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公开(公告)号：JP2011211217A
公开(公告)日：2011-10-20
申请号：JP2011116526
申请日：2011-05-25
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-ceramic junction circuit board, easily controlling a cross-sectional shape with a smaller number of steps or at a low cost, and manufacturing the circuit board that has high reliability in thermal impact resistance and insulation characteristic.SOLUTION: After a Cu plate 14 is joined to both surfaces of a ceramic substrate 10 through a solder 12, a UV-curing alkaline peeling type resist 16 is applied on a predetermined portion of the surface of Cu plate 14 for etching an unrequired portion of the Cu plate 14 to form a metal circuit part. While the resist 16 is maintained, an unnecessary solder 12 and a reactive product between the solder 12 and the ceramic substrate 10 are removed (otherwise, an unnecessary solder 12 and a reactive product between the solder 12 and the ceramic substrate 10 are removed for etching on the side surface part of the metal circuit part). Then, the resist 16 is released and Ni-P electroless plating 18 is performed.
摘要翻译： 要解决的问题：为了提供一种金属陶瓷结电路板的制造方法，能够以较少的步骤或低成本容易地控制截面形状，并且制造在热冲击中具有高可靠性的电路板 电阻和绝缘特性。解决方案：在通过焊料12将Cu板14接合到陶瓷衬底10的两个表面之后，将UV固化碱性剥离型抗蚀剂16施加在Cu板14的表面的预定部分上 蚀刻Cu板14的不需要部分以形成金属电路部分。 当保持抗蚀剂16时，去除不需要的焊料12和焊料12与陶瓷基板10之间的反应产物（否则，去除不需要的焊料12，并且去除焊料12和陶瓷基板10之间的反应产物以进行蚀刻 在金属电路部分的侧表面部分上）。 然后，剥离抗蚀剂16，进行Ni-P无电镀18。
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公开(公告)号：JP2008283210A
公开(公告)日：2008-11-20
申请号：JP2008182447
申请日：2008-07-14
发明人： OSANAI HIDEYO , FURO MASAHIRO
摘要： PROBLEM TO BE SOLVED: To solve the problem that a crack is formed in a bonding surface due to difference in a thermal expansion in each of materials, because a ceramics base member is fitted to a metallic base board through a metallic layer and a solder in a conventional ceramic electronic circuit board. SOLUTION: A melt is obtained by melting aluminum or aluminum alloy in a vacuum or an inert gas. Thereafter, the melt is brought into contact with the ceramics base member inside a mold under the vacuum or the inert-gas atmosphere. At that time, the melt is rigidly bonded to the ceramics base member by retaining to cool in a direct contact without interposing the oxidized layer of a metal surface, to each interface, and the melt is bonded to the ceramics base member by means of a brazing material. Otherwise, the melt is bonded to the ceramics base member in the order opposite to the above-described procedure. The metallic base board is specified to have a resistive strength of 320 MPa or less and a thickness of 1 mm or more. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译： 解决问题：为了解决由于每种材料中的热膨胀差异而在接合面上形成裂纹的问题，因为陶瓷基底部件通过金属层装配到金属基板上，并且 常规陶瓷电子电路板中的焊料。 解决方案：通过在真空或惰性气体中熔化铝或铝合金来获得熔体。 此后，在真空或惰性气体气氛下使熔体与模具内的陶瓷基体接触。 此时，熔融物通过保持直接接触而冷却而不将金属表面的氧化层插入到各界面中而与陶瓷基体部件刚性接合，熔融体通过以下方式结合到陶瓷基体部件 钎焊材料。 否则，熔体以与上述步骤相反的顺序结合到陶瓷基底部件上。 金属基板的电阻强度规定为320MPa以下，厚度为1mm以上。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2014053619A
公开(公告)日：2014-03-20
申请号：JP2013202975
申请日：2013-09-30
IPC分类号： H05K3/06 , B23K1/00 , B23K1/018 , B23K1/19 , B23K101/42 , C04B37/02 , C23F1/18 , C23F1/20 , C23F1/30 , H01L23/12 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-ceramic bonded circuit board, by which a cross-sectional shape of a metal-ceramic bonded circuit board can be easily controlled in a small number of man-hour or at a low cost, and a metal-ceramic bonded circuit board having higher reliability in thermal shock resistance or insulating property can be manufactured.SOLUTION: After a Cu plate 14 is bonded with a brazing material 12 to both surfaces of a ceramic substrate 10, a UV-curable alkali stripping type resist 16 is applied to a predetermined part on a surface of the Cu plate 14, and an unnecessary part of the Cu plate 14 is etched to form a metal circuit part. While maintaining the resist 16, an unnecessary brazing material 12 and a reaction product between the brazing material 12 and the ceramic substrate 10 are removed (otherwise, the unnecessary brazing material 12 and the reaction product between the brazing material 12 and the ceramic substrate 10 are removed and a side face of the metal circuit part is etched), and then, the resist 16 is stripped and Ni-P electroless plating 18 is applied.
