Abstract:
PROBLEM TO BE SOLVED: To provide a defect inspection device for detecting a defect part of a pattern formed on a wafer at high speed and at high precision, and by means of acquiring a stable mirror electron image and by solving problems that images obtained by a mirror electron microscope would tend to reflect shapes of equi-potential surface to reflect the mirror electron, and that image interpretation would become complicated, while a general electron microscope image reflects shapes and materials of a sample. SOLUTION: According to a structure of a pattern to be measured or an object of an interesting defect, following means of controlling the reflecting face of the mirror electron are installed. (1) According to kinds of an electron source, operating conditions, and kinds of patterns on the sample 7 to be measured, a means to control an electric potential difference between the electron source 1 corresponding to a height of the reflecting face of the mirror electron beam and the sample 7 is installed. (2) A means to control an energy distribution of the irradiation electron beam is installed by arranging an energy filter 9 at an irradiation system. Testing by distinguishing sizes and electric potentials of the patterns becomes possible, and an insulation material sample can be observed at a high resolution. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an efficient secondary optical system adjustment method not relying upon the skill of an engineer, in a multi-beam charged particle beam application apparatus.SOLUTION: During adjustment of a secondary optical system, images of the individual secondary electron beams 120a-120c of a multi-beam secondary electron beam 120 separated by a beam separator 111 are focused on the detection surfaces of corresponding individual beam detectors 121a-121c of a secondary electron beam detector 121, via the aperture 127 of a secondary optical system aperture plate 124 provided between a lens on the final stage of a secondary optical system lens 123 and the secondary electron beam detector 121, and the secondary optical system is adjusted based on the two-dimensional image thereof.
Abstract:
PROBLEM TO BE SOLVED: To provide a device and a method to inspect height variations of a sample.SOLUTION: An inspection device comprises: a holder 211 holding a sample 29; a charge control unit 23 which electrically charges the sample 29 held by the holder 211; a retarding power supply 24 which applies a voltage to the sample 29 held by the holder 211; an electron optical system 20 which irradiates an electron beam toward the sample 29 supplied with the voltage from the retarding power supply 24, thereby causing mirror electrons retracted from the vicinity of a surface of the sample 29 to form an image; and an image processing unit 27 which processes a mirror image formed by the mirror electrons. The image processing unit 27 outputs, as height variations of the sample 29, information based on a difference between the mirror image formed by the mirror electrons and a standard mirror image prepared in advance.
Abstract:
PROBLEM TO BE SOLVED: To efficiently monitor a frequency of defect generation and characteristic likelihood of an ROI region with high sensitivity. SOLUTION: A plurality of electron beams arranged in matrix are applied on a circuit pattern while thinning in a stage movement direction in synchronization with continuous movement of a stage. Generated secondary electrons or the like are obtained, and images acquired in a same region are averaged to acquire an image of a high S/N rapidly to determine defect of the circuit pattern from the acquired image. By acquiring the image not in an adjacent region but by thinning in moving in a direction vertical to stage movement, the frequency of defect generation and characteristic likelihood of only the ROI region or the entire circuit pattern can be efficiently monitored. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a multi-beam type charged particle beam application device having a function wherein a primary beam is incident to a sample from a slanting direction without relatively inclining an electrooptic system and the sample. SOLUTION: In the multi-beam type charged particle beam application device, lenses 140a, 140b are controlled by an optical control circuit 139 so as to focus on the sample while lens voltage of an array lens 109 is turned off. The primary beam 107 is irradiated to one point on the sample by a plurality of directions, namely, a plurality of angles against a sample wafer 115, and a reached point of the primary beam 107 on the sample is maintained at a fixed level without inclining the electrooptic system and the sample. Furthermore, an irradiating angle of the primary beam 107 for irradiation to the sample wafer 115 can be selected by individually controlling a blanca array 116 arranged by corresponding to an aperture array 108 and the array lens 109. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a defect inspecting technology capable of observing or inspecting a sample by distinguishing a contrast resulting from a shape from another contrast resulting from a potential condition. SOLUTION: In this reflection image forming electron microscope, a defect inspecting device has a preliminary charge control device 40 to control electrostatic charge of a sample surface by charging the sample surface by irradiation of a planar electron beam, and a means to separate the contrast resulting from the shape defect of the sample from another contrast resulting from a potential defect from a mirror electron image obtained, by structuring it so as to control the potential of the sample depending on the kinds of objective defect of the sample. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To solve such problems that the contrast becomes obscure at an observation part in an electron beam device, due to miniaturization or three-dimensional device structure, and that it takes time to search the irradiation conditions of primary electrons for optimizing the contrast, or to search the filtering conditions of detection electrons, or the measurement reproducibility is deteriorated.SOLUTION: The information of sample shape and the information of potential are acquired simultaneously, by using means for separating the energy of electrons generated from a sample, and signal processing means performing the addition and subtraction processing of the plurality of detection means, and then the filtering conditions of secondary electrons are determined for each irradiation conditions of primary electrons. Consequently, the search times of the irradiation conditions and the filtering conditions are shortened, and an optimum contrast can be obtained. Furthermore, the charging is monitored in real time during observation, and a highly accurate length measurement value is obtained while enhancing the reliability.
Abstract:
PROBLEM TO BE SOLVED: To provide a charged particle beam apparatus capable of measuring a sample at any inclination angle with high resolution.SOLUTION: A charged particle beam apparatus irradiating a sample 114 with a primary charged particle beam 110 to detect a secondary changed particle 115 generated, includes a beam tilt lens 113 having: a yoke magnetic path member 132 and a lens coil 134 for focusing the primary charged particle beam 110 on the sample 114; and a solenoid coil 133 having an upper end arranged on a side face of the yoke magnetic path member 132, and a lower end arranged between a pole piece tip end of the yoke magnetic path member 132 and the sample 114, the solenoid coil being used for inclining the primary charged particle beam 110 at any angle on the sample 114.
Abstract:
PROBLEM TO BE SOLVED: To provide an electron beam application device and a lens array which compensate image field curvature aberration under various optical conditions.SOLUTION: An electron beam application device includes a lens array 110 which has a plurality of electrodes each having a plurality of apertures formed. An imaging position (for example, 111b) of a reference beam and curvature of a lens array image field 112 are adjusted independently by individually setting aperture diameter distribution of pluralities of apertures formed in the respective electrodes and independently controlling voltages applied to the respective electrodes.