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公开(公告)号：JP2012211566A
公开(公告)日：2012-11-01
申请号：JP2011078484
申请日：2011-03-31
Applicant: Denso Corp , 株式会社デンソー
Inventor： KUROYANAGI MASATOSHI , URUSHIZAKI MAMORU , MATSUNAGA YASUAKI
CPC classification number: F02M59/102 , F02M59/48 , F04B7/04 , F04B19/22 , F04B39/121 , F04B39/122 , F04B39/127 , F04B39/14
Abstract: PROBLEM TO BE SOLVED: To provide a high pressure pump that can be reduced in the weight of housings, and can sufficiently secure a sealing property between a cylinder and the housings.SOLUTION: The combustion pressure of a pressurization chamber 14 is received by a cylinder inner wall 131 and a plunger 51 in a pressurization stroke of the high pressure pump 1. Alternatively, since the upper housing 15 does not directly receive an operation force generated by the combustion pressure of the pressurization chamber 14, the housing can be thinned in thickness and reduced in weight. Furthermore, the cylinder 13 is formed with a bottom 132, a tubular part 133 and a large-diameter tubular part 134. When manufacturing the high pressure pump 1, the bottom 132 and the tubular part 133 do not contact with the lower housing 11 when inserting the cylinder 13 into the lower cylinder 11. By this arrangement, the upper housing 15 can be inserted into the bottom 132 and the tubular part 133 while maintaining the accuracy of the bottom 132 and the external peripheral wall of the tubular part 133, and a high fluid-tight property can be secured between and among the bottom 132, the tubular part 133 and a small inside-diameter engagement hole 151.
Abstract translation: 要解决的问题：提供可以减小壳体重量的高压泵，并且可以充分确保气缸和壳体之间的密封性能。 解决方案：加压室14的燃烧压力由高压泵1的加压行程中的气缸内壁131和柱塞51容纳。或者，由于上壳体15不直接接收操作力 由加压室14的燃烧压力产生的，壳体的厚度可以变薄并且重量减轻。 此外，气缸13形成有底部132，管状部分133和大直径管状部分134.当制造高压泵1时，底部132和管状部分133不与下部壳体11接触，当 将气缸13插入下气缸11.通过这种布置，上壳体15可以在保持底部132和管状部分133的外周壁的精度的同时插入底部132和管状部133，以及 在底部132，管状部分133和小的内径接合孔151之间和之间可以确保高流体密封特性。版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2004034162A
公开(公告)日：2004-02-05
申请号：JP2002190367
申请日：2002-06-28
Applicant: Denso Corp , 株式会社デンソー
Inventor： MATSUNAGA YASUAKI
Abstract: PROBLEM TO BE SOLVED: To reduce a disposition area in a production line composed by connecting a plurality of production facilities. SOLUTION: First to fifth production facilities 21-25 are provided to perform first to fifth processes to workpieces. In the first to the third production facilities 21-23, a main carrier 28 is provided on the closer side as seen from the base of a work part 27, with the direction of an arrow A set as the carrying direction, so that work is conducted at the work part 27, and a buffer carrier 29 is provided on the farther side, with the direction of an arrow B as the carrying direction, so that workpieces can be stored. In the fourth and the fifth production facilities 24 and 25, a main carrier 30 is provided on the farther side, with the direction of the arrow B set as the carrying direction, and on the closer side, a buffer carrier 31 is provided, with the direction of the arrow A as the carrying direction. The first production facility 21, the fifth production facility 25, the second production facility 22, the fourth production facility 24, and the third production facility 23 are disposed in this order from left to right in drawing, and a return part 32 to U-turn the workpieces is provided on the right side of the third production facility 23. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2003139245A
公开(公告)日：2003-05-14
申请号：JP2001333204
申请日：2001-10-30
Applicant: DENSO CORP
Inventor： MATSUNAGA YASUAKI , NAKAYAMA AKINORI
Abstract: PROBLEM TO BE SOLVED: To provide an O-ring removing device which removes an O-ring and fitting parts therefor without damaging them, with reduced working time. SOLUTION: This O-ring removing device comprises: a pressing means 3 for pressing the O-ring by applying a load to a pressure body 32 to be pressed at a prescribed angle against at least two points on the outer periphery of the O-ring 2 fitted on the fitting parts 1; and an expansion means 4 which has at least two pawls 41 to be inserted into a clearance g between the O-ring formed by pressure against the O-ring and the fitting parts and which further expands the O-ring by increasing a clearance between the pawls.