摘要翻译： 要解决的问题：为了提供金属 - 陶瓷粘结电路板的制造方法，通过该方法可以以少量的工时或低的速度容易地控制金属 - 陶瓷粘合电路板的截面形状 可以制造具有更高的耐热冲击性或绝缘性的可靠性的金属 - 陶瓷粘合电路板。解决方案：在将铜板14与钎焊材料12接合到陶瓷基板10的两个表面上之后， 将可固化碱剥离型抗蚀剂16施加到Cu板14的表面上的预定部分，并且蚀刻不需要的Cu板14的部分以形成金属电路部分。 在保持抗蚀剂16的同时，除去钎焊材料12和陶瓷基板10之间的不必要的钎焊材料12和反应产物（否则，不需要的钎焊材料12和钎料12与陶瓷基板10之间的反应产物为 去除金属电路部分的侧面），然后剥离抗蚀剂16，并施加Ni-P无电镀层18。
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公开(公告)号：JP2007036263A
公开(公告)日：2007-02-08
申请号：JP2006214935
申请日：2006-08-07
发明人： FURO MASAHIRO , OSANAI HIDEYO
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a metal ceramic circuit board of excellent heat cycle resistance which is suitable for mounting a large power electronic component such as a power module, and to provide the power module using the board. SOLUTION: An insulating substrate board for a semiconductor comprises a metal alloy layer containing silicon mainly made of aluminum, copper, zinc or nickel formed on at least one surface portion of a ceramic substrate board, and the Vickers hardness of the metal alloy layer is not less than 25 and less than 40. The ceramic substrate board is made of a material selected from a group consisting of alumina, aluminum nitride, and silicon nitride. A semiconductor chip is provided on the other surface of the ceramic substrate board to form the power module. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译： 要解决的问题：提供一种适用于安装诸如功率模块的大功率电子元件的优异的耐热循环电阻的金属陶瓷电路板，并且使用该板来提供功率模块。 解决方案：用于半导体的绝缘衬底板包括在陶瓷衬底板的至少一个表面部分上形成有主要由铝，铜，锌或镍制成的硅的金属合金层，并且金属合金的维氏硬度 层不小于25且小于40.陶瓷基板由选自氧化铝，氮化铝和氮化硅的材料制成。 在陶瓷基板的另一个表面上设置半导体芯片以形成功率模块。 版权所有（C）2007，JPO＆INPIT
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5.发明专利Metal-ceramic composite heat-dissipating plate integrated with ceramic insulating substrate and method of manufacturing the same 有权与陶瓷绝缘基体一体化的金属 - 陶瓷复合热绝缘板及其制造方法
公开(公告)号：JP2010258458A
公开(公告)日：2010-11-11
申请号：JP2010100904
申请日：2010-04-26
发明人： FURO MASAHIRO , YAMANAKA YOSHINORI , OSANAI HIDEYO
CPC分类号： H01L2224/32225
摘要： PROBLEM TO BE SOLVED: To provide a heat-dissipating plate of a metal-ceramic composite directly joined to a ceramic insulating substrate through a cost-effective process, and to provide a method of manufacturing the heat-dissipating plate, in order to solve a problem that, although metal-ceramic composite, which is produced by impregnating a porous preform made of ceramics with metal, has been used as a conventional heat-dissipating plate for a power module, an application of pressure in the impregnation process entails a massive production facility. SOLUTION: The method of manufacturing a heat-dissipating plate includes steps of: mixing silicon carbide powder and silver powder; applying a pressure on the resultant mixture, and forming a preform 10; placing an aluminum 11 in contact with the preform; and heating the preform and the aluminum together to impregnate the preform with aluminum. Furthermore, the method includes a step of joining the impregnated aluminum to the ceramic insulating substrate. The metal is magnesium, zinc, gallium, lead, or tin. The content ratio of metal relative to the preform measures from 2 wt.% or more to 10 wt.% or less. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译： 要解决的问题：为了通过成本有效的方法提供直接接合到陶瓷绝缘基板的金属 - 陶瓷复合材料的散热板，并且按顺序提供制造散热板的方法 为了解决这样一个问题，尽管通过浸渍由金属制陶瓷制成的多孔预制件制成的金属陶瓷复合材料已被用作传统功率模块的散热板，但在浸渍过程中施加压力需要 一个巨大的生产设施。 解决方案：制造散热板的方法包括以下步骤：将碳化硅粉末和银粉混合; 对所得混合物施加压力，并形成预制件10; 将铝11放置成与预成型件接触; 并将预成型件和铝加热在一起以用铝浸渍预制件。 此外，该方法包括将浸渍的铝连接到陶瓷绝缘基板的步骤。 金属是镁，锌，镓，铅或锡。 金属相对于预制件的含量比为2重量％以上至10重量％以下。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2008150288A
