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    Heat conductive silicone grease composition and a cured product thereof
    5.
    发明专利
    Heat conductive silicone grease composition and a cured product thereof 有权

    公开(公告)号：JP4634891B2

    公开(公告)日：2011-02-23

    申请号：JP2005238019

    申请日：2005-08-18

    Applicant: 信越化学工業株式会社

    Inventor： 敬 三好 ,  邦弘 山田 ,  弘明 木崎 ,  晃洋 遠藤

    IPC: C08L83/07 ,  C08K3/08 ,  C08K5/5419 ,  C08K7/00 ,  C08L83/05 ,  C08L83/06 ,  C09K5/08 ,  H01L23/36

    CPC classification number: H01L23/3737 ,  C10M169/04 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/053 ,  C10M2201/061 ,  C10M2229/041 ,  C10M2229/0415 ,  C10M2229/044 ,  C10M2229/046 ,  C10N2210/01 ,  C10N2210/03 ,  C10N2210/07 ,  C10N2210/08 ,  C10N2220/082 ,  C10N2230/02 ,  H01L2224/32245 ,  Y10T428/31663

    Abstract: Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 µm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.

    Thermally conductive silicone composition and cured product thereof
    7.
    发明专利
    Thermally conductive silicone composition and cured product thereof 有权

    公开(公告)号：JP5304588B2

    公开(公告)日：2013-10-02

    申请号：JP2009245382

    申请日：2009-10-26

    Applicant: 信越化学工業株式会社

    Inventor： 靖久 石原 ,  祐貴 櫻井 ,  晃洋 遠藤

    IPC: C08L83/07 ,  C08K3/22 ,  C08K5/541 ,  C08L83/05

    Abstract: PROBLEM TO BE SOLVED: To provide a heat conductive silicone composition and a cured product of the same achieving heat conductivity of 1.5 W/mK or more and reducing wear of a reactor and a stirring blade in production and sedimentation of a heat conductive filler, preferably by skillfully combining aluminum hydroxides varying in particle size. SOLUTION: The heat conductive silicone composition comprises: (A) 100 pts.mass of an organopolysiloxane having at least two alkenyl groups in the molecule; (B) an organohydrogen polysiloxane having at least two hydrogen atoms directly bonded to a silicon atom; (C) 200-2,500 pts.mass of a heat conductive filler wherein 70 mass% or more is occupied by an aluminum hydroxide; and (D) a platinum group metal curing catalyst. The content of the component (B) is set so that the number of moles of the hydrogen atoms directly bonded to the silicon atom is 0.1-5.0 times that of the alkenyl groups originated from the component (A). The content of the component (D) is 0.1-1,000 ppm in the mass terms of platinum group metal elements with respect to the component (A). COPYRIGHT: (C)2011,JPO&INPIT

    Thermally conductive silicone rubber composite sheet
    10.
    发明专利
    Thermally conductive silicone rubber composite sheet 有权

    公开(公告)号：JP5574532B2

    公开(公告)日：2014-08-20

    申请号：JP2010207792

    申请日：2010-09-16

    Applicant: 信越化学工業株式会社

    Inventor： 晃洋 遠藤 ,  貴宏 丸山

    IPC: B32B27/00 ,  B32B27/18 ,  H01B17/60

    CPC classification number: C09J183/04 ,  C08G77/12 ,  C08G77/20 ,  C08L83/04

    Abstract: This invention discloses a thermal conductive silicone rubber composite sheet, comprising of an intermediate layer (A), which is an electric insulating heat resistant film, and cured material layers as an outer layers (B) prepared on both surfaces of said intermediate layer (A), characterized in that said cured material layers (B) are prepared by curing a silicone composition in a thin film state which are formed by coating said silicone composition comprising the following components (a)-(f) on both surfaces of said intermediate layer (A) ; (a) organopolyciloxane having two or more alkenyl groups bonding to a silicon atom within a molecule: 100 mass parts (b) thermal conductive filler: 100-4,000 mass parts (c) organohydrogenpolysiloxane having two or more hydrogen atoms bonding to a silicon atom within a molecule: the amount wherein the mole ratio of [the hydrogen atom bonding to a silicone atom of the present component/an alkenyl group in the component (a)] is 0.5-5.0 (d) platinum group metallic catalyst: effective amount (e) reaction control agent: effective amount, and (f) silicone resin: 50-500 mass parts wherein, the outer layers provided on both surfaces of the intermediate layer (A) may be identical or different.

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