-
-
公开(公告)号:JP4901327B2
公开(公告)日:2012-03-21
申请号:JP2006173828
申请日:2006-06-23
Applicant: 信越化学工業株式会社
IPC: H01L23/373
-
公开(公告)号:JP5233325B2
公开(公告)日:2013-07-10
申请号:JP2008050276
申请日:2008-02-29
Applicant: 信越化学工業株式会社
CPC classification number: C09D183/04 , Y10T428/31663
-
4.
公开(公告)号:JP5131648B2
公开(公告)日:2013-01-30
申请号:JP2009162420
申请日:2009-07-09
Applicant: 信越化学工業株式会社
Abstract: PROBLEM TO BE SOLVED: To provide a thermally conductive silicone composition that provides a thermally conductive silicone molding that has high restoration performance in spite of having a low hardness and is excellent in handleability and reworkability; and a thermally conductive silicone molding using the composition.SOLUTION: The thermally conductive silicone composition contains (a) an organopolysiloxane containing an alkenyl group at least in a side chain, wherein the number of the alkenyl groups in the side chain is 2 to 9; (b) an organohydrogenpolysiloxane, wherein at least both terminals are blocked with SiH groups; (c) a thermally conductive filler; and (d) a platinum group metal-based curing catalyst. Assuming that an average number of siloxane bond among silicon atoms in a non-terminal moiety, to each of which silicon atoms the alkenyl group is bonded in the organopolysiloxane, the component (a), is L, and that an average degree of polymerization of the organohydrogenpolysiloxane, the component (b), is L', L'/L=0.6 to 3.0 is satisfied. The thermally conductive silicone molding in the form of a sheet comprises a cured product of the composition.
-
公开(公告)号:JP5574532B2
公开(公告)日:2014-08-20
申请号:JP2010207792
申请日:2010-09-16
Applicant: 信越化学工業株式会社
CPC classification number: C09J183/04 , C08G77/12 , C08G77/20 , C08L83/04
Abstract: This invention discloses a thermal conductive silicone rubber composite sheet, comprising of an intermediate layer (A), which is an electric insulating heat resistant film, and cured material layers as an outer layers (B) prepared on both surfaces of said intermediate layer (A), characterized in that said cured material layers (B) are prepared by curing a silicone composition in a thin film state which are formed by coating said silicone composition comprising the following components (a)-(f) on both surfaces of said intermediate layer (A) ; (a) organopolyciloxane having two or more alkenyl groups bonding to a silicon atom within a molecule: 100 mass parts (b) thermal conductive filler: 100-4,000 mass parts (c) organohydrogenpolysiloxane having two or more hydrogen atoms bonding to a silicon atom within a molecule: the amount wherein the mole ratio of [the hydrogen atom bonding to a silicone atom of the present component/an alkenyl group in the component (a)] is 0.5-5.0 (d) platinum group metallic catalyst: effective amount (e) reaction control agent: effective amount, and (f) silicone resin: 50-500 mass parts wherein, the outer layers provided on both surfaces of the intermediate layer (A) may be identical or different.
-
公开(公告)号:JP5538739B2
公开(公告)日:2014-07-02
申请号:JP2009064278
申请日:2009-03-17
Applicant: 信越化学工業株式会社
IPC: H01L23/373 , B32B15/08 , H01L23/36 , H05K7/20
-
-
公开(公告)号:JP4572243B2
公开(公告)日:2010-11-04
申请号:JP2008084669
申请日:2008-03-27
Applicant: 信越化学工業株式会社
IPC: B32B27/00 , C08K5/5415 , C08L83/05 , C08L83/07 , H01L23/373
-
-
-
-
-
-
-
-