring the life of a connection against cooling-and-heating cycle to an electronic component mounted by soldering. SOLUTION: Rectangular chip components 20, 21 are mounted on a circuit board 10, this circuit board 10 is held by a lower case 1, the circuit board 10 is received in the combination of the lower case 1 and an upper case 2, and the circuit board 10 is fixed to the lower case 1 with screws. As to the sizes of the rectangular chip components 20, 21 mounted on each of front and rear surfaces of the circuit board 10, they are made not larger than the maximum size determined for each of the front and rear surfaces according to the warped shape of the circuit board 10 before it is attached to the case (1, 2) and the material of the lower case 1. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种电子控制装置，其可以在确保与通过焊接安装的电子部件的冷却和加热循环的连接的寿命的同时小型化。 解决方案：矩形芯片部件20,21安装在电路板10上，该电路板10由下壳体1保持，电路板10被接收在下壳体1和上壳体2的组合中 电路板10用螺钉固定在下壳体1上。 对于安装在电路板10的前表面和后表面中的矩形芯片组件20,21的尺寸，它们不大于根据前后表面的翘曲形状确定的最大尺寸 电路板10在其附接到壳体（1,2）和下壳体1的材料之前。版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2002344122A

公开(公告)日：2002-11-29

申请号：JP2001148406

申请日：2001-05-17

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  HIRAMATSU TOMOYUKI ,  AKITA NAOYUKI

IPC: H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board and is manufacturing method for preventing cracks at the corner of a rectangular opening of a solder resist film formed on the surface. SOLUTION: The solder resist film 32 has a rectangular opening 33 that exposes a land 21a of a conductive pattern 12. A corner 33a of the opening 33 has almost an arc shape with a curvature radius of 50 μm or more. Even when the printed circuit board 101 is exposed to high-temperature circumstances, the corner 33a of the opening 33 is protected from the concentration of stress. Then, cracks at the corner 33a of the opening 33 can be prevented.

公开(公告)号：JP2012156195A

公开(公告)日：2012-08-16

申请号：JP2011012052

申请日：2011-01-24

Applicant: Denso Corp ,  株式会社デンソー

Inventor： SAKUMA TAKASHI ,  AKITA NAOYUKI

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To reduce stress on solder by decreasing the difference of an expansion/contraction degree between a circuit substrate and an electronic component joined to the circuit substrate by soldering, in an electronic device mounted with the electronic component on the circuit substrate by soldering.SOLUTION: A circuit substrate 10 has a linear expansion coefficient larger than that of an electronic component 20. The electronic component 20 is fixed to the circuit substrate 10 at a first electrode 21 and a second electrode 22 through solder 30. A part 13 between fixed portions which is a part positioned between a fixed portion of the first electrode 21 and a fixed portion of the second electrode 22 of the circuit substrate 10 is provided with trough-holes 14 on one surface 11. Therefore, a degree of thermal expansion and thermal contraction of the part 13 between the fixed portions is smaller than that of a part except for the part 13 between the fixed portions of the circuit substrate 10.

Abstract translation: 要解决的问题：通过在安装有电子部件的电子装置中通过焊接减小电路基板与连接到电路基板的电子部件之间的膨胀/收缩程度的差异来减小焊料的应力 电路基板通过焊接。 解决方案：电路基板10的线膨胀系数大于电子部件20的线膨胀系数。电子部件20通过焊料30在第一电极21和第二电极22处固定到电路基板10。 在位于第一电极21的固定部分和电路基板10的第二电极22的固定部分之间的部分的固定部分13之间的一个表面11上设置有槽孔14，因此， 固定部分之间的部分13的膨胀和热收缩小于除了电路基板10的固定部分之间的部分13以外的部分的膨胀和热收缩。（C）2012，JPO＆INPIT

公开(公告)号：JP2002018569A

公开(公告)日：2002-01-22

申请号：JP2000205062

申请日：2000-07-06

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  MIKURA HIDEHIRO ,  AKITA NAOYUKI ,  MATSUNAGA YASUAKI ,  HARADA TOSHIICHI

