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    Heat conductive silicone grease composition
    7.
    发明专利
    Heat conductive silicone grease composition 有权

    公开(公告)号：JP5283553B2

    公开(公告)日：2013-09-04

    申请号：JP2009094831

    申请日：2009-04-09

    Applicant: 株式会社デンソー ,  信越化学工業株式会社

    Inventor： 和敏 伊藤 ,  孝司 青木 ,  和生 加藤 ,  邦弘 山田 ,  弘明 木崎 ,  内田　　修

    IPC: C08L83/06 ,  C08K3/22 ,  C08K3/28

    Abstract: PROBLEM TO BE SOLVED: To provide a thermally conductive silicone grease composition excellent in both thermal conductivity and shear resistance. SOLUTION: The thermally conductive silicone grease composition includes at least components (A)-(C). The aggregate amount of the component (B) and (C) accounts for 500-2,000 pts.mass based on 100 pts.mass of the component (A). Component (C)/(component (B)+component (C)) representing a mixed ratio of the component (B) and the component (C) is 0.05-0.5 by mass. Component (A): Organopolysiloxane having a thixotropy index α as defined by η 1 /η 2 of 1.03-1.70, a viscosity at 25°C of 10-1,000,000 mPa s, wherein η 1 is a viscosity as determined at 25°C using a B-type rotational viscometer with a rotor rotation of 6 rpm, and η 2 is a viscosity as determined at 25°C using a B-type rotational viscometer with a rotor rotation of 12 rpm. Component (B): a thermally conductive inorganic filler having a Mohs hardness of ≥6 and an average particle size of 5-20 μm. Component (C): a thermally conductive inorganic filler having a Mohs hardness of ≤5 and an average particle size of 0.5-5 μm. COPYRIGHT: (C)2011,JPO&INPIT

    Heat conductive silicone grease composition and a cured product thereof
    8.
    发明专利
    Heat conductive silicone grease composition and a cured product thereof 有权

    公开(公告)号：JP4634891B2

    公开(公告)日：2011-02-23

    申请号：JP2005238019

    申请日：2005-08-18

    Applicant: 信越化学工業株式会社

    Inventor： 敬 三好 ,  邦弘 山田 ,  弘明 木崎 ,  晃洋 遠藤

    IPC: C08L83/07 ,  C08K3/08 ,  C08K5/5419 ,  C08K7/00 ,  C08L83/05 ,  C08L83/06 ,  C09K5/08 ,  H01L23/36

    CPC classification number: H01L23/3737 ,  C10M169/04 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/053 ,  C10M2201/061 ,  C10M2229/041 ,  C10M2229/0415 ,  C10M2229/044 ,  C10M2229/046 ,  C10N2210/01 ,  C10N2210/03 ,  C10N2210/07 ,  C10N2210/08 ,  C10N2220/082 ,  C10N2230/02 ,  H01L2224/32245 ,  Y10T428/31663

    Abstract: Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 µm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.

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