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公开(公告)号：JP2002018569A
公开(公告)日：2002-01-22
申请号：JP2000205062
申请日：2000-07-06
Applicant: DENSO CORP
Inventor： ECHIGO SUSUMU , MIKURA HIDEHIRO , AKITA NAOYUKI , MATSUNAGA YASUAKI , HARADA TOSHIICHI
Abstract: PROBLEM TO BE SOLVED: To improve reliability in strength of a soldering part even through the soldering is performed at a low cost. SOLUTION: A printed board 13 is composed of lots of alley shaped electrodes 14 corresponding to the solder balls 12 of CSP parts 11. The electrode 14 is composed of (a) an electroless nickel plating layer 17 and further an electroless gold plating layer 18 formed on the surface of an electrode substrate 16 consisting of a coper foil. Solder paste 19 is printed and applied (b) to the electrode 14 of the printed board 13 and the CSP parts 11 are mounted. By performing a reflow soldering process in which the printed circuit board 13 is passed through the inside of a reflow furnace at a prescribed speed, a solder joint 20 is formed (d). At this time, by the control of the moving speed of the printed circuit board 13, a time required for the printed circuit board 13 passing through a reflow temperature band becoming 185 deg.C or over, that is, a time in which the solder paste 19 has been melted, is secured for 60 seconds or over, in this case about 90 to 100 seconds are secured.
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公开(公告)号：JP2013142303A
公开(公告)日：2013-07-22
申请号：JP2012002174
申请日：2012-01-10
Applicant: Denso Corp , 株式会社デンソー
Inventor： MATSUMOTO TEPPEI , MATSUNAGA YASUAKI
Abstract: PROBLEM TO BE SOLVED: To provide a high pressure pump capable of restraining a burr generated when a cylinder is pressed in from being mixed in fluid.SOLUTION: A cylinder 30 has a cylinder part 31 for slidably supporting a plunger 20 by an inner wall, a bottom 32 for blocking up one end of the cylinder part 31, a pressurizing chamber 33 formed of the bottom 32, the inner wall of the cylinder part 31 and an outer wall of one end of the plunger 20, a suction hole 34 for sucking fuel in the pressurizing chamber 33, and a delivery hole 35 for delivering the fuel pressurized by the pressurizing chamber 33. An upper housing 41 has a cylinder press-in hole 42 for pressing in the cylinder 30 from the bottom 32 side, a suction passage 43 communicating with the suction hole 34 and a delivery passage 44 communicating with the delivery hole 35. The cylinder 30 has a first groove 81 for forming a first clearance between the inner wall of the cylinder press-in hole 42 and itself by recessing inwardly in the radial direction at the opposite side of the bottom 32 of the suction hole 34 on the outer wall of the cylinder part 31 and at the opposite side of the bottom 32 of the delivery hole 35 on the outer wall of the cylinder part 31.
Abstract translation: 要解决的问题：提供一种能够抑制当气缸被压入流体时产生的毛刺的高压泵。解决方案：气缸30具有用于通过内壁可滑动地支撑柱塞20的气缸部31， 用于封闭气缸部31的一端的底部32，由底部32形成的加压室33，气缸部31的内壁和柱塞20的一端的外壁，吸入孔34 加压室33中的燃料，以及用于输送由加压室33加压的燃料的排出孔35.上壳体41具有用于从底部32侧压入缸30的缸压入孔42， 43与抽吸孔34连通，以及与输送孔35连通的输送通道44.气缸30具有第一凹槽81，用于在气缸压入孔42的内壁与本身之间形成第一间隙， 在气缸部31的外壁上的吸入孔34的底部32的相反侧的径向方向上和在气缸部31的外壁上的输送孔35的底部32的相反侧 。
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Patent Agency Ranking
公开(公告)号：JP2005345195A
公开(公告)日：2005-12-15
申请号：JP2004163345
申请日：2004-06-01
Applicant: Denso Corp , 株式会社デンソー
Inventor： NAKAYAMA AKINORI , MIZUTANI HITOSHI , MATSUNAGA YASUAKI
Abstract: PROBLEM TO BE SOLVED: To permit measurement of coaxiality in a short time, which relates to a coaxiality measuring device.
SOLUTION: The coaxiality measuring device is provided with: a rotational mechanism 3 for rotating a workpiece 1 to prescribed rotational positions in order; a first sensor 41 for measuring the radial position of the outer circumferential surface in a first cylindrical part 11; a second sensor 42 for measuring the radial position of the outer circumferential surface in a second cylindrical part 12; and a computational means 6 for calculating the coaxiality of the first cylindrical part 11 and the second cylindrical part 12, on the basis of the rotational position data from the rotational mechanism 3 and the measurement data of the first and second sensors 42. Because the first cylindrical part 11 and the second cylindrical part 12 can be simultaneously measured, the coaxiality can be measured in a short time.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：允许在短时间内测量与同轴度测量装置有关的同轴度。 ＆lt; P＆gt;解决方案：同轴度测量装置设有：用于将工件1依次旋转到规定旋转位置的旋转机构3; 第一传感器41，用于测量第一圆筒部11中的外周面的径向位置; 第二传感器42，用于测量第二圆柱形部分12中的外圆周表面的径向位置; 以及用于根据来自旋转机构3的旋转位置数据和第一和第二传感器42的测量数据计算第一圆柱形部分11和第二圆柱形部分12的同轴度的计算装置6。 可以同时测量圆柱形部分11和第二圆柱形部分12，可以在短时间内测量同轴度。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2001230513A
公开(公告)日：2001-08-24
申请号：JP2000036571
申请日：2000-02-15
Applicant: DENSO CORP
Inventor： HARADA TOSHIICHI , SUZUKI TADAO , MATSUNAGA YASUAKI
Abstract: PROBLEM TO BE SOLVED: To improve bonding reliability to impacts, such as impact of falling and both warp and bending, in bonding wherein an electrode of a surface mount ing component is bonded on a land of a surface part through soldering. SOLUTION: A land 22 of a printed board 11 is formed into an elliptical shape having sufficiently large area to a solder bonding surface 22a, to which a solder ball 13 is bonded. An aperture part 23a arranged on a resist film 23 is formed into a circular shape, where rightward eccentricity is made to the land 22 and a part of the aperture part 23a is protruded from the land 22. As a result, a part of an outer peripheral edge of the land 22 is made an over- resist structure covered with the resist film 23, and the rest is made a nonover- resist structure, where a fine gap S is formed to the resist film 23.
