摘要:
A resistance variable memory apparatus (100) of the present invention includes a current suppressing element (116) which is connected in series with each resistance variable layer (114) and whose threshold voltage is VF, and is configured to apply a first voltage V1 to a first wire (WL) associated with a selected nonvolatile memory element, apply a second voltage V2 to a second wire (BL) associated with the selected nonvolatile memory element, apply a third voltage V3 to a first wire (WL) which is not associated with the selected nonvolatile memory element and apply a fourth voltage V4 to a second wire (BL) which is not associated with the selected memory element when writing data or reading data, wherein V2≦̸V3
摘要:
PROBLEM TO BE SOLVED: To provide a resistive memory apparatus capable of omitting a write circuit for a reference cell, and a layout structure thereof; to provide a resistive memory apparatus capable of writing data in a reference cell using a write circuit of a main memory cell and a layout structure thereof; and to provide a sensing circuit for a resistive memory apparatus in which a write circuit for a reference cell is omitted.SOLUTION: A resistive memory apparatus includes a plurality of memory areas each including a main memory cell array coupled with a plurality of word lines, and a reference cell array coupled with a plurality of reference word lines. Each of the plurality of memory areas shares a bit line driver/sinker with an adjacent memory area. The layout structure thereof and the sensing circuit are provided.
摘要:
PROBLEM TO BE SOLVED: To provide a resistance random access nonvolatile storage device which executes a stable switching operation at low cost.SOLUTION: A resistance random access nonvolatile storage device comprises: a first wiring 3; an interlayer insulation layer 53 formed on the first wiring 3; a second wiring 6 formed on the interlayer insulation film 53; and a resistance random access memory element 11 formed between the first wiring 3 and the second wiring 6. The interlayer insulation layer 53 is formed so as to be sandwiched between the first wiring 3 and the second wiring 6 and includes a hole 9 having a width not exceeding a width of the first wiring 3. The resistance random access memory element 11 includes a lower electrode 13 formed on a bottom of the hole 9 in contact with the first wiring 3, a resistance change layer 12 formed on the lower electrode 13 and an upper electrode 11 formed on the resistance change layer 12. The lower electrode 13, the resistance change layer 12, and the upper electrode 11 are formed inside the hole 9. The first wiring 3 contains copper. The lower electrodes 13 and 13a each contain at least one metal selected from a group consisting of ruthenium, tungsten, cobalt, platinum, gold, rhodium, iridum, and palladium.
摘要:
To provide a memory device which can maintain data accurately even when memory characteristics of a memory element deteriorate over time. The memory device includes a memory cell 100, a reading circuit 103, a power supply line 104, a first signal line 105, a second signal line 102, and an output terminal 106. The memory cell 100 includes a memory element 108, the resistance value of which is changed and holds data by utilizing the resistance value of the memory element 108. The reading circuit 103 reads data held in the memory cell 100. The output terminal 106 outputs a potential of the power supply line 104 or a potential corresponding to the data held in the memory cell 100 in accordance with the resistance value of the memory element 108. The reading circuit 103 includes a transistor 109 having first to fourth terminals. The threshold voltage of the transistor 109 is controlled by supplying a potential to a channel region through the fourth terminal.
摘要:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of achieving high speed operation while maintaining reliability.SOLUTION: A semiconductor device comprises: a memory cell 11 having a resistance change element 10; and a control unit 80 for controlling voltage to be applied to the memory cell 11. The resistance change element 10 comprises: a lower electrode 14 including a first metallic material; an upper electrode 16 including a second metallic material; and an insulator film 12 including oxygen. The first metallic material has larger standardization oxide generation energy than the second metallic material. In operation of changing a value of resistance of the insulator film 12 to high-resistance and in operation of changing the value to low resistance, the controlling unit 80 applies positive voltage to the upper electrode 16, and in operation of reading the value of resistance of the insulator film 12, the controlling unit 80 applies positive voltage to the lower electrode 14.
摘要:
PROBLEM TO BE SOLVED: To reduce the number of reading operations and an area of a circuit related to a control of a reading operation in a nonvolatile memory device for sensing multi-level data using a resistance change.SOLUTION: The nonvolatile memory device includes: a cell array including one or more unit cells and reading or writing data; and a sensing unit 100 that compares a sensing voltage SAI corresponding to data stored in a unit cell with a reference voltage REF, and amplifies and outputs it, then measures a difference in time when the sensing voltage is discharged according to a resistance value of the unit cell, in an activation zone of a sensing enable signal SEN after a bit line is precharged, thereby sensing the data.
摘要:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of accelerating sense operation and preventing error resetting.SOLUTION: According to an embodiment, the semiconductor device includes a memory cell array MA in which a memory cell MC having a rectifying element Di and a variable resistance element VR is arranged, a peripheral circuit including a first even and first odd bit lines (BLre, BLro) of a first side and a second even and second odd bit lines (BLle, BLlo) of a second side which are electrically connected to the memory cell, a sense amplifier 13 for sensing the memory cell through the peripheral circuit, and a control circuit 27 for controlling the operations of the memory cell array and the sense amplifier. The control circuit 17 makes the first even or the first odd bit line potential of the first side being a selection bit line go up by charge sharing of the second even and the second odd bit lines of the non-selection second side physically adjacent to the first even or the first odd bit line of the first side connected to a selection memory cell.