Thin film sample preparation method and system

    公开(公告)号:JP3488075B2

    公开(公告)日:2004-01-19

    申请号:JP2600998

    申请日:1998-02-06

    Abstract: PROBLEM TO BE SOLVED: To provide a thin film sample preparing method and its system which are suitable for preparing, with high processing accuracy, a chin film sample to be observed by an electron microscope. SOLUTION: In an electron microscope constituting an electron beam device 1, a stereoscopic image based on secondary electrons or the like is displayed on a scanned image observation device 5, the distance from the surface of a sample to an inside objective position thereof is measured by an image processing device 7, and the measured distance is memorized in a CPU 6. The memorized value is input to a CPU 8 through a communications line and is memorized therein. The sample is set on a convergent ion beam device 2 and the detection and correction of the position of the sample is performed by displaying its secondary electron image by the aid of converged ion beam irradiation and thereafter, the sample is processed by using a converged ion beam based on the memorized value in the CPU 8. The processing is carried out from both sides of the sample separately, and thereby, a thin film sample located at the objective position is prepared.

    Sample analysis method
    4.
    发明专利

    公开(公告)号:JP4534235B2

    公开(公告)日:2010-09-01

    申请号:JP2007190890

    申请日:2007-07-23

    Abstract: PROBLEM TO BE SOLVED: To observe the phenomenon generated within a device by directly applying voltage at a specific position within an LSI with design dimensions of about 0.1 μm. SOLUTION: This method comprises, in addition to a process for processing arbitrary area of an object sample into a fine sample piece by using charged particle beam and extracting the sample piece, a process for attaching fine conductors 30a and 30b to the extracted fine sample piece 72, and a process for applying voltage to the attached fine conductors. COPYRIGHT: (C)2008,JPO&INPIT

    A charged particle beam apparatus for a sample holder

    公开(公告)号:JP3106846U

    公开(公告)日:2005-01-27

    申请号:JP2004004465

    申请日:2004-07-28

    Abstract: 【課題】
    集束イオンビーム加工法での加工ムラおよびリデポジションの問題を解決し、微細構造解析や元素分析などの分析精度を向上する。
    【解決手段】
    試料を固定した試料台をホールダ軸の周りに360°回転する機能を備えた荷電粒子線装置用試料ホールダにおいて、前記試料台の先端部を集束イオンビームの進行方向に対し直角に回転補正した試料にイオンビーム照射することで達成される。
    また、試料台軸の周りに360°回転できる機能を備えた前記荷電粒子線装置用試料ホールダにおいて、前記試料ホールダの試料台の先端部を集束イオンビームの進行方向に対し直角に回転補正を加えた後、試料台に固定した試料にイオンビーム照射することで達成される。
    【選択図】図5

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