公开(公告)号：JP2012175031A

公开(公告)日：2012-09-10

申请号：JP2011038095

申请日：2011-02-24

Applicant: Denso Corp ,  株式会社デンソー

Inventor： ITO MASARU ,  UEDA NOBUTADA ,  MATSUMURA YASUSHI

IPC: H05K7/20 ,  B60R16/02

Abstract: PROBLEM TO BE SOLVED: To provide an electronic control device which smoothly controls each external device, effectively radiates heat generated in a housing, and reduces the size.SOLUTION: A mother board 30 to which electric power supplied from a battery 15 is input and having a power supply circuit 33 transforming a voltage for supplying electric power to electronic components mounted on each module substrate 41 to 44 is disposed near one surface 21a of a housing 21 at one side board surface 31. Further, the respective module substrates 41 to 44 are disposed so that substrate surfaces thereof are arranged parallel to the mother board 30.

Abstract translation: 要解决的问题：为了提供平滑地控制每个外部装置的电子控制装置，有效地辐射在壳体中产生的热量并减小尺寸。 输入从电池15供给的电力的母板30，具有向安装在各模块基板41〜44上的电子部件供给电力的电压变换用的电源电路33配置在一个表面附近 另外，相应的模块基板41至44设置成使得其基板表面平行于母板30布置。（C）2012年，JPO和INPIT

公开(公告)号：JP2011219076A

公开(公告)日：2011-11-04

申请号：JP2010210753

申请日：2010-09-21

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HIRONAKA YOSHIO ,  MATSUMURA YASUSHI ,  HARAGUCHI KIYOHIRO ,  IWAMOTO KENJI ,  SATO HIDEAKI ,  SHITAYA MASAHIRO ,  INAGAKI MITSUHARU

IPC: B60R16/02

CPC classification number: B60H1/143 ,  B60H2001/00178 ,  B60H2001/00614

Abstract: PROBLEM TO BE SOLVED: To provide an electronic control device and a cooling device of the same which suitably cool a plurality of control circuits for controlling onboard equipment.SOLUTION: In a housing 21 in which radiating fins 22 are each installed, there are stored a plurality of control circuits 23 for controlling a plurality of pieces of onboard equipment individually. Then, the radiating fins 22 are each arranged to be exposed in an air suction side duct 12a, wherein respective heating elements 24 comprising the plurality of control circuits 23 are arranged in contact with a radiating surface 21b near an upper surface 21a on which radiating fins 22 are each installed.

Abstract translation: 要解决的问题：提供一种电子控制装置及其冷却装置，其适当地冷却用于控制车载设备的多个控制电路。 解决方案：在其中安装有散热片22的壳体21中，存储有多个用于单独控制多个机载设备的控制电路23。 然后，散热片22分别被布置成暴露在空气吸入侧管道12a中，其中包括多个控制电路23的各个加热元件24被布置成与靠近上表面21a的辐射表面21b接触，散热片 每个都安装了22个。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2009289851A

公开(公告)日：2009-12-10

申请号：JP2008138921

申请日：2008-05-28

Applicant: Denso Corp ,  株式会社デンソー

Inventor： MATSUMURA YASUSHI

IPC: H05K1/14 ,  H05K1/02 ,  H05K7/14

Abstract: PROBLEM TO BE SOLVED: To provide an electronic control device capable of electrically connecting boards each other only by attaching a plurality of boards to a housing.
SOLUTION: The electronic control device is provided with a flexible portion 33 having each connection terminal 34 and bendably connecting to a portion of a periphery of an opening 32 of a first board 30. In a housing 20, when attaching the first board 30 and the second board 40 to the housing 20, there is provided a support member 50 so as to project inside from a bottom surface 21a of a case 21, the support member having a top end portion 51 which electrically connects each connection terminal 34 to a corresponding connection terminal 42 respectively by biasing an upper surface 33a of the flexible portion 33 to a lower surface 40a of a second board 40, while penetrating through the opening portion 32 of the first board 30.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种电子控制装置，其能够通过将多个板附接到壳体而彼此电连接板。 解决方案：电子控制装置设置有具有每个连接端子34并可弯曲地连接到第一板30的开口32的周边的一部分的柔性部分33.在壳体20中，当连接第一板 30和第二板40连接到壳体20，设置有从壳体21的底面21a向内突出的支撑构件50，支撑构件具有将每个连接端子34电连接到的顶端部分51 分别通过将柔性部分33的上表面33a偏压到第二板40的下表面40a，同时穿过第一板30的开口部分32而对应的连接端子42.版权所有（C）2010 ，JPO＆INPIT