IPC: B23K1/00 ,  B23K1/008 ,  B23K31/02 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To improve reliability in strength of a soldering part even through the soldering is performed at a low cost. SOLUTION: A printed board 13 is composed of lots of alley shaped electrodes 14 corresponding to the solder balls 12 of CSP parts 11. The electrode 14 is composed of (a) an electroless nickel plating layer 17 and further an electroless gold plating layer 18 formed on the surface of an electrode substrate 16 consisting of a coper foil. Solder paste 19 is printed and applied (b) to the electrode 14 of the printed board 13 and the CSP parts 11 are mounted. By performing a reflow soldering process in which the printed circuit board 13 is passed through the inside of a reflow furnace at a prescribed speed, a solder joint 20 is formed (d). At this time, by the control of the moving speed of the printed circuit board 13, a time required for the printed circuit board 13 passing through a reflow temperature band becoming 185 deg.C or over, that is, a time in which the solder paste 19 has been melted, is secured for 60 seconds or over, in this case about 90 to 100 seconds are secured.

公开(公告)号：JP2014012386A

公开(公告)日：2014-01-23

申请号：JP2012151446

申请日：2012-07-05

Applicant: Denso Corp ,  株式会社デンソー

Inventor： YOSHIMURA YOHEI ,  NAKANO RYOICHI ,  INOUE TETSUSHI ,  AKITA NAOYUKI

IPC: B29C43/34 ,  B29C43/02 ,  B29C43/56 ,  B29C51/08 ,  B29C51/20 ,  B29C51/30

Abstract: PROBLEM TO BE SOLVED: To provide a resin press molding method in which non-uniform cooling of a molten resin in a transportation process in resin press is suppressed, and favorable cooling is performed in a press process; and an apparatus of the same.SOLUTION: In a resin press molding method in which a molten resin R excluded in vertical downward from a die 51 is pressed by stationary molds 3, 4 fixed and disposed in left and right, and a movable mold 2 movably disposed in the middle and in a cross direction, alternately in a prescribed shape; a sheet material 60 is supplied and maintained to/at one surface of the movable mold, in the molten resin, a state in which the sheet material is temporarily adhered to a moving movable mold surface is kept, the molten resin is transported to the corresponding stationary mold. Two or more salients 23 are formed in the movable mold surface, a heat insulation air layer H is formed between the sheet material and the movable mold, and thereby cooling of the molten resin in transportation is suppressed.

Abstract translation: 要解决的问题：提供一种树脂压制成型方法，其中抑制树脂压榨机中的输送过程中的熔融树脂的不均匀冷却，并且在冲压加工中进行良好的冷却; 及其装置。本发明提供一种树脂压制成型方法，其中从模具51垂直向下排列的熔融树脂R被固定并左右固定的固定模3,4按压，并且可动模2 可移动地设置在中间和十字方向上，交替地以规定的形状; 在熔融树脂中将片材60供给并保持在可动模具的一个表面上，保持片材临时粘附到移动的可动模具表面的状态，将熔融树脂输送到相应的 固定模具。 在可动模具表面形成有两个以上的凸部23，在片材与活动模具之间形成绝热空气层H，抑制了输送时的熔融树脂的冷却。

公开(公告)号：JP2012166425A

公开(公告)日：2012-09-06

申请号：JP2011028466

申请日：2011-02-14

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TERA AKINOSUKE ,  YAMAOKA TADASHI ,  ARAI TAKESHI ,  AKITA NAOYUKI ,  ASAI YASUTOMI

IPC: B29C33/02 ,  B29C33/38 ,  B29C33/58

Abstract: PROBLEM TO BE SOLVED: To provide a molding apparatus capable of irradiating with plasma a mold surface while closing the mold.SOLUTION: The apparatus includes a mold 10 where a molten material is sent in and plasma electrodes 12, 13 to generate plasma; wherein plasma irradiation holes 101a, 102a are provided to the mold 10 for irradiating an interior space 11 of the mold 10 with plasma generated by the plasma electrodes 12, 13, the plasma irradiation holes 101a, 102a may has pin holes 101a, 102a for inserting release pins 12, 13 and the plasma electrodes may include the release pins 12, 13.

Abstract translation: 要解决的问题：提供一种能够在关闭模具的同时照射等离子体模具表面的成型设备。 解决方案：该装置包括：模具10，其中熔融材料被送入和等离子体电极12,13以产生等离子体; 其中等离子体照射孔101a，102a设置在模具10中，用于用等离子体电极12,13产生的等离子体照射模具10的内部空间11，等离子体照射孔101a，102a可以具有用于插入的针孔101a，102a 释放销12,13，等离子体电极可以包括释放销12,13。版权所有：（C）2012，JPO＆INPIT