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公开(公告)号：JP2003060587A
公开(公告)日：2003-02-28
申请号：JP2001242712
申请日：2001-08-09
Applicant: Denso Corp , 株式会社デンソー
Inventor： KONDO KENJI , MATSUNAGA YASUAKI , TAKEUCHI TATEO
Abstract: PROBLEM TO BE SOLVED: To provide a shielding box capable of reducing the number of working steps needed for opening/closing a door and attaching/detaching a connector and securing stable shielding performance during measurement by air connection.
SOLUTION: In the shielding box provided with a case 10 having an opening 10a and a door 11 for opening or closing the opening 10a; a work holding section 12 sliding inside the case 10 and housing a work 100 so that the work 100 is fixed therein is provided on the door 11, and a guiding section 13 for guiding the section 12 and a connector 14 to be connected to the work 100, are provided inside the case 10. When the door 11 closes the opening 10a, the section 12 slides along the section 13 so that the door 11 closes the opening 10a, and at the same time, the work 100 fixed on the section 12 is connected to the connector 14.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：提供一种屏蔽盒，其能够减少打开/关闭门并连接/拆卸连接器所需的工作步骤的数量，并通过空气连接在测量期间确保稳定的屏蔽性能。 解决方案：在具有开口10a的壳体10和用于打开或关闭开口10a的门11的屏蔽箱中， 在门11上设置有在壳体10内滑动并容纳工件100以使工件100固定在其中的工件保持部分12，以及用于引导部分12的引导部分13和连接到工件的连接器14 100设置在壳体10的内部。当门11关闭开口10a时，部分12沿着部分13滑动，使得门11关闭开口10a，同时固定在部分12上的工件100 连接到连接器14。
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公开(公告)号：JP2002043466A
公开(公告)日：2002-02-08
申请号：JP2000231362
申请日：2000-07-26
Applicant: DENSO CORP
Inventor： MATSUNAGA YASUAKI , AOYAMA MASAYUKI , TAKEMOTO MASANORI , MIZUNO SATORU , ECHIGO SUSUMU , KONDO KOJI
Abstract: PROBLEM TO BE SOLVED: To prevent the constriction of the ball end of the inside of the opening of an interposer in the package of a ball grid array(BGA). SOLUTION: In the BGA package, a soldering terminal is composed of two kinds or more of materials, and the melting point T1 of the material existing in the opening of the interposer is higher than the melting point T1 of the material existing out of the opening of the interposer.
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公开(公告)号：JP2001217514A
公开(公告)日：2001-08-10
申请号：JP2000026346
申请日：2000-02-03
Applicant: DENSO CORP
Inventor： ECHIGO SUSUMU , SUZUKI TADAO , MATSUNAGA YASUAKI
Abstract: PROBLEM TO BE SOLVED: To improve the connection reliability of a solder joint part by suppressing curvature deformation accompanying heating and cooling as to a multi-layered wiring board having surface-mounted components soldered on its mount surface. SOLUTION: The multi-layered wiring board 11 has on both the top and reverse sides of a core base material 14 a built-up layer formed by stacking two insulating layers 15a and 15b, and a built-up layer 16 formed by stacking two insulating layers 16a and 16b. A conductor pattern 17 is provided between both the top and reverse sides of the multi-layered wiring board 11 and the insulating layers and lands 17a corresponding to solder bumps 13 of a surface- mounted component 12 are provided on the mount surface. The surface-mounted component 12 is mounted on the lands 17a coated with solder paste so that the solder bumps 13 are mounted, and then soldered by solder flow heating. At this time, the insulating layers 15a and 15b on the mount surface side are formed of resin materials which have a larger modulus of elasticity or a smaller coefficient of thermal expansion than the insulating layers 16a and 16b on the opposite surface side.
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