公开(公告)日：2008-07-03
申请号：JP2008032554
申请日：2008-02-14
发明人： NAKAMURA JUNJI , WADA MASAHIKO , FURO MASAHIRO , OGAWA YUJI , SHIMADA SUSUMU , YAMAMOTO KAZUHIDE , OTA MITSURU , KAMIHIRA NOBORU , NAMIOKA KAZUHIKO
IPC分类号： C04B37/02 , B23K1/00 , B23K1/19 , B23K101/42 , B23K103/18 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-ceramic joined body, in which the width of fillet can be altered freely, and by which the metal-ceramic joined body having high reliability to repeated heat cycle can be produced.
SOLUTION: In the method for manufacturing the metal-ceramic joined body composed of a ceramic base plate 10 and a metal plate 16 which are joined through an active metal-containing braze material 12, after coating a prescribed area on the ceramic base plate 10 with the braze material 12 and coating an area surrounding the braze material 12 on the ceramic base plate 10 with an inert paste material 14 not reacting with the ceramic base plate 10, the metal plate 16 is arranged on the braze material 12 and the paste material 14, and the ceramic base plate 10 is joined with the metal plate 16. Thereafter, a metal circuit is formed on the ceramic base plate 10 by coating an area corresponding to the braze material 12 on the metal plate with a resist 18, and eliminating an unnecessary part of the metal plate 16.
COPYRIGHT: (C)2008,JPO&INPIT摘要翻译： 要解决的问题：提供一种金属陶瓷接合体的制造方法，其中可以自由地改变圆角的宽度，并且通过该方法，具有对重复的热循环具有高可靠性的金属陶瓷接合体可以是 产生的。 解决方案：在通过含有活性金属的钎焊材料12接合的陶瓷基板10和金属板16构成的金属陶瓷接合体的制造方法中，在陶瓷基体上涂布规定的面积 板10用钎焊材料12涂覆陶瓷基板10上的钎焊材料12周围的区域，其中惰性浆料14与陶瓷基板10不反应，金属板16布置在钎焊材料12上， 糊状材料14，陶瓷基板10与金属板16接合。之后，通过用抗蚀剂18在金属板上涂布与钎焊材料12对应的区域，在陶瓷基板10上形成金属电路， 并且消除金属板16的不必要部分。版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2006341315A
公开(公告)日：2006-12-21
申请号：JP2006196091
申请日：2006-07-18
申请人： DOWA HOLDINGS CO LTD
发明人： FURO MASAHIRO , KOSAKA MICHIHIRO
摘要： PROBLEM TO BE SOLVED: To enhance metal-ceramic bonding strength and improve product quality. SOLUTION: The invented apparatus for manufacturing a metal-ceramic composite member joins a metal to the surface of a ceramic member by retaining the ceramic member in a mold, pouring molten metal into the mold and cooling it for solidification. The apparatus comprises an atmosphere changing section 1, a preheating section 2, a molten metal pouring section 3, a cooling/joining section 4 and a slow cooling section 5. The atmosphere changing section 1 changes an atmosphere in the mold with the ceramic member being retained therein to lower the oxygen content to a prescribed value or less. The preheating section 2 preheats the mold. The molten metal pouring section 3 keeps the mold at a molten metal pouring temperature and pours the molten metal into the mold. The cooling/joining section 4 lowers the mold temperature to a temperature at which the molten metal commences to solidify, and joins the metal to the surface of the ceramic member. The slow cooling section 5 cools the mold slowly. COPYRIGHT: (C)2007,JPO&INPIT
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