CURING ACCELERATOR FOR EPOXY RESIN
    63.
    发明专利

    公开(公告)号:JPH08301988A

    公开(公告)日:1996-11-19

    申请号:JP12736295

    申请日:1995-04-28

    发明人: JINBO SUSUMU

    IPC分类号: C07C275/28 C08G59/54

    摘要: PURPOSE: To improve storage stability and low-temp. curability without incorporating any halogen by using a particular compd. for curing an epoxy resin. CONSTITUTION: Naphthylene 1,5-diisocyanate is reacted with a di(lower alkyl) amine in an at least stoichiometric amt. to prepare a curing accelerator for an epoxy resin, comprising a compd. of the formula (wherein R1 to R4 represent each a 1-3C alkyl). An epoxy resin is mixed with 2 to 15 pts.wt. dicyandiamide and the curing accelerator in an amt. of 1 to 20 pts.wt. based on the epoxy resin.

    69.
    发明专利
    失效

    公开(公告)号:JPH06510992A

    公开(公告)日:1994-12-08

    申请号:JP50574593

    申请日:1992-09-10

    摘要: where X1-X4 are each O or S; W is unsubstituted or substituted -CH=O, -CH=S, -CH=NH, -CH(X3R6)(X4R7), R6 and R7 are each C1-C6-alkyl, C3-C6-alkenyl, C3-C6-alkynyl or C1-C6-alkoxy-C1-C6-alkyl or together form a carbon chain; R10 is H, OH, SH, an ether or thioether group, unsubstituted or substituted C1-C6-alkyl, C3-C6-alkenyl, C3-C6-alkynyl, C3-C7-cycloalkyl, unsubstituted or substituted amino or unsubstituted or substituted phenyl; R1 is halogen, CN, NO2 or CF3; R2 is H or halogen; R3 is H, C1-C6-alkyl, C3-C6-alkenyl, C3-C6-alkynyl, C3-C8-cycloalkyl, C3-C8-cycloalkylcarbonyl, C1-C6-cyanoalkyl, C1-C6-haloalkyl, C1-C6-alkoxy-C1-C6-alkyl, CHO, C1-C6-alkanoyl, C1-C6-alkoxycarbonyl, C1-C6-haloalkylcarbonyl, unsubstituted or substituted amino, unsubstituted or substituted phenyl or phenyl-C1-C6-alkyl; R4 and R5 are each H, CN, halogen, unsubstituted or substituted C1-C6-alkyl, C2-C6-alkenyl, C2-C6-alkynyl, C3