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Patent Agency Ranking
公开(公告)号：JP4911254B2
公开(公告)日：2012-04-04
申请号：JP2011103359
申请日：2011-05-06
Applicant: 日立電線株式会社
Abstract: A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of its surface, and the Sn-based material part includes a base metal doped with an oxidation control element. The oxidation control element is at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn and the oxidation control element is diffused to form an alloy.
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公开(公告)号：JP4367149B2
公开(公告)日：2009-11-18
申请号：JP2004023994
申请日：2004-01-30
Applicant: 日立電線株式会社
IPC: C23C30/00 , H01B7/08 , C23C2/08 , C25D5/10 , C25D5/48 , C25D7/06 , H01B1/02 , H01B5/02 , H01B13/00 , H05K1/00 , H05K3/20 , H05K3/24 , H05K3/28 , H05K3/38
CPC classification number: H05K3/244 , C25D5/10 , C25D5/50 , C25D7/0607 , H05K1/0393 , H05K3/202 , H05K3/281 , H05K3/386
Abstract: A flat cable conductor has: a conductor made of copper or a copper alloy; a first plating film made of tin and/or a tin-copper alloy, the first plating film being formed around the conductor; and a second plating film made of an alloy of tin and a third element selected from Au, Ag, Ni, Ge, Zn and Bi, the second plating film being formed around the first plating film. The third element has a concentration of 0.01 or more and 80 or less wt % at an outer surface of the second plating film.
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