公开(公告)号：JP5283553B2

公开(公告)日：2013-09-04

申请号：JP2009094831

申请日：2009-04-09

Applicant: 株式会社デンソー ,  信越化学工業株式会社

Inventor： 和敏 伊藤 ,  孝司 青木 ,  和生 加藤 ,  邦弘 山田 ,  弘明 木崎 ,  内田　　修

IPC: C08L83/06 ,  C08K3/22 ,  C08K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a thermally conductive silicone grease composition excellent in both thermal conductivity and shear resistance. SOLUTION: The thermally conductive silicone grease composition includes at least components (A)-(C). The aggregate amount of the component (B) and (C) accounts for 500-2,000 pts.mass based on 100 pts.mass of the component (A). Component (C)/(component (B)+component (C)) representing a mixed ratio of the component (B) and the component (C) is 0.05-0.5 by mass. Component (A): Organopolysiloxane having a thixotropy index α as defined by η 1 /η 2 of 1.03-1.70, a viscosity at 25°C of 10-1,000,000 mPa s, wherein η 1 is a viscosity as determined at 25°C using a B-type rotational viscometer with a rotor rotation of 6 rpm, and η 2 is a viscosity as determined at 25°C using a B-type rotational viscometer with a rotor rotation of 12 rpm. Component (B): a thermally conductive inorganic filler having a Mohs hardness of ≥6 and an average particle size of 5-20 μm. Component (C): a thermally conductive inorganic filler having a Mohs hardness of ≤5 and an average particle size of 0.5-5 μm. COPYRIGHT: (C)2011,JPO&INPIT

公开(公告)号：JP5359934B2

公开(公告)日：2013-12-04

申请号：JP2010045462

申请日：2010-03-02

Applicant: 株式会社デンソー

Inventor： 浩之 奥平 ,  和生 加藤 ,  昭夫 杉浦 ,  孝司 青木 ,  直樹 平澤

IPC: H01F37/00 ,  C08K3/08 ,  C08L33/04 ,  C08L63/00 ,  H01F1/26

Abstract: PROBLEM TO BE SOLVED: To provide a reactor such that an iron powder-dispersed type epoxy casting material with which magnetic powder is mixed by ≥80 mass% has both flexibility and heat resistance, by using core shell type powder having a stable particle shape, usable even at high temperature, and existing in a system stably for a long period, especially, resin powder which stably toughens in a large-amount mixing system of special metal powder, i.e., magnetic powder. SOLUTION: The reactor is made of a curable resin composition including an epoxy resin, a curing agent, iron powder, and core shell type resin powder. he curable resin composition being acrylic resin includes: the iron core by 80 to 92 mass% of the whole composition; and the core shell type resin powder by 3 to 60 mass% of the epoxy resin, and a shell of the core shell type resin powder is cross-linked. COPYRIGHT: (C)2011,JPO&INPIT

公开(公告)号：JP5169343B2

公开(公告)日：2013-03-27

申请号：JP2008066363

申请日：2008-03-14

Applicant: 株式会社デンソー

Inventor： 治 伊奈 ,  孝司 青木

IPC: C23C14/12 ,  B05B7/22 ,  C23C14/24

公开(公告)号：JP5317677B2

公开(公告)日：2013-10-16

申请号：JP2008326162

申请日：2008-12-22

Applicant: 株式会社デンソー ,  国立大学法人九州大学

Inventor： 孝司 青木 ,  泰志 岡本 ,  和生 加藤 ,  淳 高原 ,  三郎 山本

IPC: C09J5/02 ,  C09J163/00 ,  C09J183/04 ,  C09J201/00

Abstract: PROBLEM TO BE SOLVED: To provide a method to adhere a plated substrate in order to develop excellent adhesion. SOLUTION: The method to adhere a plated substrate to a subject to be adhered with an adhesive includes a pre-treatment step wherein a dopamine solution is brought into contact with a surface of the plated substrate to form a thin film of the dopamine on the surface of the plated substrate, and an adhering step wherein adhesion is developed by interaction between a functional group on the surface of the plated substrate formed in the pre-treatment step and a functional group in the adhesive. COPYRIGHT: (C)2010,JPO&INPIT

公开(公告)号：JP5156300B2

公开(公告)日：2013-03-06

申请号：JP2007222520

申请日：2007-08-29

Applicant: 株式会社デンソー ,  東洋インキScホールディングス株式会社

Inventor： 輝彦 岩瀬 ,  治 伊奈 ,  孝司 青木 ,  伸一 佐藤 ,  泰男 吉広 ,  征寿 高橋

IPC: B41M5/00 ,  B60K35/00 ,  C09D11/00 ,  C09D11/30 ,  G01D13/02 ,  G09F7/16 ,  G09F13/08

公开(公告)号：JP4957220B2

公开(公告)日：2012-06-20

申请号：JP2006327191

申请日：2006-12-04

Applicant: 株式会社デンソー

Inventor： 和生 加藤 ,  亮 新帯 ,  進介 長坂 ,  孝司 青木

IPC: H01L23/29 ,  H01L23/31

CPC classification number: H01L23/3142 ,  H01L23/3107 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：JP4925457B2

公开(公告)日：2012-04-25

申请号：JP2007268987

申请日：2007-10-16

Applicant: 東洋インキScホールディングス株式会社 ,  株式会社デンソー

Inventor： 治 伊奈 ,  伸一 佐藤 ,  泰男 吉広 ,  輝彦 岩瀬 ,  孝司 青木 ,  征寿 高橋

IPC: B41M5/00 ,  B41M5/50 ,  B41M5/52 ,  B60K35/00 ,  C09D11/00 ,  C09D11/38 ,  G01D13/02 ,  G01D13/04 ,  G09F13/08

公开(公告)号：JP3921859B2

公开(公告)日：2007-05-30

申请号：JP904499

申请日：1999-01-18

Applicant: 株式会社デンソー

Inventor： 一秀 佐藤 ,  充 加藤 ,  文夫 加藤 ,  慎一 松原 ,  孝司 青木

IPC: H02K3/34 ,  H02K15/12

公开(公告)号：JP3858927B2

公开(公告)日：2006-12-20

申请号：JP2005098679

申请日：2005-03-30

Applicant: 株式会社デンソー

Inventor： 善文 渡辺 ,  貴志 野村 ,  孝司 青木

IPC: G01L19/06 ,  G01L9/00 ,  G01L23/24 ,  H01L29/84

CPC classification number: H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

公开(公告)号：JP5317679B2

公开(公告)日：2013-10-16

申请号：JP2008326448

申请日：2008-12-22

Applicant: 株式会社デンソー ,  国立大学法人九州大学

Inventor： 泰志 岡本 ,  孝司 青木 ,  和生 加藤 ,  淳 高原 ,  三郎 山本

IPC: C09J5/02 ,  B32B27/00 ,  C08J5/12 ,  C09J163/00 ,  C09J201/00

Abstract: PROBLEM TO BE SOLVED: To provide a method of adhesion of a polyacetal resin molding for developing excellent adhesion while keeping inherent properties of polyacetal resin. SOLUTION: This method of adhesion of polyacetal resin molding includes adhering a polyacetal resin molding with an adhesive to an adhesion object, and includes a pretreatment process in which a polydopamine thin film is formed on the surface of a polyacetal resin molding by contacting a dopamine solution on the surface of the polyacetal resin molding, and an adhesion process in which adhesion is worked out by mutual action of the functional group on the surface of the polyacetal resin molding formed in the pretreatment process and the functional group of the adhesive. COPYRIGHT: (C)2010,JPO&INPIT