公开(公告)号：JP2009176626A

公开(公告)日：2009-08-06

申请号：JP2008015472

申请日：2008-01-25

Applicant: Denso Corp ,  Nippon Soken Inc ,  株式会社デンソー ,  株式会社日本自動車部品総合研究所

Inventor： HORI MASAFUMI ,  IIDA TAKU ,  MATSUMURA YASUSHI ,  HIRONAKA YOSHIO ,  KAMIYA TAKASHI ,  HIRAMATSU SATOSHI ,  MIYAKE TOSHIHIRO ,  KAMIYA HIROTERU

CPC classification number: H01R12/721 ,  H01R4/242 ,  H01R12/79 ,  Y10T29/49222

Abstract: PROBLEM TO BE SOLVED: To multistage and install a conductive path conductive to a plurality of contact terminals in the direction perpendicular to an electronic substrate surface while forming those contact terminals on the same plane of the electronic substrate. SOLUTION: A connection terminal 5 is provided of which one end is connected to a second connector pin 4 in contact with an inside contact terminal 33 positioned inside the electronic substrate 31, and which extends toward the direction separating from the surface of the electronic substrate 31 in the direction perpendicular to the surface of the electronic substrate 31, and has a through-groove 5b through which a conductor part 19b of a harness 19 penetrates. Accordingly, a first connector pin 10 electrically connected to a head contact terminal 32 of the electronic substrate 31, and the tip of the connection terminal 5 electrically connected to the inside contact terminal 33 can be installed with sufficient intervals in the direction perpendicular to the surface of the electronic substrate 31. As a result, harnesses 18, 19 become possible to be multistaged and provided which form conductive paths conductive to the head contact terminal 32 and the inside contact terminal 33, respectively. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：在电子基板的同一平面上形成这些接触端子的同时，在垂直于电子基板表面的方向上多级并且安装导电到多个接触端子的导电路径。 解决方案：设置连接端子5，其一端连接到与位于电子基板31内部的内部接触端子33接触的第二连接器引脚4，并且朝向与 电子基板31沿着与电子基板31的表面垂直的方向，并具有贯通槽5b，线束19的导体部19b穿过该贯通槽5b。 因此，电连接到电子基板31的头接触端子32的第一连接器引脚10和电连接到内部接触端子33的连接端子5的末端可以在垂直于表面的方向上具有足够的间隔 结果，线束18,19成为可能的多级并且设置成分别形成导电路径，导电到头部接触端子32和内部接触端子33。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2009176625A

公开(公告)日：2009-08-06

申请号：JP2008015471

申请日：2008-01-25

Applicant: Denso Corp ,  Nippon Soken Inc ,  株式会社デンソー ,  株式会社日本自動車部品総合研究所

Inventor： HORI MASAFUMI ,  IIDA TAKU ,  MATSUMURA YASUSHI ,  HIRONAKA YOSHIO ,  KAMIYA TAKASHI ,  HIRAMATSU SATOSHI ,  MIYAKE TOSHIHIRO ,  KAMIYA HIROTERU

CPC classification number: H01R13/5205 ,  H01R31/06 ,  Y10T29/49002

Abstract: PROBLEM TO BE SOLVED: To provide a card edge connector capable of multi-staging connector terminals (contact conductors) in the direction perpendicular to an electronic substrate surface while forming contact terminals on the same plane of an electronic substrate with sufficient intervals. SOLUTION: With respect to a second connector pin 4 in contact with an inside contact terminal 33 positioned inside the electronic substrate 31, a third connector pin 13 as an auxiliary contact conductor is provided, and these second connector pin 4 and third connector pin 13 are electrically connected by a coupling conductor 5. The third connector pin 13 is positioned at a height position which is more separated from the surface of the electronic substrate 31 than a first connector pin 10. Accordingly, even if a head contact terminal 32 and the inside contact terminal 33 are formed along the insertion direction of the electronic substrate 31, the first connector pin 10 and the third connector pin 13 electrically connected to them, respectively, become possible to be multistaged and provided in the direction perpendicular to the electronic substrate surface with sufficient intervals. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供能够在垂直于电子基板表面的方向上多级连接器端子（接触导体）的卡缘连接器，同时以足够的间隔在电子基板的同一平面上形成接触端子。 解决方案：对于与位于电子基板31内部的内部接触端子33接触的第二连接器引脚4，设置作为辅助接触导体的第三连接器引脚13，并且这些第二连接器引脚4和第三连接器 销13通过耦合导体5电连接。第三连接器针13位于比第一连接器针10更离开电子基板31的表面的高度位置。因此，即使头部接触端子32 并且沿着电子基板31的插入方向形成内部接触端子33，分别与它们电连接的第一连接器引脚10和第三连接器引脚13可以是多个并沿垂直于电子的方向设置的 基板表面有足够的间隔。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2012218621A

公开(公告)日：2012-11-12

申请号：JP2011087900

申请日：2011-04-12

Applicant: Denso Corp ,  株式会社デンソー

Inventor： MATSUMURA YASUSHI ,  KAMEI EIICHI

IPC: B60R16/02

CPC classification number: B60R16/0238 ,  B60W50/0225 ,  B60W50/04 ,  B60W2050/0006 ,  B60W2050/041

Abstract: PROBLEM TO BE SOLVED: To provide an on-board electronic control apparatus capable of easily coping with a number of functions required in response to a car model, and capable of reducing developing-manufacturing cost.SOLUTION: This on-board electronic control apparatus includes: a mother board 2; a plurality of ECU modules 10, 20 and 30 detachably installed on the mother board 2 and respectively executing mutually different controls of a vehicle; an arithmetic operation data communication means 6 for communicating arithmetic operation data for executing arithmetic processings for control by the plurality of ECU modules 10, 20 and 30, between the mother board 2 and the ECU modules; and substitute arithmetic operation executing means 4 and 22a for executing a substitute arithmetic operation for replacing at least a part of the arithmetic processing to be executed by at least one among the plurality of ECU modules 10, 20 and 30, with at least one of the other ECU module and the mother board 2.

Abstract translation: 要解决的问题：提供能够容易地应对响应于汽车模型所需的多种功能并且能够降低开发制造成本的车载电子控制装置。 该车载电子控制装置包括：母板2; 可拆卸地安装在母板2上并分别执行车辆的相互不同的控制的多个ECU模块10,20和30; 用于在母板2和ECU模块之间通信用于执行用于由多个ECU模块10,20和30进行控制的算术处理的算术运算数据的算术运算数据通信装置6; 代替算术运算执行装置4和22a，执行替代算术运算，用于将至少一部分运算处理替换为多个ECU模块10,20和30中的至少一个执行的运算处理， 其他ECU模块和母板2.版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2012175032A

公开(公告)日：2012-09-10

申请号：JP2011038096

申请日：2011-02-24

Applicant: Denso Corp ,  株式会社デンソー

Inventor： ITO MASARU ,  UEDA NOBUTADA ,  MATSUMURA YASUSHI

IPC: H05K5/02 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To provide an electronic control device, enabling easy exchange of boards housed in a cabinet without damaging heat dissipation.SOLUTION: A cabinet 21 for housing a mother board 30 and each module board 41-44, which is electrically connected to the mother board 30, is configured by assembling a first case 22 with a second case 23. The module boards 41, 42 are disposed adjacent to a first inner surface 22a of the first case 22, while the mother board 30 is disposed adjacent to a second inner surface 23a of the second case 23. On a heat dissipation element 41a etc. mounted on the module boards 41, 42 disposed adjacent to the first inner surface 22a, a heat conductive adhesive 24, a heat conductive member, is disposed between it and the first inner surface 22a. The module boards 41, 42 are stopped at the first case 22 by a stop member 50, and the mother board 30 is stopped at the second case 23 by another stop member 50.

Abstract translation: 要解决的问题：提供一种电子控制装置，能够容易地更换容纳在机柜中的板而不损坏散热。

解决方案：用于容纳母板30的壳体21和电连接到母板30的每个模块板41-44通过将第一壳体22与第二壳体23组装而构成。模块板41 42相邻于第一壳体22的第一内表面22a设置，而母板30邻近第二壳体23的第二内表面23a设置。在安装在模块板上的散热元件41a等 设置在第一内表面22a附近的导热粘合剂24，导热构件设置在其与第一内表面22a之间。 模块板41,42通过止动构件50在第一壳体22处停止，并且母板30通过另一个止动构件50在第二壳体23处停止。（C）2012年，JPO和INPIT

公开(公告)号：JP2011194958A

公开(公告)日：2011-10-06

申请号：JP2010061977

申请日：2010-03-18

Applicant: Denso Corp ,  株式会社デンソー

Inventor： MATSUMURA YASUSHI ,  KAMEI EIICHI ,  UEDA NOBUTADA ,  ITO MASARU

IPC: B60R16/02

CPC classification number: H05K7/20881 ,  H05K5/0065

Abstract: PROBLEM TO BE SOLVED: To provide an electronic control device smoothly controlling each in-vehicle equipment and achieving a space-saving.SOLUTION: A control circuit board 22 has a plurality of connectors 23a-23h to which control module circuit boards 31-35 each controlling any one of a plurality of in-vehicle equipment can be connected. A power supply circuit board 24 has a power supply circuit 24a that controls a power supply from a battery 15 to equipment to be controlled by the control module circuit boards 31-35 connected with the connectors 23a-23h. The control circuit board 22 and the power supply circuit board 24 are electrically connected and contained in a case 11. When the control module circuit boards 31-35 are each connected with any one of the connectors 23a-23h of the control circuit board 22, the power supply circuit 24a is controlled by the control module and it becomes possible to control the equipment to be controlled such as an engine 11.

Abstract translation: 要解决的问题：提供一种平滑地控制车载设备并实现节省空间的电子控制装置。解决方案：控制电路板22具有多个连接器23a-23h，控制模块电路板31-35各自 可以连接多个车载设备中的任何一个。 电源电路板24具有电源电路24a，其控制从电池15向与连接器23a-23h连接的控制模块电路板31-35控制的设备的电力供应。 控制电路板22和电源电路板24电连接并容纳在壳体11中。当控制模块电路板31-35分别与控制电路板22的连接器23a-23h中的任一个连接时， 电源电路24a由控制模块控制，并且可以控制诸如发动机11等被控制的设备。

公开(公告)号：JP2009181801A

公开(公告)日：2009-08-13

申请号：JP2008019578

申请日：2008-01-30

Applicant: Denso Corp ,  Nippon Soken Inc ,  株式会社デンソー ,  株式会社日本自動車部品総合研究所

Inventor： HORI MASAFUMI ,  IIDA TAKU ,  MATSUMURA YASUSHI ,  HIRONAKA YOSHIO ,  KAMIYA TAKASHI ,  HIRAMATSU SATOSHI ,  MIYAKE TOSHIHIRO ,  KAMIYA HIROTERU

IPC: H05K1/14 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To provide a board connection structure which can perform electrical connection between a plurality of boards with a simple structure and is capable of coping with a large current flow. SOLUTION: A plurality of contact conductors 16, 17 which contacts contact terminals 5, 6 of a first electronic board 2 are installed in a housing of a card edge connector 40, and a plurality of contact conductors 18, 19 which contact the contact terminals 10. 11 of a second electronic board 7 are installed in the housing, and furthermore, connecting conductors 20, 21 which connect one of a plurality of contact conductors to contact the contact terminals 5, 6 of the first electronic board 2 and one of the plurality of contact conductor to contact the contact terminals 10, 11 of the second electronic board 7 are installed. Thereby, by only inserting the first electronic board 2 and the second electronic board 7 in the respective insertion holes of the housing 15, the first electronic board 2 and the second electronic board 7 can be electrically connected. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够以简单结构在多个板之间进行电连接并能够应对大电流的板连接结构。 解决方案：与第一电子板2的接触端子5,6接触的多个接触导体16,17安装在卡缘连接器40的壳体中，以及多个接触导体18,19接触 第二电子基板7的接触端子10.11安装在壳体中，此外，连接导体20,21连接多个接触导体中的一个接触导体以接触第一电子板2的接触端子5,6和一个 与第二电子板7的接触端子10,11接触的多个接触导体。 因此，通过仅将第一电子基板2和第二电子基板7插入到壳体15的各个插入孔中，第一电子基板2和第二电子基板7也可以电连接。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008311013A

公开(公告)日：2008-12-25

申请号：JP2007156056

申请日：2007-06-13

Applicant: Denso Corp ,  株式会社デンソー

Inventor： MATSUMURA YASUSHI

IPC: H05K1/11 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a card edge connector in which contacting between adjoining connector terminals does not occur and conductive failure between the connector terminal and an electrode does not occur, even if there exists bending of the connector terminal and dislocation in arrangement of the connector terminal. SOLUTION: A plurality of grooves 2 in which a connector terminal 4 is inserted are formed at constant intervals on the surface of an insert part 1a of a circuit board 1. Each of the grooves 2 comprises a vertical side wall 2a and a side wall 2b tilted downward from the upper end that faces the upper end of the side wall 2a toward the lower end of the side wall 2a, with an electrode 3 arranged on the slope of the side wall 2b. The connector terminal 4 deviated toward the ridge side of the side wall 2b slides off the slope of the side wall 2b by its own spring force as inserted into the groove 2, and eventually corrected in position to contact both side walls 2a ad 2b. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了提供卡边缘连接器的连接结构，其中不会发生相邻的连接器端子之间的接触，并且不会发生连接器端子和电极之间的导电故障，即使存在连接器的弯曲 端子和位错配置在连接器端子上。 解决方案：在电路板1的插入部分1a的表面上以恒定间隔形成有插入有连接器端子4的多个凹槽2.每个凹槽2包括垂直侧壁2a和 侧壁2b从侧壁2a的上端朝向侧壁2a的下端向上倾斜，电极3设置在侧壁2b的斜面上。 朝向侧壁2b的脊侧偏离的连接器端子4通过其插入槽2中的自身弹簧力而从侧壁2b的斜面滑落，并且最终被校正就位以接触两个侧壁2a和2b。 版权所有（C）2009，JPO＆